公开(公告)号：US09395183B2

公开(公告)日：2016-07-19

申请号：US14472143

申请日：2014-08-28

Applicant: InvenSense, Inc.

Inventor： Joseph Seeger ,  Ozan Anac

IPC: G01C19/00 ,  G01C19/5733 ,  G01C19/574 ,  G01C19/5712 ,  G01C19/5755

CPC classification number: G01C19/5733 ,  G01C19/5712 ,  G01C19/574 ,  G01C19/5755

Abstract: A gyroscope is disclosed. The gyroscope comprises a substrate; and a guided mass system. The guided mass system comprises proof-mass and guiding arm. The proof-mass and the guiding arm are disposed in a plane parallel to the substrate. The proof-mass is coupled to the guiding arm. The guiding arm is also coupled to the substrate through a spring. The guiding arm allows motion of the proof-mass to a first direction in the plane. The guiding arm and the proof-mass rotate about a first sense axis. The first sense axis is in the plane and parallel to the first direction. The gyroscope includes an actuator for vibrating the proof-mass in the first direction. The gyroscope also includes a transducer for sensing motion of the proof-mass-normal to the plane in response to angular velocity about a first input axis that is in the plane and orthogonal to the first direction.

Abstract translation: 公开了一种陀螺仪。 陀螺仪包括基板; 和引导质量体系。 引导质量系统包括检验质量和引导臂。 证明物质和引导臂设置在平行于基底的平面中。 证明物质联接到引导臂。 引导臂也通过弹簧与基板相连。 引导臂允许证明物质在平面中的第一方向的运动。 引导臂和证明质量围绕第一感测轴线旋转。 第一感测轴在平面内并且平行于第一方向。 陀螺仪包括用于在第一方向上振动证明物质的致动器。 陀螺仪还包括用于响应于围绕在平面中并与第一方向正交的第一输入轴的角速度来感测与平面相反的质量法向运动的换能器。

公开(公告)号：US20160107881A1

公开(公告)日：2016-04-21

申请号：US14979194

申请日：2015-12-22

Applicant: InvenSense, Inc.

Inventor： Matthew Julian Thompson ,  Joseph Seeger

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0006 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0264 ,  B81B2207/093 ,  B81B2207/098 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031 ,  B81C2203/035

Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises providing a MEMS substrate which includes forming one or more cavities in a first semiconductor layer; forming a second semiconductor layer; and providing a dielectric layer between the first semiconductor layer and the second semiconductor layer The MEMS substrate providing step further includes bonding the first semiconductor layer to a second semiconductor layer; etching at least one via through the second semiconductor layer and the dielectric layer; and depositing a first conductive material onto the second semiconductor layer surface and filling the at least one via. The MEMS substrate providing step also includes depositing a second conductive material on top of the first conductive material; etching the second conductive material and the first conductive material to form at least one stand-off; the second semiconductor layer to define one or more MEMS structures; and the first semiconductor layer to create an opening to separate the first semiconductor layer into a first portion and a second portion. The method further comprises bonding the MEMS substrate to a base substrate using a eutectic bond between the second conductive material and metal pads of the base substrate.

Abstract translation: 公开了一种在集成MEMS器件中制造电连接的方法。 该方法包括提供MEMS衬底，其包括在第一半导体层中形成一个或多个空腔; 形成第二半导体层; 以及在所述第一半导体层和所述第二半导体层之间提供介电层。所述MEMS衬底提供步骤还包括将所述第一半导体层接合到第二半导体层; 通过所述第二半导体层和所述电介质层蚀刻至少一个通孔; 以及将第一导电材料沉积到所述第二半导体层表面上并填充所述至少一个通孔。 MEMS衬底提供步骤还包括在第一导电材料的顶部上沉积第二导电材料; 蚀刻第二导电材料和第一导电材料以形成至少一个支座; 所述第二半导体层限定一个或多个MEMS结构; 以及第一半导体层，以形成用于将第一半导体层分离成第一部分和第二部分的开口。 该方法还包括使用第二导电材料和基底衬底的金属焊盘之间的共晶键将MEMS衬底接合到基底衬底。

公开(公告)号：US09304155B2

公开(公告)日：2016-04-05

申请号：US13720984

申请日：2012-12-19

Applicant: Invensense, Inc.

