公开(公告)号：KR101074532B1

公开(公告)日：2011-10-17

申请号：KR1020090071118

申请日：2009-08-02

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소

IPC: G01R31/26 ,  H01L21/66

Abstract: 본발명은엘이디칩 분류장치에관한것으로, 본발명에따른엘이디칩 분류장치는엘이디칩이안착되는안착부재, 상기안착부재가복수개설치되는회전부재, 및엘이디칩이로딩되는로딩위치와, 엘이디칩이테스트되는테스트위치와, 엘이디칩이언로딩되는언로딩위치각각에상기안착부재들이순차적으로위치되도록상기회전부재를회전시키는회전유닛을포함하는공급부; 복수개의엘이디칩이부착되는공급부재를포함하는공급기구, 상기공급부재에서엘이디칩을픽업하여상기로딩위치에위치되는안착부재에로딩하는로딩유닛, 및상기로딩유닛에의해픽업되는엘이디칩으로부터상기공급부재를제거하기위한제1제거유닛을포함하고, 상기공급부옆에설치되는로딩부; 상기테스트위치에위치되는엘이디칩을발광시키는접촉유닛과상기테스트위치에위치되는엘이디칩의광 특성을측정하는측정유닛을포함하고, 상기공급부옆에설치되는테스트부; 및상기언로딩위치에위치되는안착부재로부터엘이디칩을언로딩하는언로딩부를포함할수 있다.

公开(公告)号：KR1020110096897A

公开(公告)日：2011-08-31

申请号：KR1020100016425

申请日：2010-02-23

Applicant: (주)큐엠씨 ,  전남대학교산학협력단

Inventor： 유병소 ,  이준기 ,  권광우

IPC: H01L33/32

CPC classification number: H01L33/32 ,  H01L33/007 ,  H01L2933/0008

Abstract: 본원은, 전기화학적 정전위법(electrochemical potentiostatic method)을 이용하여 질화갈륨계 화합물 반도체에 함유된 p-형 도판트를 활성화시킴으로써 p-형 질화갈륨계 화합물 반도체 층의 정공 농도를 증가시키고 전기적 특성을 개선할 수 있는 방법을 제공하고 이러한 방법을 이용하여 제조되는 질화갈륨계 화합물 반도체 디바이스 및 발광 디바이스를 제공하고자 한다.

公开(公告)号：KR101038776B1

公开(公告)日：2011-06-03

申请号：KR1020090041165

申请日：2009-05-12

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소

IPC: G01R31/26 ,  H01L21/66 ,  H01L33/48

Abstract: 본 발명은 엘이디 칩이 안착되는 안착부재가 복수개 설치되는 회전부재; 엘이디 칩이 상기 안착부재에 로딩되는 로딩위치와, 엘이디 칩이 테스트되는 테스트위치와, 엘이디 칩이 상기 안착부재로부터 언로딩되는 언로딩위치 각각에 상기 안착부재들이 순차적으로 위치되도록 상기 회전부재를 회전시키고, 상기 회전부재가 결합되는 회전유닛; 상기 테스트위치에 위치되는 엘이디 칩을 테스트하고, 상기 회전부재 옆에 설치되는 테스트유닛; 및 상기 언로딩위치와 상기 로딩위치 사이에 설치되고, 상기 언로딩위치를 지난 안착부재에 남아있는 엘이디 칩을 제거하는 제1제거유닛을 포함하는 엘이디 칩 테스트장치에 관한 것으로,
본 발명에 따르면 본 발명은 불필요하게 패키지공정 및 테스트공정을 거치게 되는 엘이디 칩을 줄임으로써, 재료비, 공정비 등의 손실을 막을 수 있고, 이로 인해 엘이디의 제조단가를 낮출 수 있다.
엘이디 칩, 테스트, 광 특성, 로딩, 언로딩

公开(公告)号：KR1020110053032A

公开(公告)日：2011-05-19

申请号：KR1020090109823

申请日：2009-11-13

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소

IPC: H01L21/67 ,  H01L21/02

Abstract: PURPOSE: A maintenance member discharging device and an LED chip sorting device are provided to easily grasp the flow of a process by positioning an unloading unit on an opposite side to a loading unit around a supply unit. CONSTITUTION: A housing(110) includes a support member(114) which supports a maintenance member. A discharge pin is installed in one side of the housing and discharges the maintenance member from the support member. The support member is formed in the housing to vertically stack the maintenance member in the housing. An input unit inputs the maintenance member.

