Abstract:
PROBLEM TO BE SOLVED: To provide an optical communication apparatus which suppresses the deterioration of transmission characteristics of a high-frequency signal. SOLUTION: The optical communication apparatus includes a module board carrying an optical module that receives an incoming optical signal or outputs an optical signal and a peripheral circuit electrically connected to the optical module. The optical communication apparatus also includes a connector board having an electric connector that receives an incoming electric signal or outputs an electric signal. The optical communication apparatus further includes a flexible board which is disposed between the module board and the connector board and adjusts relative positions of the module board and the connector board. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a simple structure for a holder 3 and to reduce the unmountable area of other components, in a mounting structure of an SFP module 4 made so as to keep the SFP module 4 connected to a connector 2 mounted on a PT board 1 with the holder 3. SOLUTION: The holder 3 includes both side surfaces 3a supporting the SFP module 4 on both sides, turn-back parts 3b provided to the upper edge of each side surface 3a, enabling the SFP module 4 to be inserted and pulled off in an oblique direction and preventing the SFP module 4 from coming off upwardly, and a bottom surface 3c fixing the both side surfaces 3a on the PT board 1. The connector 2 is equipped with an electrode, having return elastic force capable of keeping the SFP module 4 inserted into the holder 3 from an oblique upward direction and turning the SFP module 4 up to a state that is parallel with the PT board 1. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic equipment in which vibration proof and impact proof as well as reduction in size are simultaneously provided while incorporating a storage device such as an HDD that is susceptible to an impact. SOLUTION: An electronic equipment 100 consists of a storage device 13 which records data and is susceptible to an impact and a circuit substrate 1 which includes a control circuit of the electronic equipment 100 and has an opening section 9. The storage device 13 is held by the opening section 9 through a holding member 11. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
Die Erfindung betrifft ein Verfahren zur mechanischen Kontaktierung insbesondere eines Vergussrahmens (1) auf einer Leiterplatte (20) einer elektronischen Baugruppe (2). Hierzu weist der Vergussrahmen (1) zumindest eine metallische Kontaktfläche (11) auf; Die Leiterplatte (20) weist eine Grundfläche (21) auf, die korrespondierend zur Kontaktfläche (11) metallisch strukturiert ist. Das Verfahren umfasst folgende Verfahrensschritte: Positionieren der mechanischen Komponente (1) mit Orientierung der Kontaktfläche (11) zu der korrespondierenden Grundfläche (21) hin, und Verlöten der mechanischen Komponente (1) mit der Leiterplatte (20) über die Kontaktfläche (11) und die Grundfläche (21). Damit bietet das erfindungsgemäße Verfahren zum einen den Vorteil, dass eine materialsparende Kapselung für elektronische Baugruppen (2) in explosionsgefährdeten Bereichen bereitgestellt werden kann. Gleichzeitig kann auf einen zusätzlichen Prozessschritt zur mechanischen Kontaktierung der Kapselung auf der Leiterplatte (20) verzichtet werden, da das mechanische Kontaktieren des Vergussrahmens (1) in einem Prozessschritt zusammen mit dem Verlöten der weiteren elektrischen Bauteile (3) auf der Leiterplatte (20) durchgeführt werden kann.
Abstract:
An edge assembly (108, 108') comprising at least a first edge component (110A, HOB, 110), flexible substrate (102) and a compression retainer component (118) attaching the first edge component (110A, HOB, 110) to the flexible substrate (102). The first edge component (HOA, HOB, 110) includes at least one conductor (112A, 112B, 112) to mate with one or more conductors (104) on a surface of a flexible substrate (102) after the first edge component (HOA, HOB, 110) is affixed to an edge of the flexible substrate (102) by the compression retainer component (118). The edge assembly (108, 108') may also comprises a second edge component (116), wherein the flexible substrate (102) may be compressed between the first and second edge components (106) and held in place by the compression retainer component (118). The first edge component (HOA, HOB, 110) further comprises an extension (114), including the at least one conductor (112A, 112B, 112), that is used to convey power from a power source (404) to the flexible substrate (102). The extension (114) is accessible from outside the flexible substrate (102) via a port (124) in the compression retainer component (118).
