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    PRODUCTION OF COPPER-CLAD LAMINATE
    94.
    发明专利
    PRODUCTION OF COPPER-CLAD LAMINATE 失效

    公开(公告)号：JPS62270636A

    公开(公告)日：1987-11-25

    申请号：JP11350086

    申请日：1986-05-20

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  OGOSHI KOJI ,  YAMAGUCHI TERUHIRO

    IPC: B32B15/08 ,  C08G73/10 ,  C08J5/24 ,  H05K1/03

    Abstract: PURPOSE:To obtain a copper-clad laminate having a strong adhesion to copper foil and having high heat resistance, by laminate-molding a copper foil with a prepreg sheet impregnated with a specified polyimide and/or polyamic acid as its precursor. CONSTITUTION:A prepreg sheet is obtained by impregnating a sheet substrate with a polymer having repeating units of formula I [wherein Y is a group of formula II and/or formula III]. A copper foil is laminate-molded with this prepreg sheet. The polymer of formula I is a polyimide obtained by reacting 2,2-bis[4-(3-aminophenoxy-phenyl]propane with 3,3',4,4'-benzophenonetetracarboxy lic dianhydride and/or a polyamic acid as its precursor.

    POLYIMIDE
    95.
    发明专利
    POLYIMIDE 失效

    公开(公告)号：JPS62241923A

    公开(公告)日：1987-10-22

    申请号：JP8494586

    申请日：1986-04-15

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  OOTA MASAHIRO ,  OIKAWA HIDEAKI ,  OGOSHI KOJI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10

    Abstract: PURPOSE:To obtain a polyimide being excellent in both of heat resistance and solvent resistance, having thermoplasticity, melt moldability and good processability and suited for aircraft materials, electronic components, etc., by cyclizing a specified polyamic acid through dehydration. CONSTITUTION:A diamine component comprising 2,2-bis[4-(3-aminophenoxy) phenyl]-1,1,1,3,3,3-hexafluoropropane is reacted with a tetracarboxylic acid dianhydride component comprising pyromellitic anhydride to produce a polyamic acid having repeating units of formula I and a logarithmic viscosity of 0.1-4dl/g as measured in an N,N-dimethylacetamide solvent at a concentration of 0.5g/100ml solvent and 350 deg.C. This polyamic acid is cyclized through dehydration by heating or treating with an imidating agent to obtain the purpose polyimide having repeating units of formula II.

    HEAT-RESISTANT ADHESIVE
    96.
    发明专利
    HEAT-RESISTANT ADHESIVE 失效

    公开(公告)号：JPS62235381A

    公开(公告)日：1987-10-15

    申请号：JP7647586

    申请日：1986-04-04

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  OGOSHI KOJI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C09J179/08

    Abstract: PURPOSE:To provide an adhesive composed of a polymer having specific recurring units, exhibiting strong adhesive force without lowering the heat-resistance and maintaining high adhesivity even at a high temperature. CONSTITUTION:The objective adhesive is composed of a polymer having the recurring unit of formula I [X is group of formula II or III (Y is tetravalent group selected from >=2C aliphatic, cycloaliphatic, monocyclic aromatic, condensed polycyclic aromatic and uncondensed polycyclic aromatic group containing aromatic groups bonded directly or through a crosslinking member); R1-R3 are H or methyl]. The polymer can be produced by using an ether diamine of formula IV, i.e. methyl-substituted 2, 2-bis[4-(3-aminophenoxy) phenyl]propane as the diamine component, reacting the component with a tetracarboxylic acid dianhydride and optionally carrying out dehydrative cyclization of the product.

    POLYIMIDE
    98.
    发明专利
    POLYIMIDE 失效

    公开(公告)号：JPS62205124A

    公开(公告)日：1987-09-09

    申请号：JP4636986

    申请日：1986-03-05

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  OOTA MASAHIRO ,  OIKAWA HIDEAKI ,  OGOSHI KOJI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10

    Abstract: PURPOSE:To obtain a polyimide outstanding in processability, low water absorptivity, solvent and alkali resistances etc., suitable for aerospace base materials, having specific recurring unit, by imide modification of specific polyamic acid. CONSTITUTION:The objective polyimide having recurring unit of formula II can be obtained by imide modification of a polyamic acid with a logarithmic viscosity 0.1-4.0 (pref. 0.3-2.5dl/g) determined in the form of N,N- dimethylacetamide solution of a concentration 0.5g/100ml at 35 deg.C, having recurring unit of formula I prepared by reaction pref. between 4,4-bis(3-aminophenoxy) biphenyl and pyromellitic anhydride in an organic solvent.

    HEAT-RESISTANT ADHESIVE
    99.
    发明专利
    HEAT-RESISTANT ADHESIVE 失效

    公开(公告)号：JPS62199674A

    公开(公告)日：1987-09-03

    申请号：JP4025386

    申请日：1986-02-27

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  OOTA MASAHIRO ,  OIKAWA HIDEAKI ,  OGOSHI KOJI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C09J179/08

    Abstract: PURPOSE:A heat-resistant adhesive, consisting of a polymer having specific repeating units and capable of exhibiting powerful adhesive force without deteriorating heat resistance and keeping a high adhesive force even at high temperatures. CONSTITUTION:An adhesive consisting of a polymer having repeating units expressed by formula I [Y is formula II or III (R is tetrafunctional group selected from the gruop consisting of >=2C aliphatic, cycloaliphatic, monocyclic aromatic, condensed polycyclic aromatic and noncondensed polycyclic aromatic groups in which aromatic groups are mutually linked directly or through crosslinking members)].

    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPRISING SAME
    100.
    发明专利
    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPRISING SAME 失效

    公开(公告)号：JPS6286021A

    公开(公告)日：1987-04-20

    申请号：JP22481285

    申请日：1985-10-11

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OOTA MASAHIRO ,  KAWASHIMA SABURO ,  SONOBE YOSHIO ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C09J179/08

    Abstract: PURPOSE:To obtain a multipurpose polyimide excellent in heat resistance, processability, heat bonding resistance and transparency, by thermal dehydration and ring closure of a specified polyimide acid. CONSTITUTION:4,4'-Bis(3-aminophenoxy)diphenyl sulfide as a diamine component and a tetracarboxylic acid dianhydride of formula I (wherein R is a tetravalent group such as a 2 C or higher aliphatic group, a cycloaliphatic group or a monocyclic or condensed polycyclic aromatic group) are polymerized at 60 deg.C or below and atmospheric pressure for 4-24hr in an organic solvent (e.g., N,N- dimethylformamide) to obtain a polyamic acid having repeating units each of which is represented by formula II and having an inherent viscosity of 0.1-3.0dl/g (in N,N-dimethylacetamide at 0.5g/100mol and 35 deg.C). The obtained acid is subjected to ring closure by thermal or chemical dehydration to obtain a polyimide having repeating units of formula III and, if desired, formed into a film or a powder. The product is inserted between adherends, and these adherends are pressure-bonded at a pressure of 1-1,000kg/cm and a tempera ture of 50-400 deg.C and strongly bonded together by curing at 100-400 deg.C.

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