公开(公告)号：US20180065141A1

公开(公告)日：2018-03-08

申请号：US15697981

申请日：2017-09-07

Applicant: NORDSON CORPORATION

Inventor： Joel E. Saine

IPC: B05C11/10

CPC classification number: B05C11/1007 ,  B01F5/108 ,  B01F5/14 ,  B05B9/0403 ,  B05B11/3049 ,  B05B15/65 ,  B05C5/001 ,  B05C5/02 ,  B05C5/0225 ,  B05C5/0258 ,  B05C5/027 ,  B05C5/0279 ,  B05C11/025 ,  B05C11/1002 ,  B05C11/1026 ,  B05C11/1039 ,  B05C11/1042 ,  B05C11/1044 ,  B05C19/008 ,  B32B37/1284 ,  F04B49/20 ,  F04C14/08 ,  F04D15/0066

Abstract: An embodiment of the present disclosure is an applicator for dispensing adhesive onto a substrate. The applicator includes a manifold and at least one dispensing module coupled to the manifold. The applicator may include a least one pump assembly removably mounted the manifold. Each pump assembly having an outlet in flow communication with the manifold, and an inlet in flow communication with the adhesive. The pump assembly includes a gear assembly for pumping adhesive from said inlet to said outlet and a drive motor with a drive shaft connected to the gear assembly. The drive motor has a shaft with an axis that intersects said front surface of the pump assembly. In another example, the shaft has an axis that does not intersect both of a first side and a second side of said manifold.

公开(公告)号：US20180047563A1

公开(公告)日：2018-02-15

申请号：US15675385

申请日：2017-08-11

Applicant: Tokyo Electron Limited

Inventor： Anton J. deVilliers ,  Rodney L. Robison ,  Ronald Nasman ,  David Travis ,  James Grootegoed ,  Norman A. Jacobson, JR. ,  David Hetzer ,  Lior Huli ,  Joshua S. Hooge

IPC: H01L21/027 ,  H01L21/02 ,  H01L21/66 ,  H01L21/67

CPC classification number: H01L21/0275 ,  B05C5/02 ,  B05C11/1007 ,  B05C11/1047 ,  H01L21/02118 ,  H01L21/67017 ,  H01L21/67023 ,  H01L21/6715 ,  H01L21/67253 ,  H01L22/12

Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.

公开(公告)号：US20180035575A1

公开(公告)日：2018-02-01

申请号：US15663823

申请日：2017-07-31

Applicant: PROTEC CO., LTD.

Inventor： SEUNG MIN HONG

IPC: H05K9/00 ,  B05C11/10 ,  B05C5/02

CPC classification number: H05K9/0083 ,  B05C5/02 ,  B05C5/0225 ,  B05C11/1007 ,  B05C11/11

Abstract: Provided is a slurry dispensing apparatus for electromagnetic interference (EMI) shielding, and more particularly, a slurry dispensing apparatus for EMI shielding, wherein the slurry dispensing apparatus dispenses a slurry, in which a conductive metal powder and an adhesive are mixed, to an electronic component to form an electromagnetic wave shielding layer on the electronic component.By using the slurry dispensing apparatus for EMI shielding, the slurry may be dispensed while preventing separation of the metal powder included in the slurry from the adhesive by precipitation, and maintaining a uniform mixture ratio in the slurry.

公开(公告)号：US20170284844A1

公开(公告)日：2017-10-05

申请号：US15475442

申请日：2017-03-31

Applicant: NORDSON CORPORATION

Inventor： Wesley C. Fort ,  Ronald Ramspeck ,  Enes Ramosevac

IPC: G01F1/56 ,  C09J5/00 ,  G01F15/18 ,  B05C5/02 ,  B05C11/10

CPC classification number: G01F1/56 ,  B05C5/02 ,  B05C5/027 ,  B05C11/1007 ,  B05C11/1013 ,  B05C11/1021 ,  B05C11/1042 ,  B05C11/1044 ,  C09J5/00 ,  G01F3/10 ,  G01F15/185 ,  G05D16/06

Abstract: A hot melt adhesive system includes an adhesive supply for receiving solid or semi-solid hot melt adhesive, and a heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive into liquid hot melt adhesive. An adhesive tracking system monitors an output of the liquid hot melt adhesive, and includes a flow meter having a flow inlet and a flow outlet. The flow meter measures an amount of the adhesive flowing out of the flow outlet. A product detector may be used to sense a presence of a product to which the adhesive is applied. A controller then determines the total amount of the liquid adhesive dispensed and the average amount of liquid adhesive dispensed per product.

