公开(公告)号：EP3364166A1

公开(公告)日：2018-08-22

申请号：EP18156816.3

申请日：2018-02-14

Applicant: STMicroelectronics S.r.l.

Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  PICCO, Andrea ,  POMARICO, Anna Angela ,  ROSELLI, Giuditta ,  BRAGHIN, Francesco

IPC: G01L9/00 ,  B81B7/00 ,  G01L9/06 ,  G01L19/14 ,  G01L1/18 ,  G01L1/26

CPC classification number: G01L1/18 ,  G01L1/26 ,  G01L9/0002 ,  G01L9/06 ,  G01L19/146 ,  H01C10/10 ,  H01C17/00

Abstract: A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.

公开(公告)号：EP3364166B1

公开(公告)日：2020-02-05

申请号：EP18156816.3

申请日：2018-02-14

Applicant: STMicroelectronics S.r.l.

Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  PICCO, Andrea ,  POMARICO, Anna Angela ,  ROSELLI, Giuditta ,  BRAGHIN, Francesco

IPC: G01L9/00 ,  B81B7/00 ,  G01L9/06 ,  G01L19/14 ,  G01L1/18 ,  G01L1/26

公开(公告)号：EP3477715A1

公开(公告)日：2019-05-01

申请号：EP18203888.5

申请日：2018-10-31

Applicant: STMicroelectronics S.r.l.

Inventor： PACI, Dario ,  FERRERA, Marco ,  PICCO, Andrea

IPC: H01L41/09 ,  H01L41/22 ,  H01L41/053 ,  H03H3/007

Abstract: A MEMS device (70) comprising a body (72), having a first surface (72A) and a second surface (72B); a diaphragm cavity (74) in the body (72) extending from the second surface (72B) of the body (72); a deformable portion (77) in the body (72) between the first surface (72A) and the diaphragm cavity; and a piezoelectric actuator (90), extending on the first surface (72A) of the body (72), over the deformable portion (77). The MEMS device (70) further comprises a recess structure (78) extending in the body (72) and delimiting, in the body (72), a flexible stopper portion (72C) for the deformable portion (77), the flexible stopper portion (72C) being arranged between the deformable portion (77) and the recess structure (78).