公开(公告)号：EP1560286B1

公开(公告)日：2010-03-03

申请号：EP04254006.2

申请日：2004-07-02

Applicant: COM DEV LTD.

Inventor：

IPC: H01P1/12

CPC classification number: H01P1/122 ,  H01P1/12

公开(公告)号：EP1523059B1

公开(公告)日：2008-01-23

申请号：EP04256182.9

申请日：2004-10-06

Applicant: COM DEV LTD.

Inventor： Yu, Ming

IPC: H01P7/10

CPC classification number: H01P7/10

公开(公告)号：EP1588943A2

公开(公告)日：2005-10-26

申请号：EP05251192.0

申请日：2005-02-28

Applicant: COM DEV LTD.

Inventor： Blakeney, Ross S. ,  Wiesel, Jeffrey M.

IPC: B64G1/22 ,  H04Q11/00 ,  H02G3/00

CPC classification number: B64G1/22

Abstract: A distributed matrix wiring assembly (10) uses a distributed matrix module (14) to connect a routing relay module to a payload equipment device (20) over a set of harness wires. The routing relay module is adapted to provide driving signals to the harness wires at a first end. The distributed matrix module (14) is connected to the harness wires at a second end as well as to the payload equipment device (20). The distributed matrix includes distributed matrix column wires and distributed matrix row wires which are configured to form a distributed matrix having distributed matrix nodes, each distributed matrix node being defined by the unique combination of a distributed matrix column wire and a distributed matrix row wire. Since the distributed matrix nodes form at least a portion of the overall matrix node requirement it is possible to reduce the number of harness wires required.

Abstract translation: 分布式矩阵布线组件（10）使用分布式矩阵模块（14）将路由中继模块连接到一组线束线上的有效载荷设备装置（20）。 路由继电器模块适于在第一端处向线束提供驱动信号。 分布式矩阵模块（14）在第二端以及有效负载设备装置（20）处连接到线束线。 分布式矩阵包括分布式矩阵列线和分布式矩阵行线，其配置为形成具有分布式矩阵节点的分布式矩阵，每个分布式矩阵节点由分布式矩阵列线和分布式矩阵行线的独特组合定义。 由于分布式矩阵节点形成整个矩阵节点要求的至少一部分，因此可以减少所需的线束线的数量。

公开(公告)号：EP1523059A3

公开(公告)日：2005-06-08

申请号：EP04256182.9

申请日：2004-10-06

Applicant: COM DEV LTD.

Inventor： Yu, Ming

IPC: H01P7/10

CPC classification number: H01P7/10

Abstract: A half wave dielectric resonator assembly including a resonator cavity having a top surface and a bottom surface, an elongated cylindrical dielectric resonator positioned within said resonator cavity and first and second insulative supports to couple and insulate the ends of the cylindrical dielectric resonator from the resonator cavity. The dielectric resonator has a substantially small diameter to length ratio. The resonator assembly provides improved spurious performance and quality factor (Q) at a lower mass. A resonator filter is constructed using a plurality of these resonator assemblies, where adjacent pairs of said resonator cavities are separated from each other by a common cavity wall. By forming a first iris opening formed within a first common cavity wall and forming a second iris opening formed within a second common cavity wall having a position that is vertically offset from the position of the first iris, it is possible to reduce stray coupling.

Abstract translation: 一种半波介质谐振器组件，包括一个具有顶表面和底表面的谐振腔，一个位于所述谐振腔内的细长圆柱形介质谐振器，以及第一和第二绝缘支撑件，用于将圆柱形介质谐振器的端部与谐振腔耦合和绝缘 。 介质谐振器具有基本上小的直径长度比。 谐振器组件在较低的质量下提供改善的杂散性能和品质因数（Q）。 谐振器滤波器使用多个这些谐振器组件来构造，其中相邻的所述谐振器腔对通过共同的腔壁彼此分开。 通过形成在第一公共腔壁内形成的第一虹膜开口并在第二公共腔壁内形成第二虹膜开口，该第二虹膜开口具有与第一虹膜的位置垂直偏移的位置，可以减少杂散耦合。

公开(公告)号：EP1427069A1

公开(公告)日：2004-06-09

申请号：EP03257659.7

申请日：2003-12-05

Applicant: COM DEV LTD.

Inventor： Lecsek, Robert Leslie ,  Payne, Shawn Robert

IPC: H01R13/646

CPC classification number: H01R24/40 ,  H01R2103/00

Abstract: A coaxial heat sink connector for providing a thermal path from the conductors associated with a coaxial cable connector to a heat sink includes a center conductor, an outer conductor, an insulative layer, TNC connector(s) and a thermal element. The outer conductor is positioned around the center conductor and the insulation layer is positioned between. The insulation layer has high thermal conductivity to provide substantial heat transfer between the center and outer conductors. TNC connector(s) are positioned at the end(s) of the connector and electrically coupled to the center and outer conductors. The thermal element is coupled to the outer conductor to conduct heat from the outer conductor to the heat sink. Heat sink connector providing transfer paths for bolted together RF components as well as individual RF power components.

