公开(公告)号：WO2017058332A2

公开(公告)日：2017-04-06

申请号：PCT/US2016/041556

申请日：2016-07-08

Applicant: H.C. STARCK INC. ,  SMATHERS, David, B.

Inventor： SMATHERS, David, B. ,  AIMONE, Paul ,  DARY, Francois, Charles

IPC: G02B6/44 ,  G02B6/38

CPC classification number: H01B12/10 ,  B21C3/04 ,  C22C27/02 ,  C22F1/18 ,  H01B1/026 ,  H01B13/0036 ,  H01L39/14 ,  H01L39/2406

Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.

Abstract translation: 在各种实施例中，超导线具有包覆复合长丝的组合和/或嵌入线基体内的稳定的复合长丝。 电线可以包括用于改善机械性能的一个或多个稳定元件。

公开(公告)号：WO2015017627A1

公开(公告)日：2015-02-05

申请号：PCT/US2014/049073

申请日：2014-07-31

Applicant: H.C. STARCK INC.

Inventor： MILLER, Steven, A.

IPC: C23C24/00 ,  B05D5/00 ,  C23C14/34

CPC classification number: C23C14/3414 ,  C23C24/04 ,  H01J37/3417 ,  H01J37/3426 ,  H01J2237/081 ,  H01J2237/332

Abstract: In various embodiments, eroded sputtering targets are partially refurbished by spray- depositing particles of target material to at least partially fill certain regions (e.g., regions of deepest erosion) without spray-deposition within other eroded regions (e.g., regions of less erosion). The partially refurbished sputtering targets may be sputtered after the partial refurbishment without substantive changes in sputtering properties (e.g., sputtering rate) and/or properties of the sputtered films.

Abstract translation: 在各种实施例中，侵蚀的溅射靶通过喷射沉积目标材料的颗粒而部分地翻新，以至少部分地填充某些区域（例如，最深的侵蚀区域），而不会在其它侵蚀区域（例如较少侵蚀的区域）内进行喷雾沉积。 部分翻新的溅射靶可以在部分翻新之后溅射，而溅射性能（例如，溅射速率）和/或溅射膜的性质没有实质性的变化。

公开(公告)号：WO2013090516A1

公开(公告)日：2013-06-20

申请号：PCT/US2012/069401

申请日：2012-12-13

Applicant: H.C. STARCK INC. ,  MICHALUK, Christopher ,  LOEWENTHAL, William ,  ROZAK, Gary ,  ABOUAF, Marc ,  HOGAN, Patrick ,  MILLER, Steven, A.

Inventor： MICHALUK, Christopher ,  LOEWENTHAL, William ,  ROZAK, Gary ,  ABOUAF, Marc ,  HOGAN, Patrick ,  MILLER, Steven, A.

IPC: C23C14/34 ,  C23C24/08

CPC classification number: C23C14/3414 ,  C23C14/3407 ,  C23C24/04

Abstract: In various embodiments, used sputtering targets are refurbished at least in part by maintaining a large obliquity angle (300) between the spray-deposition gun (320) and the depressed surface contour (330) of the target during spray deposition of the target material.

Abstract translation: 在各种实施例中，使用的溅射靶材至少部分地通过在靶材料的喷涂沉积期间在喷涂沉积枪（320）和靶的凹陷表面轮廓（330）之间保持大的倾斜角（300）来进行翻新。

公开(公告)号：WO2009020619A1

公开(公告)日：2009-02-12

申请号：PCT/US2008/009446

申请日：2008-08-06

Applicant: H.C. STARCK, INC. ,  BOZKAYA, Dincer ,  JEPSON, Peter, R.

Inventor： BOZKAYA, Dincer ,  JEPSON, Peter, R.

