公开(公告)号：US5556023A

公开(公告)日：1996-09-17

申请号：US332488

申请日：1994-10-31

Applicant: Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

Inventor： Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

IPC: B23K3/06 ,  B23K35/02 ,  B23K35/36 ,  H01L23/495 ,  H05K3/28 ,  H05K3/34 ,  B23K1/20

CPC classification number: H05K3/282 ,  B23K3/0607 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/3615 ,  H01L23/49582 ,  H05K3/3484 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2924/0002 ,  H05K2201/10984 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0522 ,  H05K2203/0557 ,  H05K2203/0591 ,  H05K2203/124 ,  Y10T428/12556

Abstract: A method is available for forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts which is capable of forming a precise and fine pattern. The method comprises selectively imparting tackiness to only a predetermined part of the metallic surface by use of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract translation: 可以在诸如印刷电路板的金属电路板的焊盘和能够形成精确和精细图案的电子部件的引线框架的金属表面上形成焊接膜的方法。 该方法包括通过使用粘性层形成溶液选择性地赋予金属表面的预定部分的粘性，将粉末焊料粘附到所得粘性部分上，然后通过加热熔化焊料从而形成焊料膜。

公开(公告)号：US5542600A

公开(公告)日：1996-08-06

申请号：US232022

申请日：1994-04-26

Applicant: Shigeki Kobayashi ,  Norihito Yamamoto

Inventor： Shigeki Kobayashi ,  Norihito Yamamoto

IPC: B23K1/00 ,  B23K3/03 ,  B23K3/08 ,  B25J9/16 ,  G05B19/418 ,  H05K13/04 ,  H05K13/08 ,  B23K1/19

CPC classification number: H05K13/0486 ,  B23K1/0016 ,  B23K3/033 ,  B23K3/08 ,  B25J9/16 ,  G05B19/41865 ,  G05B19/41875 ,  G05B19/41885 ,  H05K13/08 ,  B23K2201/42 ,  G05B2219/31096 ,  G05B2219/31296 ,  G05B2219/31355 ,  G05B2219/31446 ,  G05B2219/32121 ,  G05B2219/32127 ,  G05B2219/32145 ,  G05B2219/32146 ,  G05B2219/32147 ,  G05B2219/32148 ,  G05B2219/32151 ,  G05B2219/32173 ,  G05B2219/32174 ,  G05B2219/32175 ,  G05B2219/32186 ,  G05B2219/32192 ,  G05B2219/32229 ,  G05B2219/32231 ,  G05B2219/32232 ,  G05B2219/45235 ,  G05B2219/50064 ,  Y02P90/04 ,  Y02P90/10 ,  Y02P90/20 ,  Y02P90/22 ,  Y02P90/26 ,  Y02P90/265

Abstract: Soldering condition information such as the position and angle of a soldering iron, amount of solder supplied and heating time is stored beforehand, for each grouping of parts, in a part classification table (26) for soldering purposes. Parts to be mounted on a board are stored, in correspondence with the board ID, on a floppy disk of a floppy disk device (24). When the board ID is entered, the parts to be mounted on the board are displayed on a display unit (23). The operator reads out the part classification table (26) for soldering purposes and designates soldering correction information that corresponds to the part groups to which the parts belong. As a result, a teach-data table (27) in which soldering condition information has been stored in correspondence with the parts is created. Soldering is executed automatically in accordance with the teach-data table (27).

Abstract translation: PCT No.PCT / JP92 / 01448 Sec。 371日期1994年04月26日 102（e）日期1994年4月26日PCT提交1992年11月9日PCT公布。 出版物WO93 / 09654 日期1993年5月13日焊接条件信息如烙铁的位置和角度，供应的焊料量和加热时间预先存储在用于焊接目的的部件分类表（26）中。 将要安装在板上的部件与板ID相对应地存储在软盘设备（24）的软盘上。 当输入板ID时，将要安装在板上的部件显示在显示单元（23）上。 操作人员为了焊接目的读出零件分类表（26），并指定与零件所属部件组对应的焊接修正信息。 结果，产生了与部件对应地存储焊接条件信息的教学数据表（27）。 根据教学数据表（27）自动执行焊接。

公开(公告)号：US5425495A

公开(公告)日：1995-06-20

申请号：US239004

申请日：1994-05-06

Applicant: David E. Gibson

Inventor： David E. Gibson

IPC: B23K3/00 ,  B23K1/08 ,  B23K3/06 ,  H05K3/22 ,  H05K3/34 ,  B23K1/20

CPC classification number: B23K3/0653 ,  H05K3/227 ,  B23K2201/42

Abstract: A hot air circulation apparatus and method for wave soldering machines which heats air from a high-pressure air source and directs it at the flux applied to a printed circuit board. The heated and pressurized air also circulates air within the wave soldering machine to force the moisture out. A plurality of hot air knives are mounted adjacent heaters within the wave soldering machine and are coupled to the pressurized air source. The hot air knives include a hollow metal cylindrical member which conducts heat from the heater, and contain a plurality of orifices which increase the pressure of the air and direct the air at the flux.

