公开(公告)号：US4604966A

公开(公告)日：1986-08-12

申请号：US786225

申请日：1985-10-10

Applicant: Harold Kohn

Inventor： Harold Kohn

IPC: B23K3/06 ,  B41F15/08 ,  H05K3/12 ,  H05K3/24 ,  H05K3/34 ,  B05C5/02

CPC classification number: H05K3/1233 ,  H05K2203/0134

Abstract: Apparatus for applying solder paste to printed circuit boards ("PCB's") in a continuous operation. A drum containing solder paste is positioned over a work station and has an outlet slot through which the solder paste can be discharged onto the surface of a PCB as it advances through the work station. A stencil formed with a desired pattern for application of the solder paste to the PCB is rotatably mounted on the outer surface of the drum and overlies the outlet slot. Gravity, machine vibration, and, if desired, air pressure are effective to discharge the solder paste onto the PCB with the aid of a resilient squeegee pad adjacent the outlet slot. A drive mechanism directly couples the translational movement of the PCB through the work station with the rotational movement of the stencil at the work station.

Abstract translation: 用于在连续操作中将焊膏施加到印刷电路板（“PCB”）的装置。 含有焊锡膏的滚筒位于工作台上，并具有一个出口槽，当焊膏前进通过工作台时，焊膏可以通过该出口狭缝排出到PCB的表面上。 形成有用于将焊膏施加到PCB的期望图案的模板可旋转地安装在滚筒的外表面上并且覆盖在出口槽上。 重力，机器振动，如果需要，空气压力有助于借助于邻近出口槽的弹性刮板将电极膏放电到PCB上。 驱动机构通过工作站上的模板的旋转运动直接将PCB的平移运动通过工作站耦合。

公开(公告)号：US4415113A

公开(公告)日：1983-11-15

申请号：US223191

申请日：1981-01-07

Applicant: David E. Houser ,  Harold Kohn ,  Gordon L. Williams

Inventor： David E. Houser ,  Harold Kohn ,  Gordon L. Williams

IPC: B23P21/00 ,  B23P19/02 ,  H01L23/50 ,  H05K13/04 ,  B27F7/00

CPC classification number: H05K13/0478 ,  Y10S91/04

Abstract: Multiple pins are affixed in the holes of a ceramic substrate by simultaneously impacting the pins with a piston assembly which temporarily places the pins in a viscoelastic fluid state. Upon return of the pins and the resultant fluid flow to its undisturbed solid state, each pin is left with an extension that is in interlocking engaged relationship with the ceramic particles of the substrate in the region surrounding the particular holes in which the pins have been located.The piston assembly is driven by a pneumatic high pressure system which is adjustable to the number of pins being simultaneously impacted. Release of the piston assembly is delayed until the air pressure becomes stabilized prior to impact. A vacuum pressure system returns the piston to its originating position after impact whereupon the piston assembly is ready for the next impact cycle.

Abstract translation: 通过同时用活塞组件冲击销来将多个销固定在陶瓷基板的孔中，该活塞组件暂时将销钉置于粘弹性流体状态。 在销的返回和所得到的流体流动到其未受干扰的固体状态时，每个销留下一个延伸部分，该延伸部分在包围销已经位于的特定孔的区域中与衬底的陶瓷颗粒成啮合关系 。 活塞组件由气动高压系统驱动，气动高压系统可以调节以同时受到冲击的销数量。 活塞组件的释放被延迟直到气压在冲击之前变得稳定。 真空压力系统在冲击后将活塞返回到其起始位置，随后活塞组件准备好进行下一个冲击循环。

公开(公告)号：US20050137225A1

公开(公告)日：2005-06-23

申请号：US11057748

申请日：2005-02-14

Applicant: Harold Kohn ,  T. Harden ,  Myoung Kim ,  Erik Bodor

Inventor： Harold Kohn ,  T. Harden ,  Myoung Kim ,  Erik Bodor

IPC: A61P25/28 ,  C07D471/08 ,  C07D451/02 ,  A61K31/46

CPC classification number: C07D471/08

Abstract: The present invention discloses novel cholinergic receptor ligands. The present invention also relates to the synthesis of substituted derivatives of aza-bridged bicyclic amines for use as muscarinic receptor ligands as well as methods of regulating function of certain cholinergic receptors, and hence acting as antagonists, agonists and partial agonists at certain specific cholinergic receptor subtypes. The present invention also relates to methods for treating disorders associated with cholinergic receptors.

