Abstract:
The invention concerns a method for producing a triode-type cathode structure including steps for depositing and steps for etching a cathode layer to transform it to cathode conductors; a grid layer to transform it into grid conductors; an electrically insulating layer and the grid conductors until a resistive layer is achieved to provide cavities; cathode conductors to provide them with an open-work structure at the intersection of the cathode conductors and the grid conductors. The invention is characterized in that the steps for etching the grid conductors and the electrically insulating layer consist in: a) depositing a resin layer on the grid layer; b) patterning the resin layer by means of lithography to obtain emissive pads; c) etching the structured grid layer into grid conductors, based on the pattern; d) etching the insulating layer underlying the grid layer by enlarging the etching beyond the emissive pads; e) etching the grid layer at the zones exposed by etching the insulating layer until the resin layer is reached; f) depositing a catalyst layer into the openings of the resin layer so as to form the emissive pads at the base of the cavity; g) removing the resin layer.
Abstract:
Provided is a field emission display (FED) in which field emission devices are applied to a flat panel display. The FED includes: a cathode plate including a substrate, first and second thin film transistors (TFTs) that are serially connected on the substrate, a field emitter disposed on a drain electrode of the second TFT, a gate insulating layer having a gate hole surrounding the field emitter, and field emission gate electrodes disposed on the gate insulating layer; and an anode plate including a substrate, and red, green, and blue phosphors disposed on the substrate, wherein the cathode plate and the anode plate are vacuum-packaged parallel and opposite to each other. According to the present invention, uniformity of the FED panel can be significantly improved, and an inherent source-drain leakage current of the TFT can be significantly reduced, so that a contrast ratio of the FED can be significantly enhanced.
Abstract:
L'invention concerne un procédé de réalisation de nanostructures (104) sur un support, caractérisé en ce qu'il comprend les étapes suivantes : - fourniture d'un support comprenant, sur une de ses faces, une couche de surface (101), - recouvrement de la couche de surface par une couche de catalyseur (102) structurée selon un motif faisant apparaître des zones de la couche de surface couvertes par le catalyseur et des zones de la couche de surface non couvertes par le catalyseur, - gravure de l'épaisseur de la couche de surface (101) dans les zones non couvertes par la couche de catalyseur, - croissance sélective de nanostructures (104) sur les zones de la couche de surface couvertes par le catalyseur. L'invention permet également de réaliser des structures de cathode présentant des nanostructures électriquement indépendantes.
Abstract:
An emission layer 3 of an FED device has emitters which are caused to emit electrons or not according to whether or not a voltage on a gate 12, that is to say on a gate line 20 and thus at a gate aperture 121 surrounding the point 13 of the emitter generates an electric field at the point which is sufficiently high for electrons to be emitted from the point. For the voltages of the emitters and the gates of the pixel are controlled. Emitter lines 18 are arranged at the front face 19 of the substrate 4 parallel to one edge of the display and gate lines 20 are arranged at the front face 21 of the emission layer 3, orthogonal to the emitter lines. The front face is covered by an interface lamina 1011 forming part of the emission layer 130. The lamina 101 is a single thickness of fired photo imageable glass.
Abstract:
A display device comprises a plurality of electron sources (301) of a laminated structure consisting in a lower electrode, an insulation layer and an upper electrode; a plurality of row electrodes (310) for applying drive voltage to the lower electrodes of electron sources (301) in rows; and a plurality of column electrodes (311) for applying drive voltage to the upper electrodes of the electron sources (301) in columns. At least either the lower or upper electrode of each electron source (301) is connected through a resistor (305) to the row electrode (310) or the column electrode (311).
Abstract:
New designs of electron devices such as scanning probes and field emitters based on tip structure are proposed. The tips are prepared from whiskers that are grown from the vapor phase by the vapo-liquid-solid technology. The tip structure includes a single crystalline substrate and a single crystalline tip. The axes of the tip forms a given angle in respect to the vertical that passes through its basis.
Abstract:
An image forming device having an enclosure comprising a pair of mutually opposed substrates and an outer frame interposed between the substrates and further comprising in the enclosure an electron source provided on one of the substrates, an image forming member provided on the other substrate, and a spacer disposed between the substrates, wherein the spacer and the outer frame are conductive, and there is provided means for electrically connecting the spacer and the outer frame so that the equipotential surfaces between the spacer and the outer frame are generally parallel during drive.
Abstract:
A field emission device (FED) comprising an amorphous substrate; impurity diffusion preventing layer; FET formed on a formation surface of a semiconductor layer made of amorphous silicon or polycrystalline silicon; one or more emitters made by etching the semiconductor layer of the FET drain region; and extraction electrode. The semiconductor layer is made by CVD process. The emitter array is formed within a ring or polygonal FET drain region, and surrounded by the ring or polygonal gate electrode and source electrode. The entire FET region is covered with an insulation layer and metal layer. This configuration provides uniform current emission characteristics among emitter chips, and achieves uniform electron emissions to all directions. Application of present FED to a flat panel display device achieves high picture quality, low power consumption, and low manufacturing cost.
Abstract:
An electron emitting device comprising a first electrode (2) and an electron emitting part (24) provided on the first electrode (2) and constituted of particles or their aggregates (3), the particles (3) containing a carbonaceous material which has a carbon six-membered ring structure and contains, for example, graphite or carbon nanotube as its main component.
Abstract:
An electron-emitting device contains a vertical emitter resistor patterned into multiple laterally separated sections (34, 34V, 46, or 46V) situated between the electron-emissive elements (40), on one hand, and emitter electrodes (32), on the other hand. Sections of the resistor are spaced apart along each emitter electrode. The resistor can be formed in a manner self aligned to control electrodes (38 or 52A/58B) of the device or with a separate resistor mask.