3.
    发明专利
    未知

    公开(公告)号:DE69940631D1

    公开(公告)日:2009-05-07

    申请号:DE69940631

    申请日:1999-07-28

    Abstract: Provided is a polyamide resin composition comprising a melt blend of (A) a polyamide resin, (B) a phyllosilicate, and (C) an olefin compound having a carboxylic acid anhydride group in the molecule or a polymer of the olefin compound, in which the phyllosilicate (B) has a reactive functional group bonded thereto and is such that the exchangeable metal ions existing in the interlayers are ion-exchanged with organic onium ions. The composition has a reduced inorganic ash content and has both high stiffness and high ductility. Optionally, the composition contains an inorganic filler apart from the phyllosilicate, an impact modifier, and a flame retardant, still having high stiffness and high ductility.

    4.
    发明专利
    未知

    公开(公告)号:AT417078T

    公开(公告)日:2008-12-15

    申请号:AT04730002

    申请日:2004-04-28

    Abstract: This invention is a polyester resin composition comprising 100 parts by weight of a resin composition consisting of 60 to 95 wt% of (a) a polyester resin and 5 to 40 wt% of (b) an olefin-based resin, and 0.5 to 30 parts by weight of (c) one or more resins selected from polyphenylene sulfide resins and liquid crystal resins, wherein said olefin-based resin (b) is composed of (b-1) a functional group-containing olefin copolymer having at least one kind of functional groups selected from carboxylic acid groups, carboxylic anhydride groups, carboxylic ester groups, metal carboxylate groups and epoxy groups and (b-2) an ethylene/±-olefin copolymer obtained by copolymerizing ethylene and an ±-olefin with 3 to 20 carbon atoms; and the polyester resin (a) forms a continuous phase, while the olefin-based resin (b) is dispersed as particles with an average particle size of 0.01 to 2 µm in the composition. This invention provides a polyester resin composition having excellent flexibility and impact resistance in a low-temperature atmosphere, also having excellent flowability and chemicals resistance, and suitable for injection molding.

    5.
    发明专利
    未知

    公开(公告)号:DE602004018304D1

    公开(公告)日:2009-01-22

    申请号:DE602004018304

    申请日:2004-04-28

    Abstract: This invention is a polyester resin composition comprising 100 parts by weight of a resin composition consisting of 60 to 95 wt% of (a) a polyester resin and 5 to 40 wt% of (b) an olefin-based resin, and 0.5 to 30 parts by weight of (c) one or more resins selected from polyphenylene sulfide resins and liquid crystal resins, wherein said olefin-based resin (b) is composed of (b-1) a functional group-containing olefin copolymer having at least one kind of functional groups selected from carboxylic acid groups, carboxylic anhydride groups, carboxylic ester groups, metal carboxylate groups and epoxy groups and (b-2) an ethylene/±-olefin copolymer obtained by copolymerizing ethylene and an ±-olefin with 3 to 20 carbon atoms; and the polyester resin (a) forms a continuous phase, while the olefin-based resin (b) is dispersed as particles with an average particle size of 0.01 to 2 µm in the composition. This invention provides a polyester resin composition having excellent flexibility and impact resistance in a low-temperature atmosphere, also having excellent flowability and chemicals resistance, and suitable for injection molding.

    7.
    发明专利
    未知

    公开(公告)号:DE69723541D1

    公开(公告)日:2003-08-21

    申请号:DE69723541

    申请日:1997-08-01

    Abstract: Cards which contain any one of the following thermoplastic resin compositions I to III in its material can be used as magnetic cards, IC cards, etc. since they are excellent in heat resistance, processability and embossability: I. A composition consisting of the following ingredients (A) and (B) II. A composition consisting of the following ingredients (A), (B) and (D) III. A composition consisting of 100 parts by weight of one or more selected from the following ingredients (A), (B) and (D) and 2 to 25 parts by weight of the following ingredient (C> (In the above I to III, the ingredient A is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 or more; the ingredient B is an aromatic polycarbonate; the ingredient C is an inorganic sheet-like filler of 0.5 to 20 mu m in average grain size; and the ingredient (D) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at smaller than 1.) o

    POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME
    8.
    发明公开
    POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME 有权
    聚酰胺树脂组合物及其制备方法

    公开(公告)号:EP1022314A4

    公开(公告)日:2002-12-18

    申请号:EP99933131

    申请日:1999-07-28

    CPC classification number: C08K9/04 C08L77/00 C08L77/06 C08L23/00

    Abstract: A polyamide resin composition which is obtained by melt-kneading (A) a polyamide resin, (B) a phyllosilicate, and (C) either an olefin compound having a carboxylic acid anhydride group in the molecule or a polymer of the olefin compound, wherein the phyllosilicate (B) is one in which exchangeable metal ions present between layers thereof have undergone ion exchange with an organic onium salt and which has reactive functional groups bonded thereto. The composition combines high rigidity with stretchability even when it has a low ash content. It may optionally contain an inorganic filler other than the phyllosilicate, an impact modifier, and a flame retardant. In this case also, the composition retains rigidity and stretchability.

    THERMOPLASTIC RESIN COMPOSITION AND SHEETS AND CARDS MADE FROM THE SAME
    10.
    发明公开
    THERMOPLASTIC RESIN COMPOSITION AND SHEETS AND CARDS MADE FROM THE SAME 失效
    热可塑性塑料组成,薄膜由其制得和卡

    公开(公告)号:EP0857749A4

    公开(公告)日:2000-08-30

    申请号:EP97933891

    申请日:1997-08-01

    Abstract: Cards made from any one of the following thermoplastic resin compositions (I to III), having an excellent balance among heat resistance, moldability, and embossability, and hence utilizable in magnetic cards, IC cards and the like. (I) A composition comprising a blend of the following components (A and B). (II) A composition comprising a blend of the following components (A, B and D). (III) A composition comprising a blend of at least one member selected from among the components (A, B and D) with the component (C), the content of the component (C) being 2 to 25 parts by weight based on 100 parts by weight in total of the components (A, B and D). In the compositions (I) to (III), the component (A) is a polyester comprising dicarboxylic acid units composed mainly of terephthalic acid units and glycol units composed mainly of ethylene glycol units (I) and 1,4-cyclohexanedimethanol units (II), and the molar ratio of the ethylene glycol units (I) to the 1,4-cyclohexanedimethanol units (II) is not less than 1; the component (B) is an aromatic polycarbonate; the component (C) is an organic flaky filler having an average particle diameter of 0.5 to 20 νm; and the component (D) is a polyester comprising dicarboxylic acid units composed mainly of terephthalic acid units and glycol units composed mainly of ethylene glycol units (I) and 1,4-cyclohexanedimethanol units (II), and the molar ratio of the ethylene glycol units (I) to the 1,4-cyclohexanedimethanol units (II) is less than 1.

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