106.
    发明专利
    未知

    公开(公告)号:DK162765C

    公开(公告)日:1992-04-27

    申请号:DK477785

    申请日:1985-10-18

    Applicant: BASF AG

    Abstract: 1. A light-weight building board which is based on mineral fibers and a thermoplastic binder, may furthermore contain fillers, fireproofing agents and water repellents and contains, as the binder, from 4 to 20 %, based on the weight of the mineral fibers, of a polymer having a glass transition temperature fo from 60 to 1108C and consisting of from 60 to 100 % by weight, based on the copolymer, of (meth) acrylates of alcohols of 1 to 4 carbon atoms and from 0 to 40 % by weight of (meth) acrylonitrile and/or styrene, which board additionally contains a salt of a carboxylic acid of 12 to 36 carbon atoms with a polyvalent metal.

    108.
    发明专利
    未知

    公开(公告)号:DE4016056A1

    公开(公告)日:1991-11-21

    申请号:DE4016056

    申请日:1990-05-18

    Applicant: BASF AG

    Abstract: Aqueous synthetic resin formulations containing A) from 3 to 75% by weight of one or more synthetic resins, B) one or more organic compounds having two or more hydrazide groups, C) from 0 to 10% by weight, based on the synthetic resin A, of benzophenone or acetophenone or of one or more acetophenone or benzophenone derivatives which are not monoethylenically unsaturated or of a mixture of these active ingredients, D) effective amounts of emulsifiers or protective colloids or of a mixture of these active ingredients, E) not less than 5% by weight of water and F) from 0 to 85% by weight of finely divided fillers, with the proviso that the total amount of the monomers d polymerized in the one or more synthetic resins A and of component C is from 0.05 to 10% by weight, based on the one or more synthetic resins A, and the ratio of the number of moles of hydrazide groups of component B and the number of moles of the aldehyde and keto groups of the monomers c polymerized in the one or more synthetic resins A is from 0.01 to 2. These synthetic resin formulations are suitable for coating, adhesive bonding, sealing or impregnating.

    109.
    发明专利
    未知

    公开(公告)号:FI912221A

    公开(公告)日:1991-11-19

    申请号:FI912221

    申请日:1991-05-08

    Applicant: BASF AG

    Abstract: Aqueous synthetic resin formulations containing A) from 3 to 75% by weight of one or more synthetic resins, B) one or more organic compounds having two or more hydrazide groups, C) from 0 to 10% by weight, based on the synthetic resin A, of benzophenone or acetophenone or of one or more acetophenone or benzophenone derivatives which are not monoethylenically unsaturated or of a mixture of these active ingredients, D) effective amounts of emulsifiers or protective colloids or of a mixture of these active ingredients, E) not less than 5% by weight of water and F) from 0 to 85% by weight of finely divided fillers, with the proviso that the total amount of the monomers d polymerized in the one or more synthetic resins A and of component C is from 0.05 to 10% by weight, based on the one or more synthetic resins A, and the ratio of the number of moles of hydrazide groups of component B and the number of moles of the aldehyde and keto groups of the monomers c polymerized in the one or more synthetic resins A is from 0.01 to 2. These synthetic resin formulations are suitable for coating, adhesive bonding, sealing or impregnating.

    Moulded prods. useful esp. as ceiling boards in damp rooms - contain finely-divided natural or synthetic materials and ester(s) of high mol.wt. poly:carboxylic acids and poly:hydric alcohol(s)

    公开(公告)号:DE4006644A1

    公开(公告)日:1991-09-05

    申请号:DE4006644

    申请日:1990-03-03

    Applicant: BASF AG

    Abstract: Moulded prods. (I) contain as main components, finely-divided natural or synthetic materials (II) and esters (III) of high-mol. wt. polycarboxylic acids (IV) and polyhydric alcohols (V). (I) are produced (a) by mechanically mixing (II) with an aq. soln. of (IV) and (V) as binder, removing excess binder, moulding the resulting paste as required and drying at 100-250 deg.C, (b) by compression moulding (II), coating, impregnating, spraying or dip-coating the pre-form with an aq. soln. of (IV) and (V), and drying at 100-220 deg.C, or (c) by premoulding (II) with a binder, treating with aq. soln. and drying as in (b). Pref. (I) contains 0.5-15 wt.% (III) based on equiv. amts. of (IV) (w.r.t. COOH and OH gps.), pref. esters of poly(meth)acrylic acids whose Na salts have K-value 90-130 in water at 25 deg.C; (V) is trimethylolpropane, glycerol or 2-hydroxymethylbutane-1,4-diol. USE/ADVANTAGE - Flat mouldings (I) are useful as ceiling boards in damp areas (claimed). W.r.t. prior-art binders (e.g. PF resin, amino resins), (III) gives a prod. with increased dimensional stability under damp conditions, which contains much less (or no) volatile binder component (formaldehyde, etc.).

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