PROCESS FOR THE PRODUCTION OF STRONGLY ADHERENT COATINGS
    105.
    发明申请
    PROCESS FOR THE PRODUCTION OF STRONGLY ADHERENT COATINGS 审中-公开
    生产强力涂料的方法

    公开(公告)号:WO2005014874A1

    公开(公告)日:2005-02-17

    申请号:PCT/EP2004/051599

    申请日:2004-07-26

    Abstract: The invention relates to a process for the production of strongly adherent coatings on an inorganic or organic metalized substrate, wherein in a first step a) a low-temperature plasma, a corona discharge or a flame is caused to act on the inorganic or organic substrate, in a second step b) one or more photoinitiators or mixtures of photoinitiators with monomers, containing at least one ethylenically unsaturated group, or solutions, suspensions or emulsions of the afore-mentioned substances, are applied to the inorganic or organic substrate, in a third step c) using suitable methods those afore-mentioned substances are dried and/or irradiated with electromagnetic waves and, optionally, in a fourth step d) the substrate so pretreated is provided with a coating and the coating is cured or dried.

    Abstract translation: 本发明涉及一种用于在无机或有机金属化基底上生产强粘附涂层的方法,其中在第一步骤中,a)使低温等离子体,电晕放电或火焰作用于无机或有机基底上 在第二步中b)将一种或多种光引发剂或光引发剂与含有至少一个烯键式不饱和基团的单体或上述物质的溶液,悬浮液或乳液的单体混合物施加到无机或有机基材上, 第三步骤c)使用合适的方法,将上述物质用电磁波干燥和/或照射,以及任选地在第四步骤中d)将经过预处理的基材设置有涂层,并将涂层固化或干燥。

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    110.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理装置和基板处理方法

    公开(公告)号:US20160293387A1

    公开(公告)日:2016-10-06

    申请号:US15180935

    申请日:2016-06-13

    Abstract: Disclosed is a substrate processing apparatus and method which facilitate to improve uniformity of thin film material and also facilitate to control quality of thin film by the use of plasma forming space and source gas distributing space separately provided from each other, wherein the substrate processing apparatus includes a process chamber; a substrate support for supporting a plurality of substrates, the substrate support rotatably provided inside the process chamber; and an electrode unit arranged above the substrate support and provided with the plasma forming space and the source gas distributing space, wherein the plasma forming space is spatially separated from the source gas distributing space.

    Abstract translation: 公开了一种有利于提高薄膜材料的均匀性的基板处理装置和方法,并且还通过使用彼此分开设置的等离子体形成空间和源气体分配空间来有助于控制薄膜的质量,其中基板处理装置包括 处理室; 用于支撑多个基板的基板支撑件,可旋转地设置在处理室内的基板支撑件; 以及电极单元,其布置在所述基板支撑件上方并设置有所述等离子体形成空间和所述源气体分配空间,其中所述等离子体形成空间与所述源气体分配空间在空间上分离。

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