Abstract:
A side by side red/IR laser structure (160,156) is flip chip bonded by solder balls (402,404) to a blue laser structure (252) to form a red/blue/IR hybrid integrated laser structure (400).
Abstract:
A side by side red/IR laser structure (160,156) is flip chip bonded by solder balls (402,404) to a blue laser structure (252) to form a red/blue/IR hybrid integrated laser structure (400).
Abstract:
PROBLEM TO BE SOLVED: To provide a monolithic multiple laser structure which has the capability of emitting a multiple wavelength laser beam of close intervals in a wide wavelength spectrum range from infrared to red and blue wavelengths. SOLUTION: A red/infrared parallel type laser structure 100 is bonded to a blue laser structure 200 with solder bumps 402, 404 by flip-chip bonding to form a red/blue/infrared integrated laser structure 400 integrated by a hybrid method. The method allows a laser array structure having laser elements of different wavelengths to be manufactured, even in a semiconductor materials which are not suitable for a manufacturing method based on etching and regrowth. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a structure of a monolithic edge light-emitting laser which emits light ranging in wavelength from 390 to 430 nm (blue range) and is capable of addressing independently. SOLUTION: In a laser structure 200 with exclusively of gallium nitride as the principal body, a laser heterostructure is formed on the terminal 216 of an n-GaN layer 210. Laser is emitted from a quantum well active layer. The n-GaN layer 210 is epitaxially grown laterally and is a region with few crystal defects. This allows a blue laser of high efficiency to be emitted.
Abstract:
PROBLEM TO BE SOLVED: To provide a monolithic multiple laser structure which includes the capability of emitting a multiple wavelength laser beam, having a wide range of infrared to red and blue for wavelength spectrum and close intervals. SOLUTION: A red/infrared parallel type laser structure 100 is bonded to a blue laser structure 200 with solder bumps 402 and 404 by a flip-chip method, to form a red/blue/infrared integrated laser structure 400 integrated by a hybrid method. This method allows a laser array structure having laser elements of different wavelengths to be manufactured, even in semiconductor materials which are not compatible with a manufacturing method by etching and regrowth.
Abstract:
PROBLEM TO BE SOLVED: To provide a structure of a monolithic vertical cavity surface-emitting laser which emits spectral light of wavelength in the range of 390 to 430 nm (blue range) and is independently addressable. SOLUTION: In a laser structure 200 being composed almost exclusively of gallium nitride, a laser heterostructure 230 is formed on a terminal 216 of an n-GaN layer 210. Laser is emitted from a quantum well active layer 222. The n-GaN layer 210 is grown epitaxially laterally on a DBR 206 and since this is a region with few crystal defects, a blue spectral vertical cavity surface H emitting laser can be emitted with high efficiency to be emitted.