公开(公告)号：US08259072B2

公开(公告)日：2012-09-04

申请号：US11867768

申请日：2007-10-05

Applicant: Chin-Lin Hsieh ,  Jr-Wei Lian ,  Shun-Nan Liou ,  Ming-Jye Tsai

Inventor： Chin-Lin Hsieh ,  Jr-Wei Lian ,  Shun-Nan Liou ,  Ming-Jye Tsai

IPC: G06F3/02 ,  G09G5/00

CPC classification number: A63F13/22 ,  A63F13/06 ,  A63F13/211 ,  A63F13/23 ,  A63F2300/1018 ,  A63F2300/105

Abstract: An input control apparatus and an interactive system using the same are disclosed. The input control apparatus comprises: a switch unit, for selecting an input mode for the input control apparatus selected from the group consisting of a mouse mode, a joystick mode, a keyboard mode and the combination thereof; an interface unit, for generating an input signal according to the input mode selected by the switch unit; a remote control unit, for generating and thus transmitting a control signal according to the input mode and the input signal. By transmitting the control signals of two aforesaid input control apparatuses to an electronic device, such as a computer, an interactive gaming device or an interactive multimedia device, two such input control apparatuses can be integrated as a handheld apparatus with a left-hand unit and a right-hand unit for meeting the control requirements of a comparatively more complicated game executing on the electronic device. However, for those less complicated game, the two input control apparatuses can be configured as independent devices to be operated by different users. Thereby, users are able to interact with the electronic device.

Abstract translation: 公开了一种输入控制装置和使用该控制装置的交互式系统。 输入控制装置包括：开关单元，用于从由鼠标模式，操纵杆模式，键盘模式及其组合组成的组中选择输入控制装置的输入模式; 接口单元，用于根据由开关单元选择的输入模式生成输入信号; 遥控单元，用于根据输入模式和输入信号产生和发送控制信号。 通过将两个上述输入控制装置的控制信号发送到诸如计算机，交互式游戏装置或交互式多媒体装置之类的电子装置，可将两个这样的输入控制装置集成为具有左手装置的手持装置， 用于满足在电子设备上执行的比较复杂的游戏的控制要求的右侧单元。 然而，对于那些较不复杂的游戏，两个输入控制装置可以被配置为由不同用户操作的独立设备。 因此，用户能够与电子设备进行交互。

公开(公告)号：US20120126418A1

公开(公告)日：2012-05-24

申请号：US12954397

申请日：2010-11-24

Applicant: Chien-Te Feng ,  Shih-Chin Lin

Inventor： Chien-Te Feng ,  Shih-Chin Lin

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/481 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81416 ,  H01L2224/81418 ,  H01L2224/8142 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/8146 ,  H01L2224/81463 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81473 ,  H01L2224/81476 ,  H01L2224/81478 ,  H01L2224/83385 ,  H01L2224/85409 ,  H01L2224/85411 ,  H01L2224/85413 ,  H01L2224/85416 ,  H01L2224/85418 ,  H01L2224/8542 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85457 ,  H01L2224/8546 ,  H01L2224/85463 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2224/85473 ,  H01L2224/85476 ,  H01L2224/85478 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit (IC) device includes a polymer substrate having a topside surface and a bottomside surface opposite the topside surface, a plurality of through-holes that extend from the topside surface to the bottomside surface, and a plurality of bottom metal pads on the bottomside surface positioned over the plurality of through-holes. At least one IC die having an active topside including a plurality of bond pads and a second side is affixed to the topside surface. Bonding features are coupled to the plurality of bond pads for coupling respective ones of the plurality of bond pads to the plurality bottom metal pads. The bonding features extend into the through-holes to contact the bottom metal pads.

