Abstract:
A technology capable of avoiding malfunction of a delay locked loop without generating a constant phase error in a delay locked loop circuit is provided. In a delay locked loop circuit, a control circuit is disposed in the outside of a delay locked loop, and in phase comparison of the delay locked loop, the control circuit outputs a control signal to the delay locked loop so that the relation in the phase comparison between a reference signal and an output signal is shifted by a set cycle.
Abstract:
A fine pattern forming material comprising a water soluble resin of polyvinyl alcohol derivative, etc., a water soluble crosslinking agent of melamine derivative, urea derivative, etc., an amine compound, a nonionic surfactant and water or a solution of a mixture of water and water soluble organic solvent, the solution exhibiting a pH value of >7. This fine pattern forming material is applied onto resist pattern (3) to thereby form coating layer (4), and the coating layer (4) is heated and developed to thereby form crosslinked coating layer (5). The thickness of the crosslinked coating layer is increased by the use of a secondary amine compound and/or tertiary amine compound over that realized when no amine compound is added, while the thickness of the crosslinked coating layer is decreased by the use of a quaternary amine.
Abstract:
A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. A body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. An opposite side (opposite to the chip mounting side) of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of the molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.
Abstract:
A semiconductor integrated circuit (2), provided with a charge pump circuit (9) of low power consumption, maintains an output voltage (VOUT) thereof at a predetermined voltage level without causing current consumption to undergo intermittent variation, and a contactless electronic device (1) using the semiconductor integrated circuit (2). With respective charge pump circuit unit cells (15,19), charge current/discharge current is controlled according to the output voltage (VOUT) of the charge pump circuit (9). The charge pump circuit (9) can maintain the output voltage (VOUT) thereof at the predetermined voltage level without undergoing an intermittent action. The charge current and discharge current are supplied from power supply terminals (PA,PB) of a power supply circuit (3), current control is executed by a transistor, and a voltage outputted according to the output voltage (VOUT) of the charge pump circuit (9) is supplied to the gate of the transistor.
Abstract:
Manufacturing processes for phase change memory have suffered from the problem of chalcogenide material being susceptible to delamination, since this material exhibits low adhesion to high melting point metals and silicon oxide films. Furthermore, chalcogenide material has low thermal stability and hence tends to sublime during the manufacturing process of phase change memory. According to the present invention, conductive or insulative adhesive layers are formed over and under the chalcogenide material layer to enhance its delamination strength. Further, a protective film made up of a nitride film is formed on the sidewalls of the chalcogenide material layer to prevent sublimation of the chalcogenide material layer.
Abstract:
The present invention relates generally to integrated circuit (IC) fabrication processes. The present invention relates more particularly to the treatment of surfaces, such as silicon dioxide or silicon oxynitride layers, for the subsequent deposition of a metal, metal oxide, metal nitride and/or metal carbide layer. The present invention further relates to a high-k gate obtainable by a method of the invention.
Abstract:
To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.
Abstract:
When resistivity against errors caused by cosmic ray neutrons in a semiconductor device is evaluated, the storage (120) in the evaluation apparatus stores multiple spectrum data of white neutrons having different spectrum shapes, and multiple SEE counts obtained by the white neutron method using this multiple spectrum data. A computing section (100) performs processing, with respect to each spectrum data, to read out the spectrum data from the storage, divide the data into multiple energy groups, calculates and stores a total flux of each energy group. Furthermore, the computing section reads out from the storage, the SEE counts with respect to each of the multiple spectrum data and the total flux of each energy group, substitutes the SEE counts and the total flux into a simultaneous equation, where a product of matrix elements indicating the total flux of each of the energy groups as to each of the multiple spectrum data and vectors indicating the SEE cross section of each of the energy groups represents the SEE count as to each of the multiple spectrum data, and calculates the SEE cross section for each of the energy groups. Subsequently, the computing section performs a calculation so that parameters are calculated, which determine a formula of the approximate function of the SEE cross section as a function of energy, so that computed values of error counts obtained by integration of multiple spectra and the approximate function sufficiently match the actual measured values thereof. With the processing as described above, there has been achieved an error evaluation in the semiconductor device using white neutrons independent from an accelerator.
Abstract:
The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.
Abstract:
An on-screen display unit includes OSD RAMs (1a and 1b) each for storing data on one of OSD blocks to be subjected to OSD (on-screen display); a memory bus (11) for transferring data to be stored to the OSD RAMs (1a and 1b) from a CPU (4); and an OSD local bus (12) for transferring the data stored in the OSD RAMs (1a and 1b) to make the OSD. The OSD RAMs (1a and 1b) are supplied with the data to be stored through the control of switches (2a and 2b) alternately, and transfer the stored data to the OSD local bus 12 alternately. The on-screen display unit can cope with a high frequency OSD clock signal, and carry out the OSD normally.