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    INFRARED DETECTOR AND PROCESS FOR FABRICATING THE SAME
    91.
    发明申请
    INFRARED DETECTOR AND PROCESS FOR FABRICATING THE SAME 审中-公开
    红外探测器及其制作方法

    公开(公告)号：WO2007060861A1

    公开(公告)日：2007-05-31

    申请号：PCT/JP2006/322688

    申请日：2006-11-08

    Applicant: MATSUSHITA ELECTRIC WORKS, LTD. ,  NISHIKAWA, Takayuki ,  SUMI, Sadayuki ,  KAMITSU, Tomohiro ,  TANIGUCHI, Ryo ,  HIRATA, Masaya ,  SATO, Shin

    Inventor： NISHIKAWA, Takayuki ,  SUMI, Sadayuki ,  KAMITSU, Tomohiro ,  TANIGUCHI, Ryo ,  HIRATA, Masaya ,  SATO, Shin

    IPC: G01J5/04 ,  H01L31/0203

    CPC classification number: H01L31/0203 ,  G01J1/02 ,  G01J1/0204 ,  G01J2001/0276 ,  H05K1/0218 ,  H05K1/185

    Abstract: An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.

    Abstract translation: 红外线检测器包括一个载有红外传感器元件和电子部件的电路块。 电路块由介电树脂层和形成有电路图案的第一基板和安装电子部件组成。 电介质树脂层在其顶部形成有凹部，凹部围绕其周边限定有用于支撑红外传感器的相对端的肩部。 将第一衬底集成到电介质树脂层的下端，其中至少一个电子部件被模制到电介质树脂层中，以使电路块具有统一的模具结构。 因此，将一部分或全部电子部件模制到电介质层中以实现简单和低轮廓结构的电路块，同时保持将红外传感器元件充分远离电子部件和相关电子电路的优点 从而确保得到结构简单，成本经济，红外检测可靠的红外检测器。

    RADIATION SENSOR DEVICE AND FLUID TREATMENT SYSTEM CONTAINING SAME
    93.
    发明申请
    RADIATION SENSOR DEVICE AND FLUID TREATMENT SYSTEM CONTAINING SAME 审中-公开
    辐射传感器装置和含有相同的流体处理系统

    公开(公告)号：WO2006002522A1

    公开(公告)日：2006-01-12

    申请号：PCT/CA2005/000994

    申请日：2005-06-27

    Applicant: TROJAN TECHNOLOGIES INC.

    Inventor： FRASER, Jim ,  DRAGOI, Catalina ,  GERARDI,Jennifer ,  MOLYNEUX, Tanya

    IPC: G01J1/00

    CPC classification number: C02F1/325 ,  A61L2/08 ,  A61L2/084 ,  A61L2/085 ,  A61L2/10 ,  C02F2201/326 ,  F28D15/0275 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0252 ,  G01J1/0271 ,  G01J1/429 ,  G01J2001/028 ,  G01N21/274 ,  G01N2201/127

    Abstract: The invention relates to a radiation sensor device comprising a housing, a radiation sensor secured with respect to a first portion of the housing and a heat pipe in thermal communication with the first portion of the housing, the heat pipe being configured to transfer heat from portion of the house to a second portion of the housing remote from the first portion of the housing. The heat pipe may be used advantageously to transport or transfer heat away from the sensor components of the device to an area remote therefrom. The heat pipe can be used to transfer heat at a rate that is thousands of times higher than copper. The radiation sensor device may be used in an ultraviolet radiation fluid treatment system such as an ultraviolet radiation water disinfection system.

    Abstract translation: 本发明涉及一种辐射传感器装置，其包括壳体，相对于壳体的第一部分固定的辐射传感器和与壳体的第一部分热连通的热管，该热管被配置为将热量从部分 的房屋的第二部分远离壳体的第一部分。 热管可以有利地用于将热量从设备的传感器部件传送或传递到远离其的区域。 热管可用于以比铜高出数千倍的速度传递热量。 辐射传感器装置可用于紫外线辐射水处理系统，例如紫外线辐射水消毒系统。

    METHOD AND APPARATUS FOR MONITORING THE POWER OF A MULTI-WAVELENGTH OPTICAL SIGNAL
    95.
    发明申请
    METHOD AND APPARATUS FOR MONITORING THE POWER OF A MULTI-WAVELENGTH OPTICAL SIGNAL 审中-公开
    用于监测多波长光信号功率的方法和装置

    公开(公告)号：WO03103203A2

    公开(公告)日：2003-12-11

    申请号：PCT/US0317523

    申请日：2003-06-04

    Applicant: HONEYWELL INT INC

    Inventor： GUENTER JAMES K ,  TATUM JIMMY A

    IPC: H04B10/08 ,  H04J14/00

    CPC classification number: G01J1/4257 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/32 ,  G01J1/4228 ,  G01J9/00 ,  H04B10/077 ,  H04B10/07955

    Abstract: Methods and apparatus for monitoring the power level of a multi-wavelength optical signal are provided, making use of a light detector comprising a first and a second absorbing layer having both the same conductivity type, and intermediate layer of a second conductivity type and means for providing an indication of a change in power of the first and/or the second wavelength of light as measured by the respective absorbing layers. Also provided are methods and apparatus for adjusting the power level of selected optical emitters to compensate for the changes in power levels. An optoelectronic transmitter for receiving electrical input signals and transmitting corresponding optical output signals in a common light beam comprises electrical modulators, optoelectronic emitters, an optical combiner, an optoelectronic detector, means for separating the signals detected by the detector, and means for adjusting the power of the optoelectronic emitters.