Abstract translation: 目的：提供维护部件排出装置和LED芯片分拣装置，以通过将卸载单元定位在供给单元周围的装载单元的相反侧来容易地掌握处理流程。 构成：壳体（110）包括支撑维护构件的支撑构件（114）。 排出销安装在壳体的一侧，并将维护构件从支撑构件排出。 支撑构件形成在壳体中以将维护构件垂直地堆叠在壳体中。 输入单元输入维护成员。

公开(公告)号：KR1020110013107A

公开(公告)日：2011-02-09

申请号：KR1020090071119

申请日：2009-08-02

Applicant: (주)큐엠씨

Inventor： 유병소

IPC: G01R31/26 ,  H01L21/66

CPC classification number: G01R31/2867 ,  G01R31/2635 ,  G01R31/2887 ,  G01R31/2893 ,  H01L21/67271

Abstract: PURPOSE: An LED chip sorting device is provided to prevent an LED chip from being damaged. CONSTITUTION: An unloading unit(5) includes a sorting unit and a buffer(6). The sorting unit uses a second receiving member which supports a plurality of LED chips which are tested. The second receiving unit includes a second housing and a second receiving member to which the tested LED chips are attached. A second housing has a rectangular shape and is supported by the second housing.

Abstract translation: 目的：提供LED芯片分选装置，防止LED芯片受损。 构成：卸载单元（5）包括分拣单元和缓冲器（6）。 分拣单元使用支持被测试的多个LED芯片的第二接收构件。 第二接收单元包括被测试的LED芯片附接到的第二壳体和第二接收构件。 第二壳体具有矩形形状并且由第二壳体支撑。

公开(公告)号：KR1020110013106A

公开(公告)日：2011-02-09

申请号：KR1020090071118

申请日：2009-08-02

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소

IPC: G01R31/26 ,  H01L21/66

CPC classification number: G01R31/2867 ,  G01R31/2635 ,  G01R31/2863 ,  G01R31/2893 ,  H01L21/67271 ,  H01L21/683

Abstract: PURPOSE: An LED chip sorting apparatus is provided to accurately sort an LED chip according to the performance of the LED chip. CONSTITUTION: A supplying unit(3) comprises a receiving member, a rotating member, and a rotation unit. The rotating member successively positions receiving members in a loading position, a test position, and an unloading position of the LED chip. A loading unit(2) includes a supply unit, a loading unit, and a first removing unit. A supply device includes a supply member to which a plurality of LED chips are attached. The loading unit picks up an LED chip from a supply member and positions the LED chip on the loading position. A first removing unit removes the supply member from the LED chip picked up by the loading unit. A test unit(4) measures the light property of the LED chip positioned on the test position. An unloading unit(5) unloads an LED chip from the receiving member.

Abstract translation: 目的：提供LED芯片分选装置，根据LED芯片的性能对LED芯片进行精确分类。 构成：供给单元（3）包括接收构件，旋转构件和旋转单元。 旋转构件将接收构件连续地定位在LED芯片的装载位置，测试位置和卸载位置。 装载单元（2）包括供应单元，装载单元和第一移除单元。 供给装置包括多个LED芯片附接到的供给部件。 装载单元从供应构件拾取LED芯片，并将LED芯片定位在装载位置。 第一移除单元从由装载单元拾取的LED芯片移除供应构件。 测试单元（4）测量位于测试位置的LED芯片的光特性。 卸载单元（5）从接收构件卸载LED芯片。

公开(公告)号：KR1020110000950A

公开(公告)日：2011-01-06

申请号：KR1020090058303

申请日：2009-06-29

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소

IPC: G01R31/26 ,  H01L21/66

CPC classification number: G01R31/2635 ,  G01J1/02 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2887 ,  G01R31/2893

Abstract: PURPOSE: An LED chip test device and an LED classifying device thereof are provided to reduce the manufacturing costs of an LED by preventing an LED from unnecessarily passing a packaging process and a test process. CONSTITUTION: A loading part supplies an LED chip. A supply part(2) comprises a settling member(21) which settles the LED chip that is supplied from the loading part. The supply part comprises a rotary unit(23) rotating a rotating member(22). A test part(3) comprises a contact unit(32) which emits the LED chip and a measurement unit(31) which measures the photonic property of the LED chip. An unloading part unloads the LED chip from the settling member which is located in an unloading location.