Abstract translation: 一种用于波峰焊机的热空气循环装置和方法，其从高压空气源加热空气并将其引导到施加到印刷电路板的通量。 加热和加压的空气还在波峰焊机内循环空气以迫使水分流出。 多个热风刀片安装在波峰焊机附近的加热器附近，并与加压空气源相连。 热风刀包括从加热器传导热量的中空金属圆柱形构件，并且容纳多个孔，其增加空气的压力并将空气引导至通量。

公开(公告)号：US5401380A

公开(公告)日：1995-03-28

申请号：US95139

申请日：1993-07-20

Applicant: D. Morgan Tench ,  Dennis P. Anderson

Inventor： D. Morgan Tench ,  Dennis P. Anderson

IPC: G01N27/42 ,  B23K1/20 ,  G01N27/416 ,  G01N27/26

CPC classification number: G01N27/4161 ,  B23K1/206 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2203/0315 ,  H05K2203/1157

Abstract: Apparatus for assessing solderability of electronic component leads and printed wiring boards by sequential electrochemical reduction. The apparatus detects and quantifies the oxides present on copper, solder, andintermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability. The apparatus is useful for testing off-the-shelf components and for control of circuit board manufacturing and assembly processes.

Abstract translation: 用于通过连续电化学还原来评估电子元件引线和印刷电路板的可焊性的装置。 该装置检测并量化对可焊性有害的铜，焊料和金属间化合物上存在的氧化物。 要测试的部件的可焊接部分浸入电解质中以形成电极。 惰性对电极和参比电极也放置在电解质中。 电流从惰性对电极传递到测试部件，并且部件和参考电极之间的电位作为时间的函数被记录。 在电极电位与通过的总电荷的图中，一系列拐点识别并定量存在于焊料上的特定金属氧化物。 将该图与先前对具有与可焊性劣化相关的氧化物组成的老化样品的分析进行比较。 该设备可用于测试现成的组件和控制电路板的制造和组装过程。

公开(公告)号：US5390845A

公开(公告)日：1995-02-21

申请号：US903450

申请日：1992-06-24

Applicant: Martin G. McDonald

Inventor： Martin G. McDonald

IPC: B23K31/02 ,  B23K35/26 ,  B23K35/38 ,  H05K3/34 ,  B23K1/00

CPC classification number: C22C13/00 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/28 ,  B23K35/30 ,  B23K35/362 ,  B23K35/38 ,  B23K35/383 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/087

Abstract: A process for wave soldering or reflow soldering comprises contacting substrates with a supply of molten solder containing from about 0.0001 to about 0.1% by weight of phosphorous in an atmosphere of diluent gas containing up to about 0.1% by volume oxygen. A reduced incidence of bridging and other soldering defects occurs.

Abstract translation: 用于波峰焊接或回流焊接的方法包括在含有至多约0.1体积％氧气的稀释气体的气氛中使基材与含有约0.0001至约0.1重量％的磷的熔融焊料的供应接触。 发生桥接和其他焊接缺陷的发生率降低。

公开(公告)号：US5388752A

公开(公告)日：1995-02-14

申请号：US153999

申请日：1993-11-18

Applicant: Ichiro Kawakatsu

Inventor： Ichiro Kawakatsu

IPC: B23K1/08 ,  B23K31/02 ,  H05K3/34

CPC classification number: B23K1/085 ,  B23K2201/42

Abstract: A method and apparatus for soldering a workpiece in a non-oxidizing gas are achieved by comprising conveyors running in a substantially horizontal direction, for holding and moving a workpiece in the horizontal direction, a flux supplying unit for supplying flux to the workpiece, a solder bath including solder and disposed under the conveyors such that the workpiece with a parting portion parting from the top of solder flow is dipped in the top of solder flow, and jetting unit provided at an exit side of the solder bath with respect to the conveyors and connected to a non-oxidizing gas source, for jetting non-oxidizing gas from the non-oxidizing gas source into a region defined by the parting portion of the workpiece and a vicinity thereof.

