Abstract:
A process for manufacturing an array of cells, including: implanting, in a body (10) of semiconductor material of a first conductivity type, a common conduction region (11) of the first conductivity type; forming, in the body, above the common conduction region, a plurality of active area regions (12) of a second conductivity type and a first doping level; forming, on top of the body, an insulating layer (21) having first and second openings (27a, 27b); implanting first portions of the active area regions through the first openings (27a) with a doping agent of the first conductivity type, thereby forming, in the active area regions, second conduction regions (14) of the first conductivity type; implanting second portions of the active area regions through the second openings (27b) with a doping agent of the second conductivity type, thereby forming control contact regions (15) of the second conductivity type and a second doping level, higher than the first doping level; forming, on top of the body, a plurality of storage components (3), each storage component having a terminal connected to a respective second conduction region (14).
Abstract:
A memory device is proposed. The memory device includes a plurality of memory cells (P,S), wherein each memory cell includes a storage element (P) and a selector (S) for selecting the corresponding storage element during a reading operation or a programming operation. The selector includes a unipolar element (M) and a bipolar element (D;B). The memory device further includes control means (110s) for prevalently enabling the unipolar element during the reading operation or the bipolar element during the programming operation.
Abstract:
A process for manufacturing an array of cells in a body (1) of semiconductor material wherein a common conduction region (11) of a first conductivity type and a plurality of shared control regions (12), of a second conductivity type, are formed in the body. The shared control regions (12) extend on the common conduction region (11) and are laterally delimited by insulating regions (32). Then, a grid-like layer (36) is formed on the body (1) to delimit a first plurality of empty regions (38) directly overlying the body and conductive regions of semiconductor material and the first conductivity type (44) are formed by filling the first plurality of empty regions (38), each conductive region forming, together with the common conduction region and an own shared control region (12), a bipolar junction transistor (20).
Abstract:
A process for manufacturing an array of bipolar transistors, wherein deep field insulation regions (26) of dielectric material are formed in a semiconductor body (21), thereby defining a plurality of active areas (22), insulated from each other and a plurality of bipolar transistors are formed in each active area. In particular, in each active area, a first conduction region (24) is formed at a distance from the surface of the semiconductor body (21); a control region (25) is formed on the first conduction region (24); and, in each control region, at least two second conduction regions (31) and at least one control contact region (36) are formed. The control contact region (36) is interposed between the second conduction regions (31) and at least two surface field insulation regions (29) are thermally grown in each active area (22) between the control contact region (36) and the second conduction regions (31).