公开(公告)号：US06875774B2

公开(公告)日：2005-04-05

申请号：US10213428

申请日：2002-08-06

Applicant: Harold Kohn ,  T. Kendall Harden ,  Myoung Goo Kim ,  Erik Bodor

Inventor： Harold Kohn ,  T. Kendall Harden ,  Myoung Goo Kim ,  Erik Bodor

IPC: A61P25/28 ,  C07D471/08 ,  A61K31/44

CPC classification number: C07D471/08

Abstract: The present invention discloses novel cholinergic receptor ligands. The present invention also relates to the synthesis of substituted derivatives of aza-bridged bicyclic amines for use as muscarinic receptor ligands as well as methods of regulating function of certain cholinergic receptors, and hence acting as antagonists, agonists and partial agonists at certain specific cholinergic receptor subtypes. The present invention also relates to methods for treating disorders associated with cholinergic receptors.

Abstract translation: 本发明公开了新型胆碱能受体配体。 本发明还涉及用作毒蕈碱受体配体的氮杂桥连双环胺的取代衍生物的合成以及调节某些胆碱能受体功能的方法，并因此在某些特定胆碱能受体上作为拮抗剂，激动剂和部分激动剂 亚型 本发明还涉及治疗与胆碱能受体相关的疾病的方法。

公开(公告)号：US5773475A

公开(公告)日：1998-06-30

申请号：US818688

申请日：1997-03-17

Applicant: Harold Kohn

Inventor： Harold Kohn

IPC: C07C237/06 ,  C07C237/52 ,  A61K31/16 ,  A61K31/165 ,  C07C233/05

CPC classification number: C07C237/06 ,  C07C237/52

Abstract: The present invention is directed to a compound in the R configuration about the asymmetric carbon in the following formula: ##STR1## pharmaceutical compositions containing same and the use thereof in treating CNS disorders in animals.

Abstract translation: 本发明涉及下述结构中关于不对称碳的R构型的化合物：含有其的药物组合物及其在治疗动物中的CNS紊乱中的用途。

公开(公告)号：US5170931A

公开(公告)日：1992-12-15

申请号：US644528

申请日：1991-01-23

Applicant: Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

Inventor： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC: H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15321 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template having a pattern of openings corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

公开(公告)号：US20060128681A1

公开(公告)日：2006-06-15

申请号：US10520778

申请日：2003-06-30

Applicant: Harold Kohn ,  Thomas Weber ,  William Widger

Inventor： Harold Kohn ,  Thomas Weber ,  William Widger

IPC: A61K31/555 ,  A61K31/28 ,  A61K31/315 ,  A61K31/295

CPC classification number: A61K31/555 ,  A61K31/28 ,  A61K31/315 ,  A61K33/24 ,  Y02A50/473 ,  A61K2300/00

Abstract: Rho is an enzyme essential for the growth and survival of Escherichia coli, and bicyclomycin is its only known selective inhibitor. The site and pathway of rho inhibition by the putative metal thiol chelates are disclosed. Additionally compositions and methods of divalent metals and compounds containing a thiol group are disclosed.

Abstract translation: Rho是大肠杆菌生长和存活所必需的酶，双环霉素是唯一已知的选择性抑制剂。 公开了由推定的金属硫醇螯合物抑制rho的位点和途径。 另外公开了二价金属的组成和方法以及含有硫醇基的化合物。

公开(公告)号：US6048899A

公开(公告)日：2000-04-11

申请号：US107206

申请日：1998-06-29

Applicant: Harold Kohn ,  Shridhar V. Andurkar

Inventor： Harold Kohn ,  Shridhar V. Andurkar

IPC: C07C237/06 ,  C07C237/52 ,  A61K31/16 ,  A61K31/165 ,  C07C233/05 ,  C07C235/06

CPC classification number: C07C237/52 ,  C07C237/06

Abstract: The present invention is directed to N-benzyl-2-amino-3-methoxypropionamide and stereoisomers the use thereof anti-convulsant and an intermediate in the preparation of other anti-convulsants.

