Abstract:
도금을 이용하여 도전 패드들 간을 연결하는 방법 및 이에 의한 도전 패드들 간의 연결 구조체를 제시한다. 본 발명에 따르면, 도전성의 제1패드가 형성된 제1모재를 준비하고, 제1패드 표면에 활성화된 촉매면이 형성되게 활성화 처리한다. 도전성의 제2연결 패드가 형성된 제2모재를 준비하고, 제2패드 표면에 활성화된 촉매면이 형성되게 활성화 처리한다. 제1패드 상에 제2연결 패드가 대향되게 정렬하고, 제1패드와 제2패드를 연결시키는 도전성의 도금층을 무전해 도금한다. 패키지, 칩 말림, 열 이력, 무전해 도금, 패드 접속 연결
Abstract:
일정 각속도 제어 방식에 적합한 동기 신호를 가지는 디스크에 관한 것이다. 본 발명에 따른 컴팩트 디스크는 스파이럴 상으로 형성된 트랙들을 가지는 컴팩트 디스크에 있어서, 상기 트랙은 소정의 간격으로 배열되며 일정 선속도 제어를 위한 제1동기신호가 기록된 제1영역; 및 일정 각속도 제어를 위한 제2동기 신호가 기록된 제2영역을 구비하며, 여기서, 상기 제1영역 및 제2영역은 상기 컴팩트 디스크의 트랙 방향으로 교번적으로 배치되되어 있고, 상기 제2영역은 디스크의 방사선 방향으로 일직선으로 배열된 것을 특징으로 한다. 본 발명에 따른 컴팩트 디스크는 디스크의 방사선 방향으로 일정 각속도 방식에 적합한 동기 신호를 기록함으로써 컴팩트 디스크 플레이어가 디스크로부터 검출된 동기 신호에 의해 정확한 회전 제어를 가능하게 하는 효과를 가진다.
Abstract:
PURPOSE: An In-situ chamber cleaning method and a semiconductor wafer process system using the same are provided to clean a deposit of a high-dielectric layer formed on an inner wall of a chamber in a deposition process of an aluminum oxide layer or a hafnium oxide layer by using an in-situ chamber cleaning method. CONSTITUTION: A protective layer is selectively deposited on a surface of a chamber(200). A deposit of a high-dielectric layer is formed within the chamber including the selective protection layer(300). A control gas including BCl3 and insert gas is injected into the chamber(400). The control gas is changed into plasma state by adding energy to the control gas(500). The deposit of the high-dielectric layer is cleaned by using the plasma of the control gas(600). The high-dielectric layer is formed with one of an aluminum oxide layer, a hafnium oxide layer, and a complex layer of the aluminum oxide layer and the hafnium oxide layer.
Abstract:
PURPOSE: A wafer boat of a semiconductor fabrication apparatus is provided to reduce a contact area between a wafer and slots, improve the quality of a layer formed on the wafer, and prevent errors of the wafer due to particles by contacting only three slots with the wafer to support the wafer, stably. CONSTITUTION: A wafer boat(20) includes three rods(12), an upper support plate(13), and a lower support plate(14). A groove type slot(11) is formed on the rod(12). A wafer(2) is inserted into the groove type slot(11) of the rod(12). The upper support plate(13) and the lower support plate(14) are connected with upper portions and lower portions of the rods(12). The rods(12), the upper support plate(13), and the lower support plate(14) are formed with quartz material.
Abstract:
목적: 히터코일이 열적으로 변형되어 가열로 내벽에 침입함에 따라 가열로의 내벽이 파손되는 것을 사전에 방지할 수 있는 히터코일 변형에 의한 가열로 내벽의 파손방지를 위한 점검 방법을 제공한다. 구성: 본 발명은 도전재로 형성되며 표면 절연 코팅된 가열로 내벽과 단열 및 절연된 가열로 외벽 사이로 개설되며, 제 1 코일로부터 제 n 코일까지 순차 접속되는 히터코일을 보유하는 가열로에 있어서, 상기 히터코일의 변형에 따른 상기 가열로 내벽과의 단락 여부 및 단락 부위를 점검하기 위한 방법으로서, 상기 가열로 내벽과 전기적으로 접속되는 커먼단자를 마련하고, 이 커먼단자를 중심으로 상기 제 1 코일로부터 제 n 코일까지 각 코일의 단자들과의 전기특성치를 측정하는 것을 특징으로 한다. 여기에서, 상기 전기특성치는 상기 히터코일의 전압 비인가상태에서 측정되는 저항값이거나, 상기 히터코일의 전압 인가상태에서 측정되는 전압값이다. 효과: 히터코일을 이루는 권선들이 변형되어 가열로의 내벽을 파고드는 변형초기에 그 징후를 손쉬운 점검에 의해서 확인할 수 있도록 한다. 따라서, 정비에 소요되는 시간이나 부품 비용을 줄일 수 있고 공정상의 온도 프로파일의 실패로 인한 불량 제품의 생산을 사전에 방지할 수 있다.