Abstract:
A holder structure for mounting light indicators on printed circuit boards using surface mount technology at a position elevated above the surface of the board is provided with a body member including a top wall, a bottom wall, opposed sidewalls, a front wall, and a rear wall, all being formed integrally together. Two spaced-apart recesses are formed and aligned vertically in the front wall of the body member terminating in respective first and second interior wall portions. The first interior wall portion has openings formed on diametrically opposed sides of a vertical partition and lying in a horizontal plane parallel to the bottom wall. The second interior wall portion has openings formed on diametrically opposed sides of a transverse partition and lying in a plane which is rotated a predetermined number of degrees from a vertical plane perpendicular to the bottom wall.
Abstract:
Die Erfindung betrifft eine elektrische Schaltungsanordnung (1), insbesondere für ein Steuergerät eines Kraftfahrzeugs, mit einer ersten Leiterplatine (2), mindestens einer zweiten Leiterplatine (3) und mindestens einer Halterung (4) zum HaIten der zweiten Leiterplatine (3) an der ersten Leiterplatine (2) unter Herstellung eines elektrischen Kontakts (6) zwischen der ersten (2) und der zweiten (3) Leiterplatine. Dabei ist vorgesehen, dass die zweite Leiterplatine (3) an der Halterung (4) vormontiert ist und dass die aus zweiter Leiterplatine (3) und Halterung (4) bestehende vormontierte Einheit (5) mit der ersten Leiterplatine (2) verbunden ist, wobei die Halterung (4) und die zweite Leiterplatine (3) quer, insbesondere rechtwinklig, zu der ersten Leiterplatine (2) angeordnet sind. Die Erfindung betrifft ferner ein Steuergerät sowie ein Verfahren zum Herstellen einer elektrischen Schaltungsanordnung (1).
Abstract:
본 발명에서는 정원등(庭園燈)이나 실내등(室內燈) 또는 가로등(街路燈) 같은 각종 조명기구에 적용되는 LED모듈을 구성함에 있어 다수개의 LED소자가 별도로 마련되는 열전도성 재질로 이루어진 LED홀더상에서 설계에 따라 정해진 기울기로 부착된 상태에서 인쇄회로기판상의 정해진 위치에 설치되도록 함과 동시에 LED소자로부터 발생되는 열이 그 설치위치에 형성되는 방열공(放熱孔)을 통하여 외부로 신속하게 방출될 수 있도록 함으로써 조명기구가 설치되는 지역의 조건에 따라 필요한 빛의 조사각도를 용이하게 확보할 수 있도록 하고, 방열특성을 향상시킬 수 있도록 한 새로운 조명기구용 LED모듈의 LED장착구조가 개시된다. 본 발명은 표면상에 설계에 따라 정해진 패턴의 회로가 형성되고, 상기 회로상의 LED소자 설치위치 마다 정해진 크기의 방열공이 형성된 인쇄회로기판과; 상기 인쇄회로기판상에 형성된 회로상의 정해진 위치에 전기적으로 접속되도록 고정·설치된 상태에서 전류의 인가에 따라 점등되는 다수개의 LED소자와; 열전도성이 우수한 재질로 이루어지며, 상기 인쇄회로기판상에 형성된 각각의 방열공의 내주면에 끼워져 결합된 상태에서 인쇄회로기판상에 설치된 각각의 LED소자로부터 발생되는 열을 외부로 방출하는 방열링(Ring)과; 열전도성 재질로 이루어지고, 상부면에 설계에 따라 정해진 각도의 기울기를 갖는 LED장착부가 형성되고, 하부면의 중심으로부터 아랫쪽으로는 외주면에 나사부가 형성된 상태에서 상기 방열링의 중심부를 통하여 끼워지는 체결보스가 돌출·형성된 구조로 이루어지며, 장착시 방열링의 상부면과 밀착되면서 LED소자로부터 발생되는 열이 방열링으로 전달되도록 하는 LED홀더를 포함한다.
Abstract:
Verfahren zur vereinfachten Montage einer zweiten Leiterplatte (2) mit einer ersten Leiterplatte (1) eines Betriebsgerätes (A) für ein Leuchtmittel wobei die zweite Leiterplatte (2) in ein Fixierungselement (3) geklemmt wird und darauf folgend das Fixierungselement (3) in eine Öffnung in der ersten Leiterplatte (1) befestigt wird, und in einem weiteren Schritt die zweite Leiterplatte (2) mit der ersten Leiterplatte (1) über eine Lötverbindung elektrisch kontaktiert wird.