Abstract translation: 集成电路（IC）装置包括具有顶侧表面和与顶侧表面相对的底部表面的聚合物基板，从顶侧表面延伸到底部表面的多个通孔，以及多个底部金属焊盘 底部表面定位在多个通孔上。 具有包括多个接合焊盘的活动顶面和第二侧的至少一个IC管芯固定到顶侧表面。 接合特征耦合到多个接合焊盘，用于将多个接合焊盘中的相应接合焊盘连接到多个底部金属焊盘。 接合特征延伸到通孔中以接触底部金属焊盘。

公开(公告)号：US20120052728A1

公开(公告)日：2012-03-01

申请号：US12872294

申请日：2010-08-31

Applicant: SHI-XIANG LU ,  Feng Zhu ,  Kuo-Chin Lin

Inventor： SHI-XIANG LU ,  Feng Zhu ,  Kuo-Chin Lin

IPC: H01R13/648 ,  H01R24/00

CPC classification number: H01R12/7094 ,  H01R12/724

Abstract: A card connector includes an insulating housing, a plurality of contacts, a projection and a detecting contact set. The insulating housing includes a bottom wall, a right wall and a left wall for defining a receiving space. The contacts are received in the insulating housing. The projection is protruded from the right wall and into the receiving space, which includes a slanting surface slanted relative to the right wall. The detecting contact set is fixed in the insulating housing, which includes a contacting arm protruding from the slating surface of the projection and into the receiving space. Due to the contacting arm of the detecting contact set is protruded from the slanting surface of the projection in the receiving space, the detecting contact set will be actuated while a card is inserted into the receiving space correctly and completely. Since, the detecting accuracy of the card connector is improved.

Abstract translation: 卡连接器包括绝缘壳体，多个触点，突起和检测触点组。 绝缘壳体包括用于限定接收空间的底壁，右壁和左壁。 触点被接收在绝缘壳体中。 突起从右壁突出到接收空间中，其包括相对于右壁倾斜的倾斜表面。 检测触点组固定在绝缘壳体中，该绝缘壳体包括从突起的平板表面突出并接合到接收空间中的接触臂。 由于检测触点组的接触臂从接收空间中的突起的倾斜表面突出，所以当卡被正确且完全地插入接收空间时，检测触点组将被致动。 由于卡连接器的检测精度提高。

公开(公告)号：US08120927B2

公开(公告)日：2012-02-21

申请号：US12098474

申请日：2008-04-07

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.

Abstract translation: 公开了印刷电路板。 印刷电路板包括具有顶表面和底表面的基底。 地平面位于底面。 信号迹线沿着第一方向在顶表面上。 至少两个隔离的电源平面分别位于与信号迹线的相对侧相邻的顶表面上。 沿着第二方向的导电连接在信号迹线上耦合到两个电源层，而不与电信号迹线电连接，其中信号迹线不经过接地层的任何分裂。

公开(公告)号：US20120015493A1

公开(公告)日：2012-01-19

申请号：US13241014

申请日：2011-09-22

Applicant: Chia-Pin Lin ,  Wen-Sheh Huang ,  Tian-Choy Gan ,  Chia-Lung Hung ,  Hsien-Chin Lin ,  Shyue-Shyh Lin

Inventor： Chia-Pin Lin ,  Wen-Sheh Huang ,  Tian-Choy Gan ,  Chia-Lung Hung ,  Hsien-Chin Lin ,  Shyue-Shyh Lin

IPC: H01L21/336

CPC classification number: H01L29/66795 ,  H01L29/66803

Abstract: Provided is a high-k metal gate structure formed over a semiconductor fin. A nitride layer is formed over the gate structure and the semiconductor fin, using two separate deposition operations, the first forming a very thin nitride film. Implantation operations may be carried out in between the two nitride film deposition operations. The first nitride film may be SiNx or SiCNx and the second nitride film is SiCNx. The nitride films may be combined to form low wet etch rate spacers enabling further processing operations to be carried out without damaging underlying structures and without requiring the formation of further dummy spacers. Further processing operations include epitaxial silicon/SiGe processing sequences and source/drain implanting operations carried out with the low etch rate spacers intact.

