公开(公告)号：EP0926733B1

公开(公告)日：2004-03-17

申请号：EP97830677.7

申请日：1997-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Rossi, Roberto ,  Villa, Claudio Maria

IPC: H01L23/40 ,  H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP0926733A1

公开(公告)日：1999-06-30

申请号：EP97830677.7

申请日：1997-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Rossi, Roberto ,  Villa, Claudio Maria

IPC: H01L23/40 ,  H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: An external heat sink (2) may be soldered to a metal slug (3) incorporated at the bottom of a molded body (4) of encapsulating resin of the package of an integrated power device for surface mounting on printed circuit board (7). The metal slug (3) has at least a portion protruding from an outer surface of at least one face of the body (4); an external metal heat sink (2), geometrically coupling with the packaged device over the printed circuit board (7), has at least a surface abutting with a surface of the resin body (4) thus defining a separation gap (10) between at least a surface of said protruding portion of the metal slug (3) and a surface (5, 9a, 9b) opposed to it of the external metal heat sink (2) that gets filled with molten solder alloy (8) during the normal soldering treatment to which the board is subjected.

Abstract translation: （4）封装的封装表面的集成功率器件的树脂安装在印刷电路板（7）（3）引入外部散热器（2）可以被焊接到金属块在模制体的底部。 金属块（3）具有至少从在所述主体（4）中的至少一个面的外表面突出的部分; 到外部金属散热片（2），几何上与所述封装装置耦合在印刷电路板（7），具有至少一个表面与在所述树脂体（4）因此限定（10）之间的分离间隙的表面抵接 至少一个突出反对的外部金属散热片（2）的金属块（3）和一表面（5，9A，9B）的部分的所述表面并得到正常的焊接过程中填充有熔融焊料合金（8） 其处理的板进行。

公开(公告)号：EP1367644A1

公开(公告)日：2003-12-03

申请号：EP02425348.6

申请日：2002-05-29

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Renard, Loic ,  Vitali, Battista

IPC: H01L23/495 ,  H01L21/607 ,  H01L23/485

CPC classification number: H01L24/85 ,  H01L23/4952 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05073 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20757 ,  H01L2924/2076 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device (1) is disclosed, which comprises a die (2) of a semiconductor material and a holder (3) connected electrically together by wire leads (4) of copper, the semiconductor material die being formed with a plurality of contact pads (6), the device being characterized in that it comprises a welding stud bump (7) of a metal material selected from a group comprising gold, palladium, and alloys thereof, formed on each contact pad of said plurality of contact pads, each copper wire lead (4) being welded with one end (4a) on a stud bump (7) and with the other end to said holder (3). This electronic device is highly reliable and can be fabricated simply at a low cost.

Abstract translation: 公开了一种半导体电子器件（1），其包括半导体材料的管芯（2）和由铜的引线（4）电连接的保持器（3），所述半导体材料管芯形成有多个接触 焊盘（6），其特征在于，其包括形成在所述多个接触焊盘的每个接触焊盘上的金，金属的选自包括金，钯及其合金的金属材料的焊接凸块（7） 铜线引线（4）与一端（4a）焊接在螺柱凸块（7）上，另一端与所述支架（3）焊接。 该电子设备是高度可靠的，并且可以以低成本简单地制造。

公开(公告)号：EP0905762A1

公开(公告)日：1999-03-31

申请号：EP97830480.6

申请日：1997-09-30

Applicant: STMicroelectronics S.r.l.

Inventor： Crema, Paolo ,  Tiziani, Roberto

IPC: H01L21/48 ,  B08B7/00

CPC classification number: B29C37/02 ,  B08B7/0042 ,  H01L21/4839

Abstract: A method is described for removing residues of plastic (14) from metal parts (11, 12) of plastic packages of semiconductor devices, i.e. heat-sinks and terminals. The surfaces to be treated are subjected to pulsed laser radiation. The wavelength is chosen in such a way that residues of plastic in thin films have good transparency to the radiation and that the metal has a high absorption capacity in respect of the radiation. Moreover, the intensity and duration of application of the radiation are such as to cause the formation of plasma at the point of impact of the radiation with the surface to be treated.

Abstract translation: 描述了一种方法用于从金属部件的半导体器件，即，包胶的塑料（14）残基（11,12） 的散热器和终端。 待处理的表面进行脉冲激光辐射。 波长被选择在寻求一种方法所做的在薄膜中塑料残基具有良好的透明性的辐射，也做了金属具有关于所述辐射的高吸收能力。 更以上，强度和辐射的应用持续时间进行检查以使在与所述表面的辐射的撞击点等离子体的形成来对待。

公开(公告)号：EP2273544A2

公开(公告)日：2011-01-12

申请号：EP10183317.6

申请日：2001-12-14

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Passagrilli, Carlo

IPC: H01L21/60 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05083 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device (1) is disclosed, which comprises a die (2) of semiconductor material and a support (3), the die (2) of semiconductor material including an integrated electronic circuit and a plurality of contact pads (6) associated with the electronic circuit and connected electrically to the support (3) by wire leads (4), each contact pad of said plurality of contact pads (6) comprising a lower layer (7) of copper, or alloys thereof; and an upper layer. Advantageously, the upper layer consists of:
a first film (9) of nickel or alloys thereof, overlying the lower layer (7) of copper or alloys thereof;
a second film of palladium or alloys thereof, overlying the first film (9) of nickel or alloys thereof; and optionally
a third film (10) of gold or alloys thereof, overlying the second film of palladium or alloys thereof.
Moreover, the layer or film (9, 10) are deposited by an electroless chemical process.