Abstract translation: 一种用于在非氧化性气体中焊接工件的方法和设备通过包括在大致水平方向上延伸的输送机，用于在水平方向上保持和移动工件，通量供应单元，用于向工件供应助焊剂，焊料 包括焊料并设置在输送机下方，使得具有与焊料流动顶部分离的分离部分的工件浸入焊料流动的顶部，以及设置在焊料槽相对于输送机的出口侧的喷射单元， 连接到非氧化性气体源，用于将非氧化性气体源从非氧化性气体源喷射到由工件的分离部分及其附近限定的区域中。

公开(公告)号：US5332145A

公开(公告)日：1994-07-26

申请号：US73157

申请日：1993-06-07

Applicant: David R. Bell ,  Paul V. Brownell

Inventor： David R. Bell ,  Paul V. Brownell

IPC: B23K1/20 ,  H05K3/34

CPC classification number: B23K1/203 ,  B23K2201/42 ,  H05K3/3489

Abstract: The invention provides a method that can be used online in a continuous printed circuit soldering process to measure and control the composition of soldering fluxes, in particular low-solids fluxes that utilize a solvent with a specific gravity close to the specific gravity of the flux composition. Samples of the flux are analyzed by ultra-violet absorption to determine solvent content and, based on this analysis, make up solvent is added to the flux composition to maintain a steady state composition.

Abstract translation: 本发明提供了一种可以在连续印刷电路焊接工艺中在线使用的方法，以测量和控制助焊剂的组成，特别是利用比重接近焊剂组合物的比重的溶剂的低固体熔剂 。 通过紫外吸收分析通量的样品以确定溶剂含量，并且基于该分析，将补充溶剂加入到助熔剂组合物中以保持稳态组成。

公开(公告)号：US5303824A

公开(公告)日：1994-04-19

申请号：US985397

申请日：1992-12-04

Applicant: Harold Kohn

Inventor： Harold Kohn

IPC: B23K3/08 ,  H05K3/34 ,  B65D85/62

CPC classification number: B23K3/08 ,  B23K2201/42 ,  H05K3/3478 ,  Y10S206/821

Abstract: Clear thermoplastic is vacuum molded to produce rectangular, frustro-pyramidal shaped cavities in a horizontal matrix for holding rectangular solder preforms. No-clean flux liquid is dispensed onto a preform placed in each cavity, then another holder is placed upside-down on the first holder, the holders are flipped and then no-clean flux liquid is dispensed on the dry side of the preform. Holes in the cavity bottoms drain and circulate drying air to the preform bottoms. A hole in one corner and a different width slot in an opposite corner of each holder, allow multiple holders to be stacked on a bottom frame with different sized threaded posts. An empty holder and then a dust cover are stacked on the posts to hold and protect the preforms. A top frame is stacked on the posts and nuts are screwed onto the posts to form a carrier. The cavities are sized relative to the preforms to hold the preforms in position during carrier transport. The holders are unstacked and each positioned at a station with different sized posts on a rotating table of a pick-and-place machine. A robot arm with rubber tipped vacuum probe picks up the preforms and places them on a circuit board. Grippers on the arm are used to move a heated component on top of the preform for reflow soldering. The circuit board can be used without cleaning with solvents or CFC's.

Abstract translation: 透明热塑性塑料被真空模制成在水平矩阵中产生用于保持矩形焊料预成型件的矩形，截头棱锥形的空腔。 将不清洁助焊剂液体分配到放置在每个空腔中的预制件上，然后将另一个保持器倒置放置在第一保持器上，保持器翻转，然后将不清洁的助焊剂液体分配在预成型件的干燥侧。 空腔底部的孔排出并将干燥空气循环到预制件底部。 一个角落中的一个孔和每个支架的相对角中的不同宽度的槽，允许多个支架以不同尺寸的螺纹柱堆叠在底架上。 一个空的支架，然后一个防尘罩堆叠在支柱上，以保持和保护预制件。 顶部框架堆叠在柱上，螺母拧到柱上以形成载体。 空腔相对于预成型件的尺寸设定，以便在载体输送期间将预成型件保持在适当的位置。 支架被拆开，并且每个位于位于拾取和放置机器的旋转台上的具有不同尺寸的柱的工位。 具有橡胶尖端真空探头的机器人臂拾起预成型件并将其放置在电路板上。 臂上的夹爪用于将加热的部件移动到预制件的顶部以进行回流焊接。 可以使用电路板，不用溶剂或CFC进行清洁。

