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公开(公告)号：US11589477B2
公开(公告)日：2023-02-21
申请号：US16580605
申请日：2019-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey Lunsman , Tahir Cader
Abstract: Methods and systems for creating cold plates are disclosed. For example, in one example method for manufacturing a cold plate made of a thermally-conductive plastic includes performing a first injection-molding process using the thermally-conductive plastic to produce a first unitary body, the first unitary body including one or more elongated sections forming a unitary body, performing a second injection-molding process using the thermally-conductive plastic to produce a second unitary body, the second unitary body incorporating the first unitary body so as to cover a majority of the first unitary body and form a respective coolant pipe body corresponding to each elongated section, and performing a machining process on the second unitary body so as to create a conduit in each respective coolant pipe body suitable for a fluid to pass through to create respective coolant pipes.
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公开(公告)号：US20230320032A1
公开(公告)日：2023-10-05
申请号：US18330599
申请日：2023-06-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Harvey Lunsman
CPC classification number: H05K7/20272 , H05K7/20763 , G06F1/20 , F16L37/28 , F16L37/34 , G06F2200/201
Abstract: A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.
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公开(公告)号：US11711907B2
公开(公告)日：2023-07-25
申请号：US16876804
申请日：2020-05-18
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John Franz , Harvey Lunsman
CPC classification number: H05K7/20272 , F16L37/28 , F16L37/34 , G06F1/20 , H05K7/20763 , G06F2200/201
Abstract: A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.
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4.发明授权公开(公告)号：US10763191B1
公开(公告)日：2020-09-01
申请号：US16438271
申请日：2019-06-11
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John Franz , Harvey Lunsman , Steven Dean
Abstract: Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.
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公开(公告)号：US10433458B1
公开(公告)日：2019-10-01
申请号：US15973705
申请日：2018-05-08
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Tahir Cader , Harvey Lunsman
IPC: H05K7/20 , H01L23/473 , H01L23/427 , G06F1/20 , F28F3/04 , F28F21/06 , F28D15/02
Abstract: Cold plates are described herein. In one example, a cold plate can include a thermally conductive plastic forming a coolant channel that includes a heat spreader formed into the thermally conductive plastic and an exterior surface of the thermally conductive plastic with a coupling location to couple a heat pipe to the exterior surface of the thermally conductive plastic.
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Patent Agency Ranking
公开(公告)号：US10237999B2
公开(公告)日：2019-03-19
申请号：US15339451
申请日：2016-10-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey Lunsman , Troy Oxby , Michael Peterson , David Collins , Steven J. Dean , Russell Stacy , Andy Warner
Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space.
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公开(公告)号：US12245401B2
公开(公告)日：2025-03-04
申请号：US18330599
申请日：2023-06-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Harvey Lunsman
Abstract: A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.
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公开(公告)号：US20220039295A1
公开(公告)日：2022-02-03
申请号：US17278514
申请日：2019-02-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Harvey Lunsman
Abstract: An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one of the plurality of wall structures. The internal fluid channel of at least one of the plurality of wall structures and the internal fluid channel of the at least one partition structure defines a continuous fluid circulation path between a fluid inflow port and a fluid outflow port.
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公开(公告)号：US10955883B1
公开(公告)日：2021-03-23
申请号：US16653335
申请日：2019-10-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Robert Mascia , Harvey Lunsman , Steven Dean , Michael Scott
Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
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公开(公告)号：US10188016B2
公开(公告)日：2019-01-22
申请号：US15339483
申请日：2016-10-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey Lunsman , Steven J. Dean , Roger Ramseier , Russell Stacy
Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling.
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