Abstract translation: 一种半导体电子设备（1）的光盘游离缺失，其包括半导体材料和载体（2）（3），半导体材料制成，包括上集成电子电路和接触垫多个管芯（2）（6）相关联的 与由引线的电子电路和电连接到所述支撑件（3）（4），包括：下位层的接触焊盘，所述多个（6）的每一个接触垫铜，或其合金的（7）; 并在上层。 有利的是，上层的组成：镍或合金的第一膜（9）它们的，覆盖在下层（7）铜或其合金的; 钯或合金的第二膜体，覆镍或它们的合金的第一膜（9）; 和任选的金或合金的第三电影（10）它们的，上覆钯或其合金的第二电影。 更完了，层或膜（9,10）是在通过无电解化学工艺沉积。

公开(公告)号：EP0942635B1

公开(公告)日：2009-05-13

申请号：EP98830132.1

申请日：1998-03-10

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Crema, Paolo ,  Mantovani, Marco

IPC: H05K1/00 ,  H01L23/367 ,  H01L21/60

CPC classification number: H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/19041

公开(公告)号：EP1630729B1

公开(公告)日：2007-12-26

申请号：EP04425646.9

申请日：2004-08-31

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Frezza, Giovanni

IPC: G06K19/077 ,  G06K19/04

CPC classification number: G06K19/077 ,  G06K19/041

公开(公告)号：EP1630729A1

公开(公告)日：2006-03-01

申请号：EP04425646.9

申请日：2004-08-31

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Frezza, Giovanni

IPC: G06K19/077 ,  G06K19/04

CPC classification number: G06K19/077 ,  G06K19/041

Abstract: The present invention relates to a method for manufacturing a fully moulded Multi Media Card package (5) obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method is defined by the following steps:

providing a rounded groove (4) on a substrate (2) back side (8) of the package, all around the package profile;
cutting the edges of said package (5) by a laser cutting line (9) passing through said groove (4).

This new technique permits to use all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

Abstract translation: 本发明涉及一种用于制造通过激光切割获得的完全成型的多媒体卡封装（5）的方法，其中至少一些边缘和封装周围的角部具有圆形轮廓并且具有足够的平滑度以进行安全处理。 该方法通过以下步骤限定：在包装的背面（8）的基板（2）上提供围绕包装轮廓的圆形凹槽（4） 通过穿过所述凹槽（4）的激光切割线（9）切割所述包装（5）的边缘。 这种新技术允许使用MMC封装的所有24.0mm宽度的基板2，从而增加可用于电子部件的表面。

公开(公告)号：EP0942635A1

公开(公告)日：1999-09-15

申请号：EP98830132.1

申请日：1998-03-10

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Crema, Paolo ,  Mantovani, Marco

IPC: H05K1/00 ,  H01L23/367 ,  H01L21/60

CPC classification number: H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/19041

Abstract: An electronic device is formed on a chip (11) of semiconductor material covered by a layer (12) of insulating material. Metal interconnection elements form, on the insulating layer (12), connection pads (13) to which a soldering material (14) is applied. To permit good heat dissipation, the device has a metal plate (30) partially incorporated in the insulating layer (12) and having a surface which is coplanar with the pads (13) and to which soldering material is applied (31).

Abstract translation: 电子器件形成在由绝缘材料层（12）覆盖的半导体材料的芯片（11）上。 金属互连元件在绝缘层（12）上形成施加有焊料（14）的连接焊盘（13）。 为了允许良好的散热，该装置具有部分地结合在绝缘层（12）中的金属板（30），并且具有与焊盘（13）共面并且被施加焊接材料的表面（31）。

公开(公告)号：EP2273543A2

公开(公告)日：2011-01-12

申请号：EP10183287.1

申请日：2001-12-14

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Passagrilli, Carlo

IPC: H01L21/60 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05083 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device (1) is disclosed, which comprises a die (2) of semiconductor material and a support (3), the die (2) of semiconductor material including an integrated electronic circuit and a plurality of contact pads (6) associated with the electronic circuit and connected electrically to the support (3) by wire leads (4), each contact pad of said plurality of contact pads (6) comprising a lower layer (7) of copper, or alloys thereof; and an upper layer. Advantageously, the upper layer consists of:
a first film (9) of nickel or alloys thereof, overlying the lower layer (7) of copper or alloys thereof; and
a second film (10) of gold or alloys thereof, overlying the first film (9) of nickel or alloys thereof.
Moreover, the layer (7) or film (9, 10) are deposited by an electroless chemical process.

Abstract translation: 一种半导体电子设备（1）的光盘游离缺失，其包括半导体材料和载体（2）（3），半导体材料制成，包括上集成电子电路和接触垫多个管芯（2）（6）相关联的 与由引线的电子电路和电连接到所述支撑件（3）（4），包括：下位层的接触焊盘，所述多个（6）的每一个接触垫铜，或其合金的（7）; 并在上层。 有利的是，上层的组成：镍或合金的第一膜（9）它们的，覆盖在下层（7）铜或其合金的; 和金或其合金的第二电影（10）它们的，上覆镍或它们的合金的第一部电影（9）。 更上方，层（7）或薄膜（9，10）是在通过无电解化学工艺沉积。