Abstract translation: 目的：提供一种LED芯片测试装置及其LED分类装置，通过防止LED不必要地通过封装过程和测试过程来降低LED的制造成本。 构成：装载部件提供LED芯片。 供应部分（2）包括沉降构件​​（21），其沉淀从装载部件供应的LED芯片。 供给部分包括旋转旋转部件（22）的旋转单元（23）。 测试部件（3）包括发射LED芯片的接触单元（32）和测量LED芯片的光子性质的测量单元（31）。 卸载部件从位于卸载位置的沉降构件卸载LED芯片。

公开(公告)号：KR100984726B1

公开(公告)日：2010-10-01

申请号：KR1020100039729

申请日：2010-04-28

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소 ,  이병식 ,  장현삼 ,  김범중

IPC: B23K26/382 ,  B23K26/08

Abstract: PURPOSE: An objects processing method using laser, an object processing device and an object processing system are provided to efficiently cut a target object by removing a optical density profile from the inside of a substrate. CONSTITUTION: An objects processing method using laser comprises next steps. A laser light source(300) produces a laser beam. A divergence angle of the laser beam is corrected. The corrected laser beam is condensed inside objects(200) to form a spot. A phase transformation domain is formed inside the objects with the spot. The one-axis direction of the spot is changed with the divergence angle correction of the laser beam.

Abstract translation: 目的：提供使用激光的物体处理方法，物体处理装置和物体处理系统，以通过从基板的内部去除光密度分布来有效地切割目标物体。 构成：使用激光的物体处理方法包括以下步骤。 激光源（300）产生激光束。 校正激光束的发散角。 校正的激光束在物体（200）内被冷凝以形成点。 在具有斑点的物体内形成相变域。 斑点的单轴方向随着激光束的发散角校正而改变。

公开(公告)号：KR100925768B1

公开(公告)日：2009-11-11

申请号：KR1020090033107

申请日：2009-04-16

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소

IPC: G03F7/20 ,  G02B5/00 ,  H01L33/00

CPC classification number: H01L33/0079 ,  B23K26/066 ,  H01L21/268 ,  Y10T156/1917

Abstract: PURPOSE: An apparatus and a method for manufacturing LED for separating a thin film from a substrate are provided to remove troublesome of forming trench to an epi layer before a sapphire substrate is separated from a GaN-based epitaxial layer. CONSTITUTION: An apparatus for manufacturing an LED comprises a laser beam light source which emits laser beam; a mesh-type mask with plural apertures, which selectively passes the laser beam emitted from the laser beam light source; and imaging lens for forming spots by focusing the laser beam passing through the mesh-type mask to separate a sapphire substrate(100) and a GaN-based epitaxial layer(200).

Abstract translation: 目的：提供一种用于制造用于从衬底分离薄膜的LED的装置和方法，以在蓝宝石衬底与GaN基外延层分离之前，将形成沟槽的麻烦形成为外延层。 构成：用于制造LED的装置包括发射激光束的激光束光源; 具有多个孔的网状掩模，其选择性地通过从激光束光源发射的激光束; 以及用于通过聚焦穿过网状掩模的激光束来形成斑点的成像透镜，以分离蓝宝石衬底（100）和GaN基外延层（200）。

公开(公告)号：KR100787829B1

公开(公告)日：2007-12-27

申请号：KR1020070090944

申请日：2007-09-07

Applicant: (주)큐엠씨

Inventor： 유병소 ,  이병식

IPC: G01R31/00

CPC classification number: G01R31/025 ,  G01R1/0408 ,  G01R1/07307 ,  G01R19/0092 ,  G01R31/01 ,  G01R31/2601

Abstract: A probe card test device and a test method are provided to reduce manufacturing cost and test costs by performing the test using contact heads contacted to probe tips. A probe card test device includes a first plane and a second plane, wherein a plurality of probe tips are formed in the first plane and divided by a plural sections, and a contact pad is formed in the second plane, and connected electrically with the probe tips. A plurality of contact lines are formed on a contact head(42). A contact pin(46) is contacted with one of the contact pads. A test part tests the electrical characteristic of a first probe tip by adding an electrical signal to the contact pin or contact lines. The test is repeated until all the probe tips are tested by transferring the contact head and the contact pin.

Abstract translation: 提供了探针卡测试装置和测试方法，以通过使用与探针尖端接触的接触头进行测试来降低制造成本和测试成本。 探针卡测试装置包括第一平面和第二平面，其中多个探针尖端形成在第一平面中并被多个部分分隔，并且接触垫形成在第二平面中，并与探针电连接 提示。 多个接触线形成在接触头（42）上。 接触销（46）与接触焊盘之一接触。 测试部件通过向触针或接触线添加电信号来测试第一探针尖端的电特性。 重复该测试，直到通过传送接触头和接触针来测试所有的探头尖端。