    Abstract translation: 提供了用于监测多波长光信号的功率电平的方法和装置，利用包括具有相同导电类型的第一和第二吸收层以及第二导电类型的中间层的光检测器，以及用于 提供由各个吸收层测量的第一和/或第二波长光的功率变化的指示。 还提供了用于调整所选择的光发射器的功率电平以补偿功率电平变化的方法和装置。 用于接收电输入信号并在公共光束中传输相应光输出信号的光电发射器包括电调制器，光电子发射器，光组合器，光电检测器，用于分离由检测器检测的信号的装置，以及用于调节功率的装置 的光电子发射器。

    光検出センサ
    96.
    发明申请
    光検出センサ 审中-公开
    光传感器

    公开(公告)号：WO2003087739A1

    公开(公告)日：2003-10-23

    申请号：PCT/JP2003/004638

    申请日：2003-04-11

    Applicant: 浜松ホトニクス株式会社 ,  北原 正 ,  野本 佳朗 ,  市川 典男

    Inventor： 北原 正 ,  野本 佳朗 ,  市川 典男

    IPC: G01J1/02

    CPC classification number: G01J1/02 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/429 ,  H01J40/04

    Abstract: 基板１８、陰極２０および陽極２２は、ケーシング１０により画成される空間に収容されており、空間は真空とされている。陰極２０及び陽極２２は、電気絶縁性を有する基板１８の同一面上に設けられ、互いに噛み合う櫛歯形状を呈している。このため、陰極２０と陽極２２とが近接する部分の面積は大きくなることとなり、紫外線の入射により陰極２０から放出された光電子は、真空中を伝わり陽極２２により良好に収集される。

    Abstract translation: 衬底（18），阴极（20）和阳极（22）容纳在由壳体（10）限定的空间中，并且空间被抽真空。 阴极（20）和阳极（22）设置在电绝缘基板（18）的同一面上，显示出梳齿齿指形状。 因此，阴极（20）靠近阳极（22）的部分的面积大，使得通过紫外线的入射从阴极（20）发射的光电子通过真空传播并被有利地被 阳极（22）。

    RADIANT ENERGY DETECTION APPARATUS
    98.
    发明申请
    RADIANT ENERGY DETECTION APPARATUS 审中-公开
    辐射能量检测装置

    公开(公告)号：WO1983000257A1

    公开(公告)日：1983-01-20

    申请号：PCT/US1982000898

    申请日：1982-07-06

    Applicant: BECKMAN INSTRUMENTS, INC.

    Inventor： BECKMAN INSTRUMENTS, INC. ,  KAYE, Wilbur, I.

    IPC: H01J40/14

    CPC classification number: H01L25/043 ,  G01J1/0204 ,  G01J1/0488 ,  G01J1/4228 ,  G01N21/255 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A radiant energy detector comprising a silicon photovoltaic detector (24) and a lead sulfide photoconductive detector (22) in a common optical path and each responsive to radiant energy in different wavelength intervals. The silicon detector (24) also serves as a filter for isolating the wavelengths of radiant energy reaching the lead sulfide detector (22).

    Abstract translation: 一种辐射能量检测器，其包括在普通光路中的硅光电检测器（24）和硫化铅光电检测器（22），并且每个响应于不同波长间隔的辐射能量。 硅检测器（24）还用作用于隔离到达硫化铅检测器（22）的辐射能的波长的滤光器。

    METHOD AND SYSTEM FOR MEASURING RADIATION AND TEMPERATURE EXPOSURE OF WAFERS ALONG A FABRICATION PROCESS LINE
    100.
    发明公开
    METHOD AND SYSTEM FOR MEASURING RADIATION AND TEMPERATURE EXPOSURE OF WAFERS ALONG A FABRICATION PROCESS LINE 审中-公开
    用于测量制造工艺线上的晶片的辐射和温度暴露的方法和系统

    公开(公告)号：EP3201942A1

    公开(公告)日：2017-08-09

    申请号：EP15851269.9

    申请日：2015-10-13

    Applicant: KLA - Tencor Corporation

    Inventor： SUN, Mei ,  JENSEN, Earl ,  O'BRIEN, Kevin

    IPC: H01L21/66

    CPC classification number: G01J1/429 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/0407 ,  G01J1/58 ,  G01J5/04 ,  G01J5/0818 ,  G01J5/10 ,  G01K11/20 ,  H01L21/67248 ,  H01L21/67253 ,  H01L22/10

    Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.

    Abstract translation: 用于测量辐射强度和温度的测量晶片装置包括含有一个或多个空腔的晶片组件。 测量晶片装置还包括检测器组件。 检测器组件设置在晶片组件的一个或多个空腔内。 检测器组件包括一个或多个光传感器。 检测器组件还被配置为执行入射在晶片组件的表面上的紫外光的强度的直接或间接测量。 检测器组件还被配置成基于一个或多个光传感器的一个或多个特性来确定晶片组件的一个或多个部分的温度。

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