公开(公告)号：US5262022A

公开(公告)日：1993-11-16

申请号：US706142

申请日：1991-05-28

Applicant: D. Morgan Tench ,  Dennis P. Anderson

Inventor： D. Morgan Tench ,  Dennis P. Anderson

IPC: G01N27/42 ,  B23K1/20 ,  G01N27/416 ,  G01N27/26

CPC classification number: G01N27/4161 ,  B23K1/206 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2203/0315 ,  H05K2203/1157

Abstract: A sequential electrochemical reduction method and apparatus for assessing solderability of electronic component leads and printed wiring boards. The method detects and quantifies the oxides present on copper, solder, and intermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability. The method is useful for testing off-the-shelf components and for control of circuit board manufacturing and assembly processes.

Abstract translation: 用于评估电子元件引线和印刷线路板的可焊性的顺序电化学还原方法和装置。 该方法检测和量化铜，焊料和金属间化合物上存在的对可焊性有害的氧化物。 要测试的部件的可焊接部分浸入电解质中以形成电极。 惰性对电极和参比电极也放置在电解质中。 电流从惰性对电极传递到测试部件，并且部件和参考电极之间的电位作为时间的函数被记录。 在电极电位与通过的总电荷的图中，一系列拐点识别并定量存在于焊料上的特定金属氧化物。 将该图与先前对具有与可焊性劣化相关的氧化物组成的老化样品的分析进行比较。 该方法可用于测试现成的组件和控制电路板的制造和组装过程。

公开(公告)号：US5229016A

公开(公告)日：1993-07-20

申请号：US742362

申请日：1991-08-08

Applicant: Donald J. Hayes ,  Michael T. Boldman ,  David B. Wallace

Inventor： Donald J. Hayes ,  Michael T. Boldman ,  David B. Wallace

IPC: B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0623 ,  B23K2201/42 ,  H05K3/3457

Abstract: A method and apparatus for producing solidified solder balls and for ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to impact on a surface to be wetted is disclosed. The apparatus comprises a preload reservoir to hold and maintain solder in a liquid state, an ejection chamber to hold and maintain the solder in a liquid state, a connection between the preload reservoir and the ejection chamber to allow liquid solder in the preload reservoir to be transferred to the ejection chamber while maintaining the oxides in the preload reservoir, a device to pressurize the ejection chamber with an inert gas and an ejection device operatively connected to receive liquid solder from the ejection chamber and to eject generally spherical-shaped drops of liquid solder to a specific location on a surface to be wetted. Structure is included to provide an atmosphere of inert gas between the ejection device and the specific location on a surface to be wetted.The method includes the steps of maintaining solder in a liquid state in a reservoir, transferring solder in the liquid state from the reservoir to an ejection chamber, maintaining the transferred solder in a liquid state in the ejection chamber, pressurizing the ejection chamber with an inert gas, transferring solder in the liquid state from the ejection chamber to an ejection device, ejecting generally spherical-shaped drops of liquid solder from said ejection device to a specific location on a surface to be wetted. An atmosphere of inert gas is provided between the ejection device and the specific location on a surface to be wetted.

Abstract translation: 公开了一种用于生产固化的焊球并通过可控气氛喷射大致球形的液体焊料滴以冲击待润湿的表面的方法和装置。 该装置包括用于保持和保持处于液态的焊料的预载储存器，用于保持和保持焊料处于液态的喷射室，预负载储存器和喷射室之间的连接，以允许预负载储存器中的液体焊料为 转移到喷射室，同时保持预压储存器中的氧化物，用惰性气体对喷射室加压的装置和可操作地连接以从喷射室接收液体焊料并喷射大致球形的液体焊料滴的装置 到要润湿的表面上的特定位置。 包括结构以在喷射装置和待润湿的表面上的特定位置之间提供惰性气体的气氛。 该方法包括以下步骤：在储存器中保持处于液态的焊料，将液态的焊料从贮存器转移到喷射室，将转移的焊料保持在喷射室中的液态，并以惰性的方式对喷射室加压 气体，将液体状态的焊料从喷射室传送到喷射装置，将大致球形的液体焊料液滴从所述喷射装置喷射到待润湿的表面上的特定位置。 在喷射装置和待润湿表面上的特定位置之间设置惰性气体气氛。