公开(公告)号：US09210785B2

公开(公告)日：2015-12-08

申请号：US13802569

申请日：2013-03-13

Applicant: Palo Alto Research Center Incorporated

Inventor： Bowen Cheng ,  Dirk DeBruyker ,  Eugene M. Chow

IPC: F21V7/00 ,  H05H1/24 ,  H01T23/00 ,  H05H1/48

CPC classification number: H05H1/24 ,  H01T23/00 ,  H05H2001/481

Abstract: An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.

Abstract translation: 用于冷却半导体电路组件的离子风力发动机单元包括弯曲的微型弹簧和相关联的电极，其被保持在适当的间隙距离处，使得当经受足够高的电压电位（即，由佩克定律确定）时， 在弹簧的尖端部分处的电流拥挤产生电场，该电场使围绕尖端部分的空气填充区域的一部分中的中性分子充分电离以产生微等离子体事件。 在一种发动机类型中，电极是金属焊盘，在第二发动机类型中，电极是第二微型弹簧。 通过控制设置在相对表面上的多个发动机在分离IC器件和基底基板的气隙区域中产生气流而产生例如以倒装芯片布置在IC芯片和基底基板之间的离子风冷却 。

公开(公告)号：US20150076961A1

公开(公告)日：2015-03-19

申请号：US14031392

申请日：2013-09-19

Applicant: Palo Alto Research Center Incorporated

Inventor： Jason Thompson ,  Eugene M. Chow ,  JengPing Lu ,  Gregory L. Whiting ,  David K. Biegelsen ,  Janos Veres

IPC: H02N1/00 ,  H02K1/00

CPC classification number: H02N1/004 ,  B81C99/002 ,  H01L2224/95 ,  H02K1/00

Abstract: A system and method reduce stiction while manipulating micro objects on a surface. The system and method employed a field generator configured to generate a driving force at a frequency and amplitude to at least partially overcome stiction between the micro objects and the surface. The field generator is further configured to generate a manipulation force to manipulate the micro objects on the surface in two dimensions. The manipulation force is spatially programmable.

Abstract translation: 系统和方法在操纵表面上的微物体时减少静摩擦。 该系统和方法使用场发生器，其被配置为产生频率和振幅的驱动力，以至少部分地克服微物体和表面之间的静摩擦力。 场发生器还被配置为产生操纵力以在二维中操纵表面上的微物体。 操纵力是空间可编程的。

公开(公告)号：US08969735B2

公开(公告)日：2015-03-03

申请号：US13802701

申请日：2013-03-13

Applicant: Palo Alto Research Center Incorporated

Inventor： Eugene M. Chow ,  Dirk DeBruyker

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H01L23/5387 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/113 ,  H05K1/189 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H01L2924/00

Abstract: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.

Abstract translation: 用于在柔性电子器件中的IC器件之间传输信号的柔性金属互连结构形成在层压在一起形成多层柔性衬底的两个柔性柔性材料层之间。 互连结构由连接到柔性材料层的内侧（面向）表面的两排间隔开的导电焊盘（金属岛）形成。 合适的微接触元件例如微弹簧提供滑动金属压力接触件，其在拉伸复合片材期间保持岛之间的电连接。 具体地，至少两个微接触元件附接到行中的一个中的每个金属岛，其中一个元件与相对行中的相关联的第一金属岛滑动压力接触，并且第二元件与相关联的第二元件滑动压力接触 金属岛。 岛和滑动触点可以被图案化成适应大应变的高密度迹线。

公开(公告)号：US20140272121A1

公开(公告)日：2014-09-18

申请号：US13831358

申请日：2013-03-14

Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

Inventor： Tse Nga Ng ,  JengPing Lu ,  Eugene M. Chow ,  Timothy David Stowe ,  Janos Veres ,  Philipp H. Schmaelzle

IPC: B29C33/38

CPC classification number: B29C33/3835 ,  B29C33/005 ,  B29C33/3842 ,  B29C33/448 ,  B29C64/00 ,  B29C64/106 ,  B29C67/0051 ,  B29C67/0055 ,  B29C2033/385

Abstract: A replica 3D structure is fabricated inside a multi-layered mold by patterning each mold layer to define a void/opening that matches a corresponding cross section of the structure's peripheral surface, and filling the patterned opening of each layer with a structural material (i.e., before depositing a subsequent layer of mold material). The mold material (e.g., photoresist or another dissolvable sacrificial material) is blanket deposited (e.g., by slot-die, spray coating) and then patterned using a laser or a printed mask. Each layer of modeling material (e.g., polymer, ceramic or metal, or a combination thereof) is electro-plated or otherwise deposited on the previously formed modeling material layer. High vertical resolution is achieved by utilizing relatively thin mold layers. The mold layer deposition, patterning and modeling material deposition is repeated until the replica 3D structure is entirely formed inside the multi-layered mold, and then the mold is dissolved or otherwise removed.

Abstract translation: 复制3D结构通过图案化每个模具层以形成与结构的周边表面的相应横截面相匹配的空隙/开口，并且用结构材料填充每个层的图案化开口（即， 在沉积后续的模具材料层之前）。 模具材料（例如，光致抗蚀剂或另一种可溶解的牺牲材料）被覆盖沉积（例如，通过槽模，喷涂），然后使用激光或印刷掩模进行图案化。 每层建模材料（例如，聚合物，陶瓷或金属或其组合）被电镀或以其他方式沉积在先前形成的建模材料层上。 通过使用相对薄的模具层实现高垂直分辨率。 重复模层沉积，图案化和建模材料沉积，直到复制3D结构完全形成在多层模具内，然后模具被溶解或以其他方式去除。