公开(公告)号：US09289794B2

公开(公告)日：2016-03-22

申请号：US13928604

申请日：2013-06-27

Applicant: International Business Machines Corporation

Inventor： Urs T Duerig ,  Robert Lovchik

IPC: B05C3/02 ,  B05D1/18 ,  G01N27/447 ,  B05C11/10 ,  G01Q60/42 ,  G01Q80/00

CPC classification number: C23C2/04 ,  B05C3/02 ,  B05C11/1007 ,  B05D1/18 ,  G01N27/447 ,  G01Q60/42 ,  G01Q80/00

Abstract: The present invention is notably directed to a microfluidic surface processing device including a microfluidic probe head with at least one aperture, on a face, including at least an outlet aperture; and a surface processing structure extending outward and perpendicular with respect to the face, the processing structure being further dimensioned and located with respect to the outlet aperture such that it can intercept a flowpath of liquid dispensed via the outlet aperture. The present invention is further directed to related apparatuses and methods.

Abstract translation: 本发明特别涉及一种微流体表面处理装置，其包括具有至少一个孔的微流体探针头，其表面包括至少一个出口孔; 以及相对于所述面向外且垂直延伸的表面处理结构，所述处理结构相对于所述出口孔进一步确定尺寸并定位成使得其可以拦截经由所述出口孔分配的液体的流路。 本发明进一步涉及相关的装置和方法。

公开(公告)号：US09200741B2

公开(公告)日：2015-12-01

申请号：US13799737

申请日：2013-03-13

Applicant: Nordson Corporation

Inventor： Benjamin J. Bondeson ,  Peter W. Estelle ,  Kent Hand

IPC: B67D7/80 ,  F16L53/00 ,  B05C11/10

CPC classification number: B05C11/1042 ,  B05C11/1002 ,  B05C11/1007 ,  F16L53/00 ,  Y10T137/0391 ,  Y10T137/6416

Abstract: An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.

Abstract translation: 粘合剂分配系统被配置为自动降低粘合剂材料的温度，以减少由于在低生产量期间将粘合剂保持在施加温度下导致的粘合剂降解。 为此，系统的控制器操作加热器单元以将单元设定点温度保持在热和熔融粘合剂中，直到从填充系统最近向系统供应粘合剂而经过设定的阈值时间。 一旦从最近的粘合剂供应超过设定的阈值时间过去的时间，加热器单元的温度降低以降低粘合剂的温度。 这种降低是足够大的温度以使降解和脱气最小化，但足够小以便在新的粘合剂出现之后能够实现快速的预热时间。

公开(公告)号：US20140116525A1

公开(公告)日：2014-05-01

申请号：US13799737

申请日：2013-03-13

Applicant: NORDSON CORPORATION

Inventor： Benjamin J. Bondeson ,  Peter W. Estelle ,  Kent Hand

IPC: F16L53/00

CPC classification number: B05C11/1042 ,  B05C11/1002 ,  B05C11/1007 ,  F16L53/00 ,  Y10T137/0391 ,  Y10T137/6416

Abstract: An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.

Abstract translation: 粘合剂分配系统被配置为自动降低粘合剂材料的温度，以减少由于在低生产量期间将粘合剂保持在施加温度下导致的粘合剂降解。 为此，系统的控制器操作加热器单元以将单元设定点温度保持在热和熔融粘合剂中，直到从填充系统最近向系统供应粘合剂而经过设定的阈值时间。 一旦从最近的粘合剂供应超过设定的阈值时间过去的时间，加热器单元的温度降低以降低粘合剂的温度。 这种降低是足够大的温度以使降解和脱气最小化，但足够小以便在新的粘合剂出现之后能够实现快速的预热时间。

公开(公告)号：US20140014683A1

公开(公告)日：2014-01-16

申请号：US13548548

申请日：2012-07-13

Applicant: Jeffrey E. Owen ,  Michael A. Fornes

Inventor： Jeffrey E. Owen ,  Michael A. Fornes

IPC: B67D1/00 ,  B67D7/80

CPC classification number: B05C5/027 ,  B05C11/1007 ,  B05C11/1042 ,  B05C11/1044

Abstract: A hot melt adhesive dispensing unit includes an adhesive supply for receiving solid or semi-solid hot melt adhesive material, an adhesive supply heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive material into a liquid hot melt adhesive material, a manifold connected to the adhesive supply, a pump connected to the manifold for pumping the liquid hot melt adhesive from the adhesive supply into the manifold, a controller connected to the adhesive supply heater and the pump, and a user interface connected to the controller. The user interface is for providing information about and control over heating and pumping functions of the hot melt adhesive dispensing unit, and the controller controls the adhesive supply heater and the pump.