Abstract translation: 提供了形成在半导体鳍上的高k金属栅极结构。 在栅极结构和半导体鳍片上形成氮化物层，使用两个单独的沉积操作，首先形成非常薄的氮化物膜。 植入操作可以在两个氮化物膜沉积操作之间进行。 第一氮化物膜可以是SiNx或SiCNx，第二氮化物膜是SiCNx。 可以将氮化物膜组合以形成低湿蚀刻速率间隔物，使得能够进行进一步的处理操作而不损坏下面的结构，而不需要形成另外的虚设间隔物。 进一步的处理操作包括外延硅/ SiGe处理序列和用低蚀刻速率间隔物完整地进行的源极/漏极注入操作。

公开(公告)号：US08093078B2

公开(公告)日：2012-01-10

申请号：US12879206

申请日：2010-09-10

Applicant: Chester Kuo ,  Hung Chin Lin

Inventor： Chester Kuo ,  Hung Chin Lin

IPC: H01L21/00

CPC classification number: H01L33/642 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A method for fabricating a photoelectric device initially provides a ceramic substrate comprising a thermal dissipation layer on a bottom layer of the ceramic substrate, an electrode layer on the top surface of the ceramic substrate, and a reflective structure in cavities of the ceramic substrate. Next, a plurality of photoelectric dies is disposed on the top surface of the ceramic substrate. Then, a first packaging layer is formed on the top surfaces of the photoelectric dies. Next, the ceramic substrate is placed between an upper mold and a lower mold. Finally, a plurality of lenses is formed on the top surface of the first packaging layer by using an injection molding technique or a transfer molding technique.

Abstract translation: 一种制造光电装置的方法最初提供了一种陶瓷基片，该陶瓷基片包括陶瓷基片的底层上的散热层，陶瓷基片顶表面上的电极层和陶瓷基片的空腔中的反射结构。 接着，在陶瓷基板的上表面上配置多个光电管。 然后，在光电管芯的上表面上形成第一包装层。 接下来，将陶瓷基板放置在上模和下模之间。 最后，通过使用注塑技术或传递模塑技术在第一包装层的顶表面上形成多个透镜。

公开(公告)号：US20110297040A1

公开(公告)日：2011-12-08

申请号：US12825583

申请日：2010-06-29

Applicant: Chien-Ming Chen ,  Shun-Te Lin ,  Chien-Wen Lee ,  Wen-Chin Lin

Inventor： Chien-Ming Chen ,  Shun-Te Lin ,  Chien-Wen Lee ,  Wen-Chin Lin

IPC: C09D11/02

CPC classification number: C09D11/324

Abstract: A black ink composition is provided. The black ink composition includes a dispersive black colorant; less than 1 wt % of a glycol ether compound based on total weight of the black ink composition; a solvent; and water. The black ink composition of the present invention is free of surfactants and has excellent compatibility with a nozzle, and thus provides good smoothness in printing and high-quality image.

Abstract translation: 提供黑色油墨组合物。 黑色油墨组合物包括分散黑色着色剂; 小于1重量％的基于黑色油墨组合物的总重量的二醇醚化合物; 溶剂; 和水。 本发明的黑色油墨组合物不含表面活性剂并且与喷嘴具有优异的相容性，因此提供良好的印刷平滑性和高品质图像。

公开(公告)号：US08021188B1

公开(公告)日：2011-09-20

申请号：US12850020

申请日：2010-08-04

Applicant: Yuan-Yuan Ma ,  Kai-Hsiang Chang ,  Kuo-Chin Lin

Inventor： Yuan-Yuan Ma ,  Kai-Hsiang Chang ,  Kuo-Chin Lin

IPC: H01R13/648

CPC classification number: H01R13/6582 ,  H01R12/722 ,  H01R13/6594 ,  H01R24/60

Abstract: An electrical connector includes an insulating housing, a terminal pack module, at least one propping element and a shielding shell. A front of the insulating housing defines a receiving space. At least one fastening groove is opened in an outer periphery of the insulating housing. A bottom of the fastening groove defines a fastening hole. A plurality of terminals is received in the insulating housing. The propping element is received in the corresponding fastening groove and has a base portion. An elastic portion is extended frontward from the base portion, and a contacting portion is protruded inward from a free end of the elastic portion for being inserted into the fastening hole to be exposed to the receiving space. A shielding shell encloses the insulating housing and the propping element. The shielding shell has at least one mouth corresponding to the fastening hole and the contacting portion.

