公开(公告)号：EP0942635B1

公开(公告)日：2009-05-13

申请号：EP98830132.1

申请日：1998-03-10

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Crema, Paolo ,  Mantovani, Marco

IPC: H05K1/00 ,  H01L23/367 ,  H01L21/60

CPC classification number: H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/19041

公开(公告)号：EP0942635A1

公开(公告)日：1999-09-15

申请号：EP98830132.1

申请日：1998-03-10

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Crema, Paolo ,  Mantovani, Marco

IPC: H05K1/00 ,  H01L23/367 ,  H01L21/60

CPC classification number: H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/19041

Abstract: An electronic device is formed on a chip (11) of semiconductor material covered by a layer (12) of insulating material. Metal interconnection elements form, on the insulating layer (12), connection pads (13) to which a soldering material (14) is applied. To permit good heat dissipation, the device has a metal plate (30) partially incorporated in the insulating layer (12) and having a surface which is coplanar with the pads (13) and to which soldering material is applied (31).

Abstract translation: 电子器件形成在由绝缘材料层（12）覆盖的半导体材料的芯片（11）上。 金属互连元件在绝缘层（12）上形成施加有焊料（14）的连接焊盘（13）。 为了允许良好的散热，该装置具有部分地结合在绝缘层（12）中的金属板（30），并且具有与焊盘（13）共面并且被施加焊接材料的表面（31）。