Abstract translation: 用于提供从与同轴电缆连接器相关联的导体到散热器的热路径的同轴散热器连接器包括中心导体，外部导体，绝缘层，TNC连接器和热元件。 外导体围绕中心导体定位，并且绝缘层位于中间导体之间。 绝缘层具有高导热性，以在中心和外导体之间提供实质的热传递。 TNC连接器位于连接器的端部并电耦合到中心和外部导体。 热元件耦合到外部导体以将热量从外部导体传导到散热器。 散热器连接器提供传输路径，用于螺栓连接在一起的RF部件以及单个RF功率部件。

公开(公告)号：EP0760561B9

公开(公告)日：2004-03-17

申请号：EP96113034.1

申请日：1996-08-13

Applicant: COM DEV LTD.

Inventor： Peach, Robert ,  Miller, Nigel ,  Tailor, Bharat ,  Ali, Kamal ,  Beauchamp, Gary ,  Lam, Simon ,  Lazaris-Brunner, Ken

IPC: H04B7/204

CPC classification number: H04B7/2041

公开(公告)号：EP1245035A2

公开(公告)日：2002-10-02

申请号：EP00984671.8

申请日：2000-11-29

Applicant: COM DEV LTD.

Inventor： ZYBURA, Andrzej ,  FRANCIS, James, T. ,  D'SOUZA, Ian, A. ,  KOBE, Bradley, A.

IPC: H01J3/00 ,  H01J23/12 ,  H01J9/24 ,  C23C14/34

CPC classification number: C23C14/08

Abstract: A microwave device with a secondary yield coefficient of less than 1 is produced by applying a coating of yttrium-iron-garnet to the inner surface of the device by sputtering.

公开(公告)号：EP0908964A3

公开(公告)日：2001-01-03

申请号：EP98307405.5

申请日：1998-09-14

Applicant: COM DEV LTD.

Inventor： Evans, Gwyn

IPC: H01P5/04

CPC classification number: H01P5/04

Abstract: A redundancy combiner assembly has two amplifiers (1, 2) connected in parallel along a waveguide path to a hybrid (3dB). The hybrid is connected through a transfer switch to an antenna The hybrid contains a movable coupling plate. The coupling plate has a coupling array to allow combining of signals of the amplifiers in one position. When one of the amplifiers fails, the coupling plate is replaced by a metal wall and the output from the failed amplifier is directed by the switch to a dump load while the output from the operating amplifier is directed to the antenna. The assembly is controlled by a controller, which monitors the amplifiers and controls the movement of the coupling plate and the switch.

公开(公告)号：EP0911904A3

公开(公告)日：2000-09-13

申请号：EP98117269.5

申请日：1998-09-11

Applicant: COM DEV LTD.

Inventor： Swarup, Arvind

IPC: H01P3/08

CPC classification number: H01P3/085 ,  H01P3/088 ,  H01P5/18 ,  H03H7/0123 ,  H03H7/42 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T29/49126

Abstract: A novel circuit packaging structure including a combination of printed lumped elements within a multi-layer stripline architecture is provided and methods of making the same. The lumped elements are provided by printing the individual passive elements, including interdigital capacitors and spiral inductors, onto the supporting substrate and then embedding these elements into the multi-layer stripline structure. The stripline structure consists of a signal layer sandwiched between at least two ground layers separated by two dielectric substrates of equal thickness. This ground-signal-ground approach confines the electromagnetic fields within the multi-layer structure, thereby minimizing radiation from coupling to nearby components. This approach offers a unique combination of stripline technology and printed lumped elements resulting in miniaturized radio frequency and microwave circuits at operating at frequencies well below 1GHz, up to several GHz.

公开(公告)号：EP0883203A3

公开(公告)日：1999-10-27

申请号：EP98304360.5

申请日：1998-06-02

Applicant: COM DEV LTD.

Inventor： Lundquist, Steven Barton ,  Zybura, Andre J.

IPC: H01P1/208 ,  H01P1/30 ,  H01P7/06

CPC classification number: H01P1/208 ,  H01P1/30 ,  H01P7/06

Abstract: A temperature compensated filter has a compensating screw (18) mounted in a support (40) in the wall (22) of a cavity. The support is made from a material having a high coefficient of thermal expansion compared to the material of the cavity and the material of the compensating screw. As temperature changes, the support moves the compensating screw either further into the cavity or further out of the cavity to compensate for the change in resonant frequency of the cavity that would otherwise occur. The compensating screw can be used with single, dual or triple mode cavities. The compensating screw can be made of metallic material or it can be made of non-metallic material with a metallic outer surface. The compensating screw is locked in the support before the support is inserted into the wall of the cavity. The support is then locked in the wall of the cavity and the screw automatically changes position within the cavity as temperature changes. An RF barrier (50) can be used to prevent RF energy from the cavity from entering the area of the support.

Abstract translation: 温度补偿过滤器具有安装在空腔的壁（22）中的支撑件（40）中的补偿螺钉（18）。 与空腔材料和补偿螺钉的材料相比，支撑体由具有高热膨胀系数的材料制成。 随着温度的变化，支撑件将补偿螺丝进一步移动到空腔中或者进一步移出空腔，以补偿否则会发生的空腔的谐振频率的变化。 补偿螺丝可用于单模，双模或三模腔。 补偿螺钉可以由金属材料制成，或者可以由具有金属外表面的非金属材料制成。 在将支撑件插入空腔的壁之前，补偿螺钉被锁定在支撑件中。 然后将支撑件锁定在空腔的壁上，随着温度的变化，螺钉自动改变腔内的位置。 可以使用RF屏障（50）来防止来自空腔的RF能量进入支撑体的区域。