IPC: B21B1/22

CPC classification number: H01J37/3426 ,  B21B1/227 ,  B21B39/04 ,  B21B2265/24 ,  B21B2267/065 ,  B21B2273/02 ,  B22F3/18 ,  C22F1/18 ,  C23C14/3414 ,  Y10T428/12 ,  Y10T428/12014 ,  Y10T428/12458

Abstract: Methods and apparatus for rolling metal sheet or plate (3) are provided. The method comprises the step of feeding the metal plate or sheet (3) into a rolling mill (1, 2) at an angle. The apparatus comprises a rolling mill having a tilted feed table (4), or an apron upon which a transfer table and tilted feed table can rest. Through- thickness gradient and shear texture can be improved using the methods and apparatus of the invention.

Abstract translation: 提供了用于轧制金属板或板（3）的方法和装置。 该方法包括以一定角度将金属板或片材（3）进给到轧机（1,2）中的步骤。 该设备包括具有倾斜进给台（4）的滚轧机或转台和倾斜进给台可以放在其上的围裙。 可以使用本发明的方法和装置改善厚度梯度和剪切结构。

公开(公告)号：WO2008137689A3

公开(公告)日：2008-11-13

申请号：PCT/US2008/062434

申请日：2008-05-02

Applicant: H.C. STARCK INC. ,  H.C. STARCK GMBH ,  MILLER, Steven, A. ,  KUMAR, Prabhat ,  WU, Richard ,  SUN, Shuwei ,  ZIMMERMANN, Stefan ,  SCHMIDT-PARK, Olaf

Inventor： MILLER, Steven, A. ,  KUMAR, Prabhat ,  WU, Richard ,  SUN, Shuwei ,  ZIMMERMANN, Stefan ,  SCHMIDT-PARK, Olaf

IPC: B22F1/00 ,  C22C1/04 ,  C23C4/12 ,  C23C14/34

Abstract: The invention relates to a sputtering target which has a fine uniform equiaxed grain structure of less than 44 microns, no preferred texture orientation as measured by electron back scattered diffraction ("EBSD") and that displays no grain size banding or texture banding throughout the body of the target. The invention relates a sputtering target with a lenticular or flattened grain structure, no preferred texture orientation as measured by EBSD and that displays no grain size or texture banding throughout the body of the target and where the target has a layered structure incorporating a layer of the sputtering material and at least one additional layer at the backing plate interface, said layer has a coefficient of thermal expansion ("CTE") value between the CTE of the backing plate and the CTE of the layer of sputtering material. The invention also relates to thin films and their use of using the sputtering target and other applications, such as coatings, solar devices, semiconductor devices etc. The invention further relates to a process to repair or rejuvenate a sputtering target.

公开(公告)号：WO2008076748A3

公开(公告)日：2008-06-26

申请号：PCT/US2007/087214

申请日：2007-12-12

Applicant: H.C. STARCK INC. ,  MILLER, Steven, A. ,  SHEKHTER, Leonid, Natan ,  ZIMMERMAN, Stefan

Inventor： MILLER, Steven, A. ,  SHEKHTER, Leonid, Natan ,  ZIMMERMAN, Stefan

IPC: C23C24/04 ,  C23C24/08 ,  C23C24/10 ,  B23K5/10 ,  B23K9/23 ,  B23K9/32 ,  B23K101/18 ,  B23K101/34

Abstract: The present invention is directed to a process for joining tantalum clad steel structures. The process broadly comprises: a) providing a first tantalum clad section, said first tantalum clad section comprising a tantalum layer over a steel layer, with a bonding layer optionally therebetween, with a portion of said steel layer in an edge region not being covered by said tantalum layer or said bonding layer, b) providing a second tantalum clad section, said second tantalum clad section comprising a tantalum layer over a steel layer, with a bonding layer optionally therebetween, with a portion of said steel layer in an edge region not being covered by said tantalum layer or said bonding layer, c) locating said steel edge regions adjacent each other, d) welding the steel edge regions together, e) cold spraying a tantalum powder onto the welded edge regions and over the tantalum layers adjacent said edge regions thereby joining the tantalum clad steel sections. The invention is also directed to tantalum welds or joints formed by cold spraying tantalum powder.

