3.
    发明专利
    未知

    公开(公告)号:DE60107518D1

    公开(公告)日:2005-01-05

    申请号:DE60107518

    申请日:2001-09-07

    Applicant: XEROX CORP

    Abstract: Optical cross-connect systems (100) involve the general concept of a two dimensional array (104) of microelectromechanical system (MEMS) tilt mirrors (106) being used to direct light coming from a first optical fiber (110) to a second optical fiber (111). Each MEMS tilt mirror (106) in the two dimensional array (104) can be tilted about two non-colinear axes and is suspended by a plurality of suspension arms (450) attached to a silicon on insulator substrate. Each of the plurality of suspension arms (450) comprises a layer with a built-in stress gradient deposited thereon which serves to automatically raise the MEMS tilt mirrors (106) during a release etch in the fabrication phase.

    6.
    发明专利
    未知

    公开(公告)号:DE60117216T2

    公开(公告)日:2006-07-27

    申请号:DE60117216

    申请日:2001-12-04

    Applicant: XEROX CORP

    Abstract: A micro-optical-electrical-mechanical laser scanner is configured from a silicon-on-insulator substrate having a silicon substrate layer, a buried oxide layer, and a single crystal silicon device layer. A first device layer portion having a micro-mirror (34) fabricated therefrom. A laser (36) is connected to a second device layer portion, and a hinge (24) connects the first device layer portion and the second device layer portion. The hinge is formed with a bimorph material, wherein the bimorph material creates built-in stresses in the hinge. The bimorph hinge moves the released micro-mirror out of the horizontal plane to a position for either directly or indirectly reflecting laser light emitted from the laser.

    8.
    发明专利
    未知

    公开(公告)号:BR0204637A

    公开(公告)日:2003-09-16

    申请号:BR0204637

    申请日:2002-11-12

    Applicant: XEROX CORP

    Abstract: A highly compact laser scanner with no moving parts includes a vertical cavity surface emitting laser (VCSEL). A microlens is mounted directly to the light emitting surface of the VCSEL via flip chip bonding. The VCSEL array may be one or two dimensional. The laser array may be used in a variety of applications including free space optical communications.

    10.
    发明专利
    未知

    公开(公告)号:DE60129914T2

    公开(公告)日:2007-12-06

    申请号:DE60129914

    申请日:2001-11-28

    Applicant: XEROX CORP

    Abstract: Provided is a ribbon structure which may be used as part of a micro-assembly including a micro-device formed on or in a device layer of a single crystal silicon substrate. The ribbon structure is also formed in the device layer, where the ribbon structure is thinned to a thickness less than the thickness of the micro-device. The ribbon structure has an electrical conductive material deposited on its surface. When implemented as part of the micro-assembly, a first end of the micro-device and a first end of a ribbon structure are interconnected, wherein the ribbon structure and out-of-plane device are formed as a single piece.

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