Inventor： Baris Cagdaser ,  Derek Shaeffer ,  Joseph Seeger

IPC: G01R27/26 ,  G01C19/5726 ,  G01D5/24

CPC classification number: G01C25/00 ,  G01C19/5726 ,  G01D5/24 ,  G01R27/2605

Abstract: A MEMS capacitive sensing interface includes a sense capacitor having a first terminal and a second terminal, and having associated therewith a first electrostatic force. Further included in the MEMS capacitive sensing interface is a feedback capacitor having a third terminal and a fourth terminal, the feedback capacitor having associated therewith a second electrostatic force. The second and the fourth terminals are coupled to a common mass, and a net electrostatic force includes the first and second electrostatic forces acting on the common mass. Further, a capacitance measurement circuit measures the sense capacitance and couples the first terminal and the third terminal. The capacitance measurement circuit, the sense capacitor, and the feedback capacitor define a feedback loop that substantially eliminates dependence of the net electrostatic force on a position of the common mass.

Abstract translation: MEMS电容感测接口包括具有第一端子和第二端子的感测电容器，并且具有与其相关联的第一静电力。 还包括在MEMS电容感测接口中的是具有第三端子和第四端子的反馈电容器，所述反馈电容器具有与其相关联的第二静电力。 第二和第四端子耦合到共同的质量，净静电力包括作用在公共质量上的第一和第二静电力。 此外，电容测量电路测量感测电容并耦合第一端子和第三端子。 电容测量电路，感测电容器和反馈电容器定义了基本上消除了净静电力对共同质量位置的依赖性的反馈回路。

公开(公告)号：US09221676B2

公开(公告)日：2015-12-29

申请号：US14590839

申请日：2015-01-06

Applicant: InvenSense, Inc.

Inventor： Kegang Huang ,  Jongwoo Shin ,  Martin Lim ,  Michael Julian Daneman ,  Joseph Seeger

IPC: B81C1/00

CPC classification number: B81C1/00301 ,  B81B7/0064 ,  B81B2207/098 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031

Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.

Abstract translation: 公开了一种在集成MEMS器件中制造电连接的方法。 该方法包括形成MEMS晶片。 形成MEMS晶片包括在第一半导体层中形成一个空腔，将第一半导体层与设置在第一半导体层和第二半导体层之间的电介质层结合到第二半导体层，并且通过第二半导体蚀刻至少一个通孔 层和介电层，并在第二半导体层上沉积导电材料并填充至少一个通孔。 形成MEMS晶片还包括图案化和蚀刻导电材料以形成一个间隔并在导电材料上沉积锗层，图案化和蚀刻锗层，以及图案化和蚀刻第二半导体层以限定一个MEMS结构。 该方法还包括将MEMS晶片接合到基底基板。

公开(公告)号：US09170107B2

公开(公告)日：2015-10-27

申请号：US14041810

申请日：2013-09-30

Applicant: InvenSense, Inc.

Inventor： Ozan Anac ,  Joseph Seeger

IPC: G01C19/56 ,  G01C19/574 ,  G01C19/5712

CPC classification number: G01C19/56 ,  G01C19/5712 ,  G01C19/574

Abstract: A gyroscope comprises a substrate and a guided mass system. The guided mass system comprises proof masses and guiding arms disposed in a plane parallel to the substrate. The proof masses are coupled to the guiding arm by springs. The guiding arm is coupled to the substrate by springs. At least one of the proof-masses is directly coupled to the substrate by at least one anchor via a spring system. The gyroscope also comprises an actuator for vibrating one of the proof-masses in the first direction, which causes another proof mass to rotate in the plane. Finally, the gyroscope also includes transducers for sensing motion of the guided mass system in response to angular velocities about a single axis or multiple input axes.

Abstract translation: 陀螺仪包括基板和引导质量系统。 引导质量系统包括设置在平行于基板的平面中的检验质量块和引导臂。 检测质量通过弹簧联接到引导臂。 引导臂通过弹簧联接到基板。 至少一个校验物质通过弹簧系统由至少一个锚定件直接耦合到衬底。 陀螺仪还包括用于在第一方向上振动一个证明质量块的致动器，这导致另一个证明物质在平面中旋转。 最后，陀螺仪还包括用于响应于围绕单个轴或多个输入轴的角速度来感测被引导质量系统的运动的换能器。