Abstract:
A process for manufacturing an array of bipolar transistors, wherein deep field insulation regions (26) of dielectric material are formed in a semiconductor body (21), thereby defining a plurality of active areas (22), insulated from each other and a plurality of bipolar transistors are formed in each active area. In particular, in each active area, a first conduction region (24) is formed at a distance from the surface of the semiconductor body (21); a control region (25) is formed on the first conduction region (24); and, in each control region, at least two second conduction regions (31) and at least one control contact region (36) are formed. The control contact region (36) is interposed between the second conduction regions (31) and at least two surface field insulation regions (29) are thermally grown in each active area (22) between the control contact region (36) and the second conduction regions (31).