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公开(公告)号：US10705578B2
公开(公告)日：2020-07-07
申请号：US16191916
申请日：2018-11-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , William K. Norton , Ernesto Ferrer Medina
IPC: G06F1/20 , H05K1/02 , H05K7/20 , G11C5/04 , H01L27/108 , H01L23/473 , H01L23/427
Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.
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公开(公告)号：US10827649B2
公开(公告)日：2020-11-03
申请号：US15965069
申请日：2018-04-27
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer Medina , Tahir Cader
Abstract: Examples herein relate to an efficient cooling system. Examples disclose a first distribution line that delivers a first cooling fluid across a device. The first cooling fluid flows across the device from a first side to a second side. The examples also disclose a second distribution like that is separate from the first distribution line. The second distribution line delivers a second cooling fluid across the device from the second side to the first side such that the second cooling fluid flows in an opposite direction to the first cooling fluid.
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公开(公告)号：US10813249B1
公开(公告)日：2020-10-20
申请号：US16526960
申请日：2019-07-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Ernesto Ferrer Medina , Harvey Lunsman , Tahir Cader
Abstract: An example tunable cold plate includes a body that is formed from a thermally conductive material and that includes a thermal interface surface to receive by conduction heat generated by a component of a computing device, such as a memory module. The cold plate includes a liquid coolant channel extending through the body. The cold plate also includes multiple orifices in the thermal interface surface that fluidly connect into the liquid coolant channel. The cold plate may also include one or more inserts that can be inserted into some or all of the orifices. The thermal performance of the cold plate, or a subsection thereof, may be tuned by varying the number of inserts that are inserted into the orifices of the cold plate or of the subsection.
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公开(公告)号：US20190335618A1
公开(公告)日：2019-10-31
申请号：US15965069
申请日：2018-04-27
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer Medina , Tahir Cader
Abstract: Examples herein relate to an efficient cooling system. Examples disclose a first distribution line that delivers a first cooling fluid across a device. The first cooling fluid flows across the device from a first side to a second side. The examples also disclose a second distribution like that is separate from the first distribution line. The second distribution line delivers a second cooling fluid across the device from the second side to the first side such that the second cooling fluid flows in an opposite direction to the first cooling fluid.
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公开(公告)号：US11974414B2
公开(公告)日：2024-04-30
申请号：US17604827
申请日：2019-08-23
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Ernesto Ferrer Medina , Harvey J. Lunsman , Tahir Cader , John Franz
CPC classification number: H05K7/20509 , G06F1/20 , H05K1/0203
Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.
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Patent Agency Ranking
公开(公告)号：US20210333846A1
公开(公告)日：2021-10-28
申请号：US16860926
申请日：2020-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Ernesto Ferrer Medina , Tahir Cader , Steven Dean
Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.
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公开(公告)号：US10667431B1
公开(公告)日：2020-05-26
申请号：US16398115
申请日：2019-04-29
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , John Franz , Tahir Cader , Ernesto Ferrer Medina
Abstract: An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.
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公开(公告)号：US20200159294A1
公开(公告)日：2020-05-21
申请号：US16191916
申请日：2018-11-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , William K. Norton , Ernesto Ferrer Medina
IPC: G06F1/20 , G11C5/04 , H01L27/108 , H05K1/02
Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.
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公开(公告)号：US20190103290A1
公开(公告)日：2019-04-04
申请号：US15724251
申请日：2017-10-03
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Ernesto Ferrer Medina , Niru Kumari , Chih C. Shih , Sergio Escobar-Vargas
IPC: H01L21/48 , H01L23/367 , H05K7/20
Abstract: In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.
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公开(公告)号：US20240251528A1
公开(公告)日：2024-07-25
申请号：US18627195
申请日：2024-04-04
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Ernesto Ferrer Medina , Harvey J. Lunsman , Tahir Cader , John Franz
CPC classification number: H05K7/20509 , G06F1/20 , H05K1/0203
Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.
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