公开(公告)号：WO2007120194A3

公开(公告)日：2007-10-25

申请号：PCT/US2006/042400

申请日：2006-10-31

Applicant: H.C. STARCK INC. ,  H.C. STARCK GMBH ,  HUDDLESTON, James, B. ,  ZATORSKI, Raymond ,  MAZOLIC, Jean

Inventor： HUDDLESTON, James, B. ,  ZATORSKI, Raymond ,  MAZOLIC, Jean

IPC: C09D5/00 ,  C23C30/00 ,  C23C4/10

Abstract: Abradable coatings are provided. The coatings comprise SrTiO in combination with a ceramic, such as ytrria stabilized zirconia, or SrTiO in combination with an MCrAlX, such as NiCoCrAlY. The abradable coatings are suitable for use in high temperature environments found in gas turbine engines. Also provided are metal articles coated with such coatings, and abradable assemblies.

公开(公告)号：WO2006026621A2

公开(公告)日：2006-03-09

申请号：PCT/US2005/030852

申请日：2005-08-29

Applicant: H.C. STARCK INC. ,  LEMON, Brad ,  HIRT, Joseph ,  WELLING, Timothy ,  DAILY, James, G., III ,  MEENDERING, David ,  ROZAK, Gary ,  O'GRADY, Jerone ,  JEPSON, Peter, R. ,  KUMAR, Prabhat ,  MILLER, Steven, A. ,  WU, Rong-Chein, Richard ,  SCHWARZ, Davd, G.

Inventor： LEMON, Brad ,  HIRT, Joseph ,  WELLING, Timothy ,  DAILY, James, G., III ,  MEENDERING, David ,  ROZAK, Gary ,  O'GRADY, Jerone ,  JEPSON, Peter, R. ,  KUMAR, Prabhat ,  MILLER, Steven, A. ,  WU, Rong-Chein, Richard ,  SCHWARZ, Davd, G.

IPC: C22C27/04 ,  C23C14/34 ,  B22F3/14

CPC classification number: C23C14/3414 ,  B22F1/0003 ,  B22F3/16 ,  B22F3/162 ,  B22F3/24 ,  B22F5/006 ,  B22F2003/248 ,  B22F2301/20 ,  B22F2998/00 ,  B22F2998/10 ,  C21D8/0221 ,  C21D8/0247 ,  C22C1/045 ,  C22C27/04 ,  C22F1/18 ,  C23C14/14 ,  C23C14/3478 ,  C23C14/3485 ,  C23C14/35 ,  C23C14/46 ,  B22F3/172 ,  B22F3/20 ,  B22F3/04 ,  B22F3/10

Abstract: Molybdenum, sputtering targets and sintering characterized as having no or minimal texture banding or through thickness gradient. The molybdenum sputtering targets having a fine, uniform grain size as well as uniform texture, are high purity and can be micro-alloyed to improved performance. The sputtering targets can be round discs, square, rectangular or tubular and can be sputtered to form thin films on substrates. By using a segment-forming method, the size of the sputtering target can be up to 6 m X 5.5 m. The thin films can be used in electronic components such as Thin Film Transistor - Liquid Crystal Displays, Plasma Display Panels, Organic Light Emitting Diodes, Inorganic Light Emitting Diode Displays, Field Emission Displays, solar cells, sensors, semiconductor devices, and gate device for CMOS (complementary metal oxide semiconductor) with tunable work functions.

