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1.
公开(公告)号:WO2021167711A1
公开(公告)日:2021-08-26
申请号:PCT/US2021/012773
申请日:2021-01-08
Applicant: RAYTHEON COMPANY
Inventor: MCCORDIC, Craig H. , ELLSWORTH, Joseph R. , SOUTHARD, Todd E. , HEINRICH, Ethan S. , ZARKH, Dimitry
IPC: H05K7/20 , H01L23/373
Abstract: An apparatus includes a coldplate (104, 200, 300) configured to be thermally coupled to a structure (100) to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers (202 and 206, 302 and 306) having at least one first material and (ii) a third layer (204, 304) embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones (114a-114c, 212a-212c, 312a-312c) of the coldplate have different local CTEs. The third layer may include openings (210, 310) extending through the second material(s), and projections (208, 308) of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.
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公开(公告)号:WO2020018320A1
公开(公告)日:2020-01-23
申请号:PCT/US2019/041044
申请日:2019-07-09
Applicant: RAYTHEON COMPANY
Inventor: MCCORDIC, Craig H. , ELLSWORTH, Joseph R. , SOUTHARD, Todd , MORIONDO, Douglas
Abstract: A coolant interface includes a line replaceable unit (LRU) (103) inserted into a slot within a modular assembly such as a chassis (101) for an electronics assembly. Quick disconnect fluid coupling fittings (131) on the LRU mate with counterpart fittings (111) on a fluid distribution manifold (110) within the chassis when the LRU is inserted into the slot. A seal (133) surrounding the quick disconnect fluid coupling fittings on a flat surface (132) abutting a counterpart surface on the fluid distribution manifold when the LRU is inserted into the slot compresses the seal against the counterpart surface. Alignment pin(s) (134) projecting from the flat surface and received by corresponding guide holes within the counterpart surface, and captive hardware (135) provides pressure between the flat surface and the counterpart surface to increase and maintain compression of the seal. The alignment pins and captive hardware are arranged to increase mechanical stability of the connection.
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公开(公告)号:WO2022271271A1
公开(公告)日:2022-12-29
申请号:PCT/US2022/027224
申请日:2022-05-02
Applicant: RAYTHEON COMPANY
Inventor: HARKINS, Brian J. , MCCORDIC, Craig H. , MIKUTEL, John A. , BEAULIEU, Mark J.
IPC: G01S7/00 , G01S7/02 , H01Q3/26 , H01Q3/30 , H01Q21/00 , G01S13/87 , G01S2013/0245 , G01S7/003 , G01S7/027 , G01S7/40 , H01Q1/02 , H01Q1/1242 , H01Q21/0025 , H01Q21/205 , H01Q3/267
Abstract: A modular radar system comprises an antenna assembly, a support structure to which the antenna assembly is mounted, and a set of modular radar subsystems. The antenna assembly comprises an antenna array, an antenna enclosure to which the antenna array is attached and which is configured to house the antenna array and to distribute communications signals and power signals to the antenna array, and an antenna enclosure interface configured to receive inputs to and provide outputs from, the antenna array. The support structure positions the antenna array at an orientation and elevation for antenna operation. The set of modular radar subsystems is separate from the support structure and in operable communication with the antenna enclosure interface and comprises a data processing subsystem, a cooling subsystem, and an AC power subsystem supplying power to the antenna enclosure, the data processing subsystem, the cooling subsystem and to a DC power conversion subsystem.
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公开(公告)号:WO2021086893A2
公开(公告)日:2021-05-06
申请号:PCT/US2020/057628
申请日:2020-10-28
Applicant: RAYTHEON COMPANY
Inventor: MAYBERRY, Travis , MCCORDIC, Craig H. , ELLSWORTH, Joseph R.
IPC: H01L21/48 , B23K20/10 , B33Y10/00 , B33Y80/00 , H01L23/373 , H01L23/473 , H01L23/427 , B22F5/006 , B23K20/103 , B23K20/106 , B23K2101/14 , B23K2103/10 , B33Y70/00 , H01L21/4871 , H01L21/4882 , H01L23/367 , H01L23/3672 , H01L23/3675 , H01L23/3735 , H01L23/3736
Abstract: A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.
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公开(公告)号:WO2021055175A1
公开(公告)日:2021-03-25
申请号:PCT/US2020/049268
申请日:2020-09-03
Applicant: RAYTHEON COMPANY
Inventor: MCCORDIC, Craig H. , ELLSWORTH, Joseph R. , MORIONDO, Douglas J. , DELGENIO, Joseph Angelo , WHITE, Christopher Robert , RICKIS, Adam Carl , MANTEIGA, Caroline Margaret
Abstract: A modular phased array antenna that includes a plurality of modular antenna array blocks assembled together as a single antenna array and an array face having an array plate and a radiator and radome assembly for each modular block interlocked and aligned to create a single monolithic array face. Each modular antenna array block includes: a plurality of transmit/receive integrated multichannel module (TRIMM) cards, each TRIMM card including power and beamforming signals, where power and beamforming signals are connected in parallel to each modular antenna array block, a plurality of radiators for radiating antenna signals having a radiator face, a radome integrated with the plurality of radiators and interfacing directly to the radiator face, where the radome does not extend beyond the radiator face, and a frame for supporting the TRIMM cards.
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6.
公开(公告)号:EP4108052A1
公开(公告)日:2022-12-28
申请号:EP21705676.1
申请日:2021-01-08
Applicant: Raytheon Company
Inventor: MCCORDIC, Craig H. , ELLSWORTH, Joseph R. , SOUTHARD, Todd E. , HEINRICH, Ethan S. , ZARKH, Dimitry
IPC: H05K7/20 , H01L23/373
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公开(公告)号:EP3610215A1
公开(公告)日:2020-02-19
申请号:EP18720441.7
申请日:2018-03-29
Applicant: Raytheon Company
Inventor: MAYBERRY, Travis L. , PRUETT, James A. , MCCORDIC, Craig H. , ALTMAN, David H.
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公开(公告)号:EP4052288A2
公开(公告)日:2022-09-07
申请号:EP20812160.8
申请日:2020-10-28
Applicant: Raytheon Company
Inventor: MAYBERRY, Travis , MCCORDIC, Craig H. , ELLSWORTH, Joseph R.
IPC: H01L21/48 , B23K20/10 , B33Y10/00 , B33Y80/00 , H01L23/373 , H01L23/473 , H01L23/427
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公开(公告)号:EP4359812A1
公开(公告)日:2024-05-01
申请号:EP22724576.8
申请日:2022-05-02
Applicant: Raytheon Company
Inventor: HARKINS, Brian J. , MCCORDIC, Craig H. , MIKUTEL, John A. , BEAULIEU, Mark J.
CPC classification number: G01S7/003 , G01S7/02 , H01Q3/26 , H01Q21/0025 , H01Q21/205 , H01Q1/1242 , H01Q1/02
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公开(公告)号:EP4032145A1
公开(公告)日:2022-07-27
申请号:EP20772518.5
申请日:2020-09-03
Applicant: Raytheon Company
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