公开(公告)号：US10813249B1

公开(公告)日：2020-10-20

申请号：US16526960

申请日：2019-07-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Ernesto Ferrer Medina ,  Harvey Lunsman ,  Tahir Cader

IPC: H05K7/20 ,  G06F1/20

Abstract: An example tunable cold plate includes a body that is formed from a thermally conductive material and that includes a thermal interface surface to receive by conduction heat generated by a component of a computing device, such as a memory module. The cold plate includes a liquid coolant channel extending through the body. The cold plate also includes multiple orifices in the thermal interface surface that fluidly connect into the liquid coolant channel. The cold plate may also include one or more inserts that can be inserted into some or all of the orifices. The thermal performance of the cold plate, or a subsection thereof, may be tuned by varying the number of inserts that are inserted into the orifices of the cold plate or of the subsection.

公开(公告)号：US10810068B2

公开(公告)日：2020-10-20

申请号：US15757032

申请日：2015-09-04

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz

IPC: G06F11/00 ,  G06F1/20 ,  F01P7/14 ,  F01P11/14 ,  G05B23/02

Abstract: In one implementation, a system for valve failure prediction includes a temperature engine to determine a temperature of a liquid exiting a cooling device, a flowrate engine to compare an actual flow rate of the liquid exiting the cooling device to a flow rate threshold, a prediction engine to determine when a valve of the cooling device is malfunctioning based on the comparison of the actual flow rate and the flow rate threshold, and a notification engine to notify a user when the valve of the cooling device is malfunctioning.

公开(公告)号：US10791648B1

公开(公告)日：2020-09-29

申请号：US16364980

申请日：2019-03-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader

IPC: H05K7/20 ,  F04D29/58

Abstract: A pump includes an armature, a rotor assembly, a liquid path connector and a member. The armature includes a ferromagnetic core, a winding and a through passageway. The rotor assembly is disposed in the passageway and includes an impeller to rotate to pump liquid through the passageway. The liquid path connector is connected to the armature to communicate the liquid with the passageway. The member contacts an outer surface of the armature and contacts an outer surface of the liquid path connector to transfer thermal energy from the armature to the liquid path connector.

公开(公告)号：US10750639B2

公开(公告)日：2020-08-18

申请号：US16196372

申请日：2018-11-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey J. Lunsman ,  Tahir Cader

IPC: H05K7/20 ,  F28F7/00 ,  H05K1/14 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02

Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.

公开(公告)号：US20200163257A1

公开(公告)日：2020-05-21

申请号：US16194259

申请日：2018-11-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader ,  Harvey Lunsman

IPC: H05K7/20

Abstract: A device including a circuit component that dissipates heat and a cooling loop thermally coupled to the circuit component, is provided. The cooling loop includes an inlet port configured to receive a cooling fluid, a first axial pump disposed along a fluid flow channel and configured to move the cooling fluid axially through the fluid flow channel in the cooling loop at a specified flow rate, and an outlet port configured to transfer the cooling fluid out of the cooling loop, wherein the specified flow rate is adjusted according to one or more parameters.

公开(公告)号：US20190335618A1

公开(公告)日：2019-10-31

申请号：US15965069

申请日：2018-04-27

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer Medina ,  Tahir Cader

IPC: H05K7/20 ,  G06F1/20

Abstract: Examples herein relate to an efficient cooling system. Examples disclose a first distribution line that delivers a first cooling fluid across a device. The first cooling fluid flows across the device from a first side to a second side. The examples also disclose a second distribution like that is separate from the first distribution line. The second distribution line delivers a second cooling fluid across the device from the second side to the first side such that the second cooling fluid flows in an opposite direction to the first cooling fluid.

公开(公告)号：US10431926B2

公开(公告)日：2019-10-01

申请号：US15561606

申请日：2015-04-14

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader

IPC: H01R13/62 ,  H01R13/52 ,  H01R25/14 ,  H05K7/20 ,  F16L29/02

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.

公开(公告)号：US20190243430A1

公开(公告)日：2019-08-08

申请号：US15889840

申请日：2018-02-06

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Matthew Slaby ,  Aaron Childers ,  Tuong Tran ,  Tahir Cader

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F1/206 ,  G06F2200/201

Abstract: In some examples, a system may include a plurality of cooling distribution units (CDUs) to control cooling of a plurality of computing devices based in part on average differential pressure between a supply and return for each of the plurality of CDUs, temperature of coolant in a loop flowing between each of the plurality of CDUs and computing devices, and facility valve position for each of the plurality of CDUs, wherein one CDU of the plurality of the CDUs is nominated lead CDU and broadcasts flow rate to the plurality of CDUs to follow.

公开(公告)号：US10337950B2

公开(公告)日：2019-07-02

申请号：US15397798

申请日：2017-01-04

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Zhiyong Li ,  John Franz

IPC: G01M3/16 ,  G01M3/40

Abstract: Examples herein relate to detecting a coolant leak. For example, a system includes a nanosensor coupled to an airflow channel in a server. The nanosensor provides a resistance measurement to a controller. The system includes the controller coupled to the nanosensor. The controller detects the coolant leak based on the resistance measurement from the nanosensor.

公开(公告)号：US10240997B2

公开(公告)日：2019-03-26

申请号：US15257554

申请日：2016-09-06

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader ,  William Kirk Norton

IPC: G01M3/04

Abstract: An assembly to detect fluid leaks is provided herein. For example, the assembly includes a plug, a gasket, and a sensor member. The plug is connected to a first electronic module. The gasket surrounds the plug to provide a fluid-tight seal around the plug. The sensor member is connected to the gasket to detect fluid loss that exceeds a predetermined amount.