Abstract translation: 电连接器包括绝缘壳体，端子组件模块，至少一个支撑元件和屏蔽壳体。 绝缘壳体的前部限定了接收空间。 至少一个紧固槽在绝缘壳体的外周边开口。 紧固槽的底部限定了紧固孔。 多个端子被容纳在绝缘壳体中。 支撑元件被容纳在相应的紧固槽中并且具有基部。 弹性部分从基部向前延伸，并且接触部分从弹性部分的自由端向内突出，以插入紧固孔中以暴露于接收空间。 屏蔽壳包围绝缘壳体和支撑元件。 屏蔽壳具有至少一个对应于紧固孔和接触部分的口。

公开(公告)号：US20110156066A1

公开(公告)日：2011-06-30

申请号：US12982210

申请日：2010-12-30

Applicant: Chin-Lin YAO ,  Chih-Chiang Lu

Inventor： Chin-Lin YAO ,  Chih-Chiang Lu

IPC: H01L33/64 ,  H01L33/10

CPC classification number: H01L27/15 ,  H01L25/075 ,  H01L25/0753 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/6609 ,  H01L29/66969 ,  H01L29/861 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/22 ,  H01L33/24 ,  H01L33/32 ,  H01L33/385 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: The present application discloses a semiconductor light-emitting device with a protection layer. The structure includes a heat dispersion substrate, a first connecting layer on the heat dispersion substrate, a protection layer on the first connecting layer, a second connecting layer on the protection layer, and a light-emitting unit on the second connecting layer. The protection layer is highly insulative and can avoid the current leakage forming between the light-emitting unit and the heat dispersion substrate.

Abstract translation: 本申请公开了一种具有保护层的半导体发光器件。 该结构包括散热基板，散热基板上的第一连接层，第一连接层上的保护层，保护层上的第二连接层和第二连接层上的发光单元。 保护层是高度绝缘的，并且可以避免发光单元和散热基板之间的电流泄漏形成。

公开(公告)号：US07963800B1

公开(公告)日：2011-06-21

申请号：US12716267

申请日：2010-03-02

Applicant: Feng Chen ,  Feng Zhu ,  Kuo-Chin Lin

Inventor： Feng Chen ,  Feng Zhu ,  Kuo-Chin Lin

IPC: H01R13/648

CPC classification number: H01R12/724 ,  H01R12/7047 ,  H01R13/6581

Abstract: An electrical connector is adapted for being mounted to a printed circuit board. The electrical connector includes a housing, a plurality of terminals, a shell and a bracket. A front edge of a periphery of the housing is protruded outward to form a flange. The terminals are received in the housing. The shell surrounds the housing. A front edge of the shell abuts against the flange. The bracket has a base board, and two opposite ends of the base board extends downward to form two blocking boards. Bottoms of the blocking boards extend outward to form two soldering boards. The base board of the bracket is mounted on the top board of the shell. The blocking boards are mounted on the two side boards. Front edges of the base board and the blocking boards of the bracket abut against the flange.

Abstract translation: 电连接器适于安装到印刷电路板。 电连接器包括壳体，多个端子，壳体和支架。 壳体的周边的前边缘向外突出以形成凸缘。 端子接收在外壳中。 外壳围绕外壳。 外壳的前边缘抵靠法兰。 支架具有基板，基板的两个相对端向下延伸以形成两个阻挡板。 阻挡板的底部向外延伸以形成两个焊接板。 支架的底板安装在外壳的顶板上。 挡板安装在两个侧板上。 基板的前边缘和支架的阻挡板抵靠凸缘。