Abstract translation: 本发明涉及N-苄基-2-氨基-3-甲氧基丙酰胺及其立体异构体，其用于抗惊厥药和制备其它抗惊厥药的中间体。

公开(公告)号：US5479703A

公开(公告)日：1996-01-02

申请号：US309777

申请日：1994-09-21

Applicant: Kishor V. Desai ,  Harold Kohn ,  Richard C. Senger ,  Donald P. Seraphim

Inventor： Kishor V. Desai ,  Harold Kohn ,  Richard C. Senger ,  Donald P. Seraphim

IPC: B42D15/10 ,  G06K19/077 ,  H01L21/48 ,  H01L23/538 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/34

CPC classification number: H05K3/462 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/5384 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2203/0338 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K3/20 ,  H05K3/205 ,  H05K3/28 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/423 ,  H05K3/4623 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165

Abstract: A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of electrically insulating material attached on both sides thereof. The circuitized power cores also include a plurality of plated through holes formed therethrough in substantially the same pattern on each circuitized power core. The circuitized power cores are parallel to each other such that corresponding plated through holes in the two circuitized power cores are co-linear. A plurality of substantially spherical balls are located between the circuitized power cores and are in contact with the corresponding plated through holes on facing cards. The balls have a diameter slightly larger than the opening of the plated through holes and are made of an electrically conductive material.

Abstract translation: 一种多层印刷电路板或卡片，包括多个电路化的电源核心，电路化的电源核心包括一层导电材料，其上具有一层电绝缘材料，该电绝缘材料层在其两侧。 电路化的功率核心还包括在每个电路化的功率核心上以基本上相同的图案形成的多个电镀通孔。 电路化的功率核心彼此平行，使得两个电路化的功率核心中相应的电镀通孔是共线的。 多个基本上球形的球位于电路化的功率核之间并且与相对的卡上的对应的电镀通孔接触。 球的直径略大于电镀通孔的开口，并且由导电材料制成。

公开(公告)号：US5303824A

公开(公告)日：1994-04-19

申请号：US985397

申请日：1992-12-04

Applicant: Harold Kohn

Inventor： Harold Kohn

IPC: B23K3/08 ,  H05K3/34 ,  B65D85/62

CPC classification number: B23K3/08 ,  B23K2201/42 ,  H05K3/3478 ,  Y10S206/821

Abstract: Clear thermoplastic is vacuum molded to produce rectangular, frustro-pyramidal shaped cavities in a horizontal matrix for holding rectangular solder preforms. No-clean flux liquid is dispensed onto a preform placed in each cavity, then another holder is placed upside-down on the first holder, the holders are flipped and then no-clean flux liquid is dispensed on the dry side of the preform. Holes in the cavity bottoms drain and circulate drying air to the preform bottoms. A hole in one corner and a different width slot in an opposite corner of each holder, allow multiple holders to be stacked on a bottom frame with different sized threaded posts. An empty holder and then a dust cover are stacked on the posts to hold and protect the preforms. A top frame is stacked on the posts and nuts are screwed onto the posts to form a carrier. The cavities are sized relative to the preforms to hold the preforms in position during carrier transport. The holders are unstacked and each positioned at a station with different sized posts on a rotating table of a pick-and-place machine. A robot arm with rubber tipped vacuum probe picks up the preforms and places them on a circuit board. Grippers on the arm are used to move a heated component on top of the preform for reflow soldering. The circuit board can be used without cleaning with solvents or CFC's.

Abstract translation: 透明热塑性塑料被真空模制成在水平矩阵中产生用于保持矩形焊料预成型件的矩形，截头棱锥形的空腔。 将不清洁助焊剂液体分配到放置在每个空腔中的预制件上，然后将另一个保持器倒置放置在第一保持器上，保持器翻转，然后将不清洁的助焊剂液体分配在预成型件的干燥侧。 空腔底部的孔排出并将干燥空气循环到预制件底部。 一个角落中的一个孔和每个支架的相对角中的不同宽度的槽，允许多个支架以不同尺寸的螺纹柱堆叠在底架上。 一个空的支架，然后一个防尘罩堆叠在支柱上，以保持和保护预制件。 顶部框架堆叠在柱上，螺母拧到柱上以形成载体。 空腔相对于预成型件的尺寸设定，以便在载体输送期间将预成型件保持在适当的位置。 支架被拆开，并且每个位于位于拾取和放置机器的旋转台上的具有不同尺寸的柱的工位。 具有橡胶尖端真空探头的机器人臂拾起预成型件并将其放置在电路板上。 臂上的夹爪用于将加热的部件移动到预制件的顶部以进行回流焊接。 可以使用电路板，不用溶剂或CFC进行清洁。