Abstract translation: 钼，溅射靶和烧结表征为没有或最小纹理条纹或通过厚度梯度。 具有精细，均匀的晶粒尺寸以及均匀质地的钼溅射靶是高纯度的，并且可以微合金化以改善性能。 溅射靶可以是圆盘，正方形，矩形或管状，并且可以溅射以在基底上形成薄膜。 通过使用段形成方法，溅射靶的尺寸可以达到6m×5.5μm。 薄膜可以用于薄膜晶体管 - 液晶显示器，等离子体显示面板，有机发光二极管，无机发光二极管显示器，场发射显示器，太阳能电池，传感器，半导体器件和门装置等电子部件中 CMOS（互补金属氧化物半导体）具有可调功能。

公开(公告)号：WO2005040044A2

公开(公告)日：2005-05-06

申请号：PCT/US2004/020932

申请日：2004-06-29

Applicant: H.C. STARCK INC. ,  McHUGH, Lawrence, F. ,  KUMAR, Prabhat ,  MEENDERING, David ,  WU, Richard ,  WOETTING, Gerhard

Inventor： McHUGH, Lawrence, F. ,  KUMAR, Prabhat ,  MEENDERING, David ,  WU, Richard ,  WOETTING, Gerhard

IPC: C01G39/00

CPC classification number: C01G39/02 ,  B82Y30/00 ,  C01P2002/52 ,  C01P2004/20 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2004/86 ,  C01P2006/10 ,  C01P2006/40 ,  C01P2006/80 ,  H01L33/42 ,  H01L51/5206

Abstract: The invention relates to high purity MoO 2 powder by reduction of ammonium molybdate or molybdenum trioxide using hydrogen as the reducing agent in a rotary or boat furnace. Consolidation of the powder by press/sintering, hot pressing , and/or HIP is used to make discs, slabs, or plates, which are used as sputtering targets. The MoO 2 disc, slab, or plate form is sputtered on a substrate using a suitable sputtering method or other physical means to provide a thin film having a desired film thickness. The thin films have properties such as electrical, optical, surface roughness, and uniformity comparable or superior to those of indium-tin oxide (ITO) and zinc-doped ITO in terms of transparency, conductivity, work function, uniformity, and surface roughness. The MoO 2 and MoO 2 containing thin films can be used in organic light-emitting diodes (OLED), liquid crystal display (LCD), plasma display panel (PDP), field emission display (FED), thin film solar cell, low resistivity ohmic contacts, and other electronic and semiconductor devices.

Abstract translation: 本发明涉及通过在旋转或船式炉中使用氢作为还原剂还原钼酸铵或三氧化钼的高纯度MoO 2粉末。 使用通过压制/烧结，热压和/或HIP将粉末固结制成用作溅射靶的盘，板或板。 使用合适的溅射方法或其它物理方法将MoO 2盘，板或板形式溅射在基板上，以提供具有所需膜厚度的薄膜。 在透明度，导电性，功函数，均匀性和表面粗糙度方面，薄膜具有与铟锡氧化物（ITO）和掺杂锌的ITO相当或优于电，光学，表面粗糙度和均匀性的性质。 含有MoO2和MoO2的薄膜可用于有机发光二极管（OLED），液晶显示器（LCD），等离子体显示面板（PDP），场发射显示器（FED），薄膜太阳能电池，低电阻率欧姆接触 ，以及其他电子和半导体器件。

公开(公告)号：WO2002064858A1

公开(公告)日：2002-08-22

申请号：PCT/US2002/004073

申请日：2002-02-12

Applicant: H.C. STARCK, INC.

Inventor： SIMKINS, Leah ,  CONLON, Anastasia

IPC: C25B11/04

CPC classification number: H01G9/042 ,  H01G9/052 ,  H01G9/0525

Abstract: The allows: Ta-Si, Nb-Si, TaN-Si, NbN-Si and variants are used as enhanced powder anode substrates for electrolytic capacitor anodes (sintered powder masses) with dielectric oxide formation at walls of the internal pores.

Abstract translation: 允许：Ta-Si，Nb-Si，TaN-Si，NbN-Si和变体用作用于在内部孔的壁处形成电介质氧化物的电解电容器阳极（烧结粉末质量）的增强的粉末阳极基底。