Abstract translation: 热熔粘合剂分配单元包括用于接收固体或半固体热熔粘合剂材料的粘合剂供应源，与粘合剂供应器相关联的粘合剂供应加热器，用于将固体或半固体热熔粘合剂材料熔化成液体热熔粘合剂材料 连接到粘合剂供应源的歧管，连接到歧管的泵，用于将液体热熔粘合剂从粘合剂供应泵送到歧管中，连接到粘合剂供应加热器和泵的控制器以及连接到控制器的用户界面 。 用户界面用于提供关于热控胶水分配单元的加热和抽吸功能的信息，并且控制器控制粘合剂供应加热器和泵。

公开(公告)号：US20120107486A1

公开(公告)日：2012-05-03

申请号：US12997501

申请日：2010-11-05

Applicant: Chengming He ,  Chien-Pang Lee ,  Yu-wu Huang

Inventor： Chengming He ,  Chien-Pang Lee ,  Yu-wu Huang

IPC: C23C16/52 ,  B67D7/80 ,  H05B1/02 ,  B05C11/00

CPC classification number: B05C5/001 ,  B05C5/02 ,  B05C11/1007

Abstract: The present invention provides a sealant coating device having a sealant receiving chamber and a nozzle formed on a lower portion of the sealant receiving chamber. The sealant coating device further has a heating device, and the heating device is installed around the sealant receiving chamber for heating a sealant material filled in the sealant receiving chamber. The present invention further provides a dispensing method of the sealant coating device, which has the following steps of: obtaining time during the sealant material stays in the sealant receiving chamber; calculating a target temperature of the sealant material according to the obtained time and a desired sealant viscosity value; heating the sealant material to the target temperature. The advantages of the present invention are to use the heating device to lower the sealant viscosity based on the characteristic of the sealant viscosity varied with the temperature. In a case that the sealant material stays in the sealant receiving chamber a period of time to cause the raise of the sealant viscosity, the heating device can be automatically started to lower the actual sealant viscosity to constantly keep in the desired sealant viscosity.

Abstract translation: 本发明提供了一种密封剂涂布装置，其具有形成在密封剂容纳室的下部的密封剂接收室和喷嘴。 密封剂涂布装置还具有加热装置，并且加热装置安装在密封剂接收室周围，用于加热填充在密封剂接收室中的密封材料。 本发明还提供一种密封剂涂布装置的分配方法，其具有以下步骤：在密封剂材料停留在密封剂接收室期间获得时间; 根据获得的时间计算密封剂材料的目标温度和期望的密封剂粘度值; 将密封材料加热至目标温度。 本发明的优点是根据随着温度变化的密封剂粘度的特性，使用加热装置降低密封剂粘度。 在密封剂材料在密封剂接收室中停留一段时间以使密封剂粘度升高的情况下，可以自动启动加热装置以降低实际的密封剂粘度，以始终保持期望的密封剂粘度。

公开(公告)号：US20110247552A1

公开(公告)日：2011-10-13

申请号：US13165188

申请日：2011-06-21

Applicant: Chih-Hao Huang

Inventor： Chih-Hao Huang

IPC: B05C11/10

CPC classification number: B05C9/06 ,  B05B12/084 ,  B05B12/10 ,  B05C11/1005 ,  B05C11/1007 ,  B05D1/02 ,  B05D1/26 ,  B05D1/36 ,  B05D5/00

Abstract: An apparatus for coating a film on a substrate are presented. According to principle of the invention, firstly, a control device controls a first coating device to spray a coating solution onto the substrate. Then, a sensor monitors viscosity data of the coating solution presented between the first coating device and the substrate during movement of the first coating device and sends the viscosity data to the control device, or the sensor monitors viscosity data of the coating solution coated on the substrate and sends the viscosity data to the control device. Lastly, the control device controls a second coating device to spray a coating solution onto the substrate after the first coating device according to signals about the viscosity data from the control device.

Abstract translation: 提出了一种在基片上涂覆薄膜的设备。 根据本发明的原理，首先，控制装置控制第一涂布装置将涂布溶液喷涂到基材上。 然后，传感器监测在第一涂布装置移动期间在第一涂布装置和基板之间呈现的涂布溶液的粘度数据，并将粘度数据发送到控制装置，或者传感器监测涂覆在涂布装置上的涂布溶液的粘度数据 将粘度数据发送到控制装置。 最后，控制装置根据关于来自控制装置的粘度数据的信号，控制第二涂布装置在第一涂布装置之后将涂布溶液喷涂到基材上。