Abstract:
PROBLEM TO BE SOLVED: To provide an electron emission device high in electron emission efficiency. SOLUTION: The device 100 includes: a SiC substrate 11 having a region 17 with its surface or inside exposed, and having a (0001) surface as a principal surface; an electron emission layer 12 formed on a C surface of the substrate 11 and formed out of carbon; and an electrode 18 formed in the region 17. The electrode 18 may be formed on the Si surface of the substrate 11. The electron emission layer 12 is formed in a part of the C surface of the substrate 11, and the electrode 18 may be formed in a region of the C surface of the substrate 11 where the electron emission layer 12 is not formed. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electron emission device improving uniformity of electron emission of respective pixels, an electron emission display device including the electron emission device and a method for manufacturing the electron emission display device. SOLUTION: The electron emission device 104 is provided with: a cathode electrode 14; a gate electrode 28 arranged to be electrically isolated from the cathode electrode 14; an electron emission portion 20; and a resistive layer 22 electrically connected to the cathode electrode 14 and the electron emission portion 20, the resistive layer 22 being made of a metal oxide or a metal nitride. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a given junction with an antireflection coating and a laminated wiring line which can prevent the junction from an undesired exposure by photons. SOLUTION: Ti-Al-N being laminated on a semiconductor substrate serves as an antireflection coating. For a form of embodiment of the wiring line, an aluminum electrically conductive layer (54) and aluminum-titanium lower layer (52) are formed beneath an antireflection cap layer. For a field emission display (FED), a Ti-Al-N layer prevents blocking of the device operation by a light originated in the anode of the display screen passing through a transistor junction. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a thin film transistor device of a field emission display. SOLUTION: This device is formed with a patterned first gate metal layer, a first gate insulating layer positioned under the first gate metal layer, a patterned second gate metal layer, and a second gate insulating layer positioned under the second gate metal layer. When the thickness of the gate insulating layer is larger than that of the first gate insulating layer and voltages of the first and second metal layers are higher than that of a threshold voltage, the device is formed so that an absolute voltage of a polysilicon layer channel area positioned under the first gate metal layer is lower than that of polysilicon layer channel area positioned under the second gate metal layer. Consequently, the device can conform to high voltage operation and can be subjected to good protection. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
Provided is a field emission display (FED) capable of driving on the basis of current and preventing leakage current caused by thin film transistors (TFTs). The FED includes: a plurality of unit pixels including an emission element in which cathode luminescence of a phosphor occurs and a TFT for driving the emission element; a current source for applying a scan signal to each unit pixel; and a voltage source for applying a data signal to each unit pixel. Here, the on- current of the current source is high enough to take care of the load resistance and capacitance of a scan row within a given writing time, and the off-current of the current source is so low that the electron emission of each pixel can be ignored. In addition, the pulse amplitude or pulse width of the data signal applied from the voltage source is changed, and thereby the gray scale of the display is represented.