Abstract:
PURPOSE: A method for preparing a thin film by reacting a first reactant and second reactant well is provided which gives a stoichiometric thin film having high and excellent film density. CONSTITUTION: A method comprises the steps of chemically absorbing a first reactant on a substrate by pouring the first reactant in a substrate-containing chamber; removing the first reactant which is physically absorbed on a chemically absorbed first reactant; forming a substance film by pouring gas containing an element having a large attraction to a second reactant to be provided thereafter in the chamber in which the first reactant is removed and reacting with the chemically absorbed reactant; chemically absorbing the first reactant on the substance film by pouring the first reactant in the substance film -forming chamber; removing the first reactant physically absorbed on the chemically absorbed first reactant; and forming a solid film on the substance film by pouring the second reactant in the chamber and chemical substitution of the first reactant and second reactant.
Abstract:
PURPOSE: A method for preserving a heater inner wall against heater coil deformation is provided to acknowledge deformation of the heater inner wall at the first place, to prevent the heater inner wall from being destructed due to the heater coil deformation. CONSTITUTION: A method for preserving a heater inner wall against heater coil deformation includes first through steps. At the first step, A heater inner wall(24) formed with a conductive material(244) whose surface is insulated is provided. At the second step, a heater coil(30) is implemented between the heater inner wall(24) and a heater outer wall(22). The heater coil is connected from a first coil(L1) through nth coil(Ln). At the third step, a common terminal(Pc) connecting electrically to the heater inner wall is provided. At the forth step, probing the terminals of each coils(P1-Pn) is performed.
Abstract:
PURPOSE: An ozone ashier is provided to easily separate or couple an exhaust line, and to prevent damage of a connected part when separating or coupling the exhaust line. CONSTITUTION: An ozone ashier(10) progressing an asking process comprises a chamber, a catalytic destroyer(50), and an exhaust line. The catalytic destroyer destroys gas exhausted from the chamber. The exhaust line is connected between the chamber and the catalytic destroyer, and makes gas flow to the catalytic destroyer from the chamber. The ozone ashier connects and separates the exhaust line by setting up a quick coupling on the exhaust line. A socket(40) of the quick coupling is set up in the exhaust line connected to the chamber, and a plug(65) coupled to the socket is set up in the exhaust line connected to the catalytic destroyer. A connecting part for connecting the catalytic destroyer and the chamber in the exhaust line is polytetrafluoethylene.
Abstract:
PURPOSE: A manufacturing method of a capacitor having an AL2O3/ALN(Alumina/Aluminium Nitride) mixed dielectric layer is provided to obtain a stable high dielectric layer which does not react on polysilicon in a succeeding thermal process without changing a structure of the capacitor. CONSTITUTION: The manufacturing method of the capacitor comprises the step of using a mixed dielectric layer composed of either AL2O3/ALN or ALN/AION(Aluminium Nitride) as a dielectric material between capacitor electrodes by utilizing an ALD(Atomic Layer Deposition) process so that good step coverage with no chemical reaction can be obtained even if conductive polysilicon is used as capacitor electrodes.
Abstract:
PURPOSE: A method of forming a capacitor is provided to prevent an increase of leakage currents occurred by lack of oxygen. CONSTITUTION: The method comprises the steps of; loading a semiconductor substrate, having a dielectric film formed with high dielectric material containing oxygen, in a process chamber; delivering a first source gas containing oxygen in the chamber; purging the first gas; delivering a second source gas containing titanium in the chamber; reacting the second gas with the first gas; purging the second gas; delivering a third source gas containing nitrogen in the chamber; reacting the third gas with the first and second gas adsorbed on the substrate, forming a titaniumoxynitride film on the dielectric film; purging the third gas; delivering the second gas in the chamber; purging the second gas; delivering the third gas in the chamber; and reacting the third gas with the second gas absorbed on the titaniumoxynitride film, forming a titaniumnitride film.