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    POLYIMIDE RESIN COMPOSITION
    3.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH0912881A

    公开(公告)日：1997-01-14

    申请号：JP16943495

    申请日：1995-07-05

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OKAWA YUICHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C08J5/18 ,  C08G77/60 ,  C08K3/00 ,  C08K7/02 ,  C08L79/08 ,  C08L83/07

    Abstract: PROBLEM TO BE SOLVED: To prepare a polyimide resin compsn. having excellent heat resistance and mechanical properties by adding a particular silicon-contg. polymeric compd. to a particular polyimide resin. SOLUTION: 5 to 50 parts by weight of a silicon-contg. compd. (including its cured product) represented by formula IV (R1 represents H or a l-30 C alkyl, alkenyl, phenyl, or naphthyl group) is added to 100 pts.wt. polyimide resin, disclosed in Japanese Patent Laid-Open No. 205124/1987, represented by formula (W X represents a direct bond, formula II or the like; Ar represents a direct bond, formula III or the like) derived from biphenyltetracarboxylic acid dianhydride or the like and a diamine, such as bis(aminophenoxy)biphenyl, and they are mixed together in a powder form to prepare a polyimide resin compsn. Pref., the silicon-contg. polymer has a mol.wt. of 2,000 to 500,000. Since this compd. has a triple bond, crosslinking occurs due to heat applied during kneading or injection molding, improving the mechanical properties of the polyimide resin compsn. This powdery compsn. may be used, as such or after melt blending, for molding.

    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPOSED THEREOF
    6.
    发明专利
    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPOSED THEREOF 失效

    公开(公告)号：JPH08127656A

    公开(公告)日：1996-05-21

    申请号：JP26891394

    申请日：1994-11-01

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OKAWA YUICHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C09J179/08 ,  C08G73/10

    Abstract: PURPOSE: To obtain a polyimide useful as a heat-resistant adhesive bondable at a low temperature under low pressure and having high adhesive strength by reacting a mixture of two specific kinds of diamine compounds with an aromatic tetracarboxylic acid dianhydride. CONSTITUTION: This polyimide is produced by reacting (A) 1mol of an aromatic diaine of formula I (X1 to X3 are each O, CO, etc.) e.g. 4,4'-bis[4-(4- aminophenoxy)phenoxy]diphenyl sulfone} with (B) a diamine mixture containing 0.1-0.005mol of a dianainosiloxane compound of formula II ((n) is 0-7) [e.g. ω,ω'-bis(3-aminopropyl)polydimethylsiloxane] and (C) an aromatic tetracarboxylic acid dianhydride (e.g. pyromellitic acid dianhydride) optionally in the presence of a dicarboxylic acid anhydride and/or a monoamine compound under heating. The polyimide is preferably produced by reacting the components A to C at 0-40 deg.C and imidating the resultant polyamic acid at 150-400 deg.C.

    POLYIMIDE
    7.
    发明专利
    POLYIMIDE 失效

    公开(公告)号：JPH0881556A

    公开(公告)日：1996-03-26

    申请号：JP30776194

    申请日：1994-12-12

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMASHITA WATARU ,  OKAWA YUICHI ,  TAMAI MASAJI ,  MATSUO MITSUKI ,  ISHIDA TSUTOMU ,  KARASAWA AKIO ,  YAMAGUCHI KEISABURO ,  YAMAGUCHI TERUHIRO

    IPC: C07D213/61 ,  C07C253/30 ,  C07C255/54 ,  C08G73/10 ,  C08J5/18

    Abstract: PURPOSE: To obtain a polyimide which is essentially thermoplastic and has excellent properties by using a long-chain aromatic diamine composed of four benzene rings, one pyridine nucleus or benzonitrile nucleus bonded to each other through specified organic groups as a monomer component. CONSTITUTION: A hydroxy aromatic amino compound such as 2-(4- aminophenyl)-2-(4'-hydroxyphenyl)propane is condensed with a dihalogenopyridine or a dihalogenobenzonitrile to obtain an aromatic diamino compound represented by formula I (wherein L is O, carbpnyl or isopropylidene; X is a group of formula II or III; and Ar is a 6-27 C aromatic group), An aromatic diamine component based on this compound is reacted with an aromatic tetracarboxylic dianhydride to make a polyamic acid. This acid is imidated thermally or chemically to obtain a polyimide comprising repeating units of formula IV. The new polyimide which is one having a specified structure having a pyridine nucleus or a benzonitrile nucleus is essentially thermoplastic and is an injection-moldable material of excellent processability.

    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPRISING SAME
    8.
    发明专利
    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPRISING SAME 失效

    公开(公告)号：JPH0841199A

    公开(公告)日：1996-02-13

    申请号：JP18221594

    申请日：1994-08-03

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMASHITA WATARU ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C09J179/08 ,  C08G73/10

    Abstract: PURPOSE:To obtain a polyimide solution which is a heat-resistant adhesive with which bonding can be performed even at low temperature and low pressure by adding a specified diaminosiloxane compound to an aromatic diamine and reacting the mixture with an aromatic tetracarboxylic acid dianhydride. CONSTITUTION:This polyimide is obtained by reacting a diamine component containing 0.005-0.1mol of a diaminosiloxane of formula II (wherein n is 0-7) per mol of an aromatic diamine of formula I (wherein X is a direct bond 0 S CO, CH2 or the like; and R1 and R2 are each H, halogn, 1-3 C alkyl, phenyl or the like) with an aromatic tetracarboxylic acid dianhydride of formula III (wherein Ar is a tetravalent aromatic group) in the presence of a dicarboxylic acid anhydride and/or a monoamine. An examples of the aromatic diamine used is pyromellitic acid, and the molar ratio of the former to the latter is 1:(0.8-1.2). The formation of the polymer is performed in an organic solvent such as pyridine to form a polyamic acid or polyimide solution used as a heatresistant adhesive solution.

    POLYIMIDE RESIN COMPOSITION AND INJECTION-MOLDED ITEM EXCELLENT IN FATIGUE CHARACTERISTICS
    10.
    发明专利
    POLYIMIDE RESIN COMPOSITION AND INJECTION-MOLDED ITEM EXCELLENT IN FATIGUE CHARACTERISTICS 失效

    公开(公告)号：JPH07304949A

    公开(公告)日：1995-11-21

    申请号：JP9716694

    申请日：1994-05-11

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OKAWA YUICHI ,  SAKATA YOSHIHIRO ,  YAMASHITA WATARU ,  IIYAMA KATSUAKI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: B29C45/00 ,  B29K79/00 ,  C08K7/04 ,  C08K7/06 ,  C08K7/14 ,  C08L77/00 ,  C08L79/08

    Abstract: PURPOSE:To obtain the compsn. having a high melt moldability and excellent fatigue resistance by compounding a polyimide having specified chemical structure and logarithmic viscosity with a reinforcement such as carbon fibers. CONSTITUTION:100 pts.wt. polyimide having repeating units of formula I and a logarithmic viscosity of 0.70 dl/g or higher is compounded with 5-65 pts.wt., pref. 10-50 pts.wt., reinforcement comprising carbon fibers, glass fibers, arom. polyamide fibers and/or potassium titanate fibers. The polyimide used has blocked molecular terminals and is produced in the presence of an arom. dicarboxylic anhydride of formula II (wherein Z is a 6-15C divalent group having a monocyclic arom. group, a condensed polycyclic arom. group and/or a noncondensed polycyclic arom. group formed by linking arom. groups directly or through linking groups) and/or an arom. monoamine of formula III (wherein V is the same as Z except it is monovalent). The part of the polyimide may be replaced by another polyimide.

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