公开(公告)号：US11061070B2

公开(公告)日：2021-07-13

申请号：US16666132

申请日：2019-10-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01R31/28 ,  G01R3/00 ,  G01R1/073

Abstract: Disclosed is a guide plate for a probe card guiding a probe pin of the probe card and a manufacturing method thereof, and the probe card having the same. Particularly, the guide plate and a manufacturing method thereof, and the probe card securing reliability of the probe card are intended to be provided, wherein probe pins are easily inserted into the guide plate, and pin insertion holes into which the probe pins are inserted are precisely formed in a small size.

公开(公告)号：US10998136B2

公开(公告)日：2021-05-04

申请号：US15618201

申请日：2017-06-09

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01G4/33 ,  H01G4/005 ,  H01G4/10 ,  H01G4/012

Abstract: Provided is a three-dimensional (3D) capacitor including conductors formed at a high density inside holes of an anodic oxide film, and a first electrode layer and a second electrode layer electrically connected to the conductors. Thus, a high capacitance relative to a size of the 3D capacitor may be easily achieved.

公开(公告)号：US10889009B2

公开(公告)日：2021-01-12

申请号：US16551566

申请日：2019-08-26

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B25J15/06 ,  B25J7/00 ,  H01L33/00

Abstract: The present invention relates to a transfer head gripping and transferring micro LEDs from a first substrate to a second substrate. More particularly, the present invention relates to a transfer head gripping and transferring micro LEDs in a batch manner without any error even when there is a height difference of the micro LEDs.

公开(公告)号：US10707394B2

公开(公告)日：2020-07-07

申请号：US16235706

申请日：2018-12-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

公开(公告)号：US10193207B2

公开(公告)日：2019-01-29

申请号：US15511821

申请日：2015-08-24

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01Q1/00 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q1/52

Abstract: The present invention relates to a substrate for supporting an antenna pattern. The substrate includes a porous anodic oxide layer having a plurality of pores formed by anodizing metal. A metallic material is filled in at least a part of the pores.

公开(公告)号：US20180100842A1

公开(公告)日：2018-04-12

申请号：US15718570

申请日：2017-09-28

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N33/00 ,  G01N27/14

CPC classification number: G01N33/0027 ,  G01N27/128 ,  G01N27/14 ,  G01N33/0014

Abstract: A micro sensor package having a low thermal conductivity includes: a substrate on which a metal pattern is formed; a sensing chip disposed on the substrate; a cover covering the sensing chip and formed with a hole for supplying gas to the sensing chip; and a filter covering the hole, wherein the sensing chip comprises a sensor platform having a plurality of first pores formed along the up-down direction, and a sensor electrode formed on an upper portion or a lower portion of the sensor platform and electrically connected to the metal pattern.

公开(公告)号：US09913381B2

公开(公告)日：2018-03-06

申请号：US14460587

申请日：2014-08-15

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Kyoung Ja Yun

IPC: H05K1/18 ,  H05K3/00 ,  H05K7/00 ,  H01L33/48 ,  H01L33/62

CPC classification number: H05K3/0052 ,  H01L33/48 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/183 ,  H05K2201/09718 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/10 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.

公开(公告)号：US20170294700A1

公开(公告)日：2017-10-12

申请号：US15511821

申请日：2015-08-24

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01Q1/00 ,  H01Q9/04 ,  H01Q1/38

CPC classification number: H01Q1/002 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q9/0407

Abstract: The present invention relates to a substrate for supporting an antenna pattern. The substrate includes a porous anodic oxide layer having a plurality of pores formed by anodizing metal. A metallic material is filled in at least a part of the pores.

公开(公告)号：US09773617B2

公开(公告)日：2017-09-26

申请号：US14825538

申请日：2015-08-13

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park

IPC: H01G4/26 ,  H01G4/005 ,  H01G4/30 ,  H01G4/38 ,  H01G4/10

CPC classification number: H01G4/26 ,  H01G4/005 ,  H01G4/10 ,  H01G4/30 ,  H01G4/38

Abstract: A folding type capacitor includes a metal substrate wherein a through hole penetrates an inside thereof; at least one dielectric layer formed on a surface of the metal substrate and an inner peripheral surface of the through hole; and an electrode layer formed on the at least one dielectric layer, wherein the metal substrate has bending portions whose surfaces are facing each other. Thus, manufacturing process is more simplified since Al2O3 insulation layers are formed by anodizing the aluminum layer without forming the extra dielectric layers after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-stacked capacitor having a high capacitance and a high reliability can be provided by stacking capacitors including a plurality of aluminum oxide layers using a more simplified process.

公开(公告)号：US20170167025A1

公开(公告)日：2017-06-15

申请号：US15369042

申请日：2016-12-05

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: C23C16/455 ,  C25D11/24

CPC classification number: C23C16/45565 ,  B01D67/003 ,  B01D67/0062 ,  B01D67/0065 ,  B01D69/06 ,  B01D71/022 ,  B01D71/025 ,  B01D2325/02 ,  C23C16/4404 ,  C25D11/04 ,  C25D11/24 ,  H01J37/3244

Abstract: A fluid permeable anodic oxide film includes a plurality of regularly-disposed pores formed by anodizing metal and a plurality of permeation holes having an inner width larger than an inner width of the pores and extending through the fluid permeable anodic oxide film. Also provided is a fluid permeable body which makes use of the fluid permeable anodic oxide film.