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    PROBE FOR TESTING A DEVICE UNDER TEST
    111.
    发明申请
    PROBE FOR TESTING A DEVICE UNDER TEST 审中-公开
    用于测试测试中的设备的探测

    公开(公告)号：WO2004107401A3

    公开(公告)日：2005-03-31

    申请号：PCT/US2004012806

    申请日：2004-04-26

    Applicant: CASCADE MICROTECH INC ,  GLEASON K REED ,  LESHER TIM ,  ANDREWS MIKE ,  MARTIN JOHN

    Inventor： GLEASON K REED ,  LESHER TIM ,  ANDREWS MIKE ,  MARTIN JOHN

    IPC: G01R1/067 ,  G01R1/073 ,  G01R31/00

    CPC classification number: G01R1/07342 ,  G01R1/06738 ,  G01R1/06772

    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits at high frequencies include a coaxial cable (40) for supporting and electrically connected to a microstrip probe having a dielectric substrate (88), an elongated conductor (92), a conductive member (90) electrically connected to a ground signal support by a second side of the substrate (88) and wherein the conductive member is under a majority of the length of an elongate conductor located on a first side of the substrate, a conductive path (94) between the first and second side of the substrate (88), and a contact electrically connected to the conductive path for making contact with a device under test.

    Abstract translation: 用于测量高频集成电路的电特性的探针测量系统包括用于支撑并电连接到具有电介质基片（88）的微带探针的同轴电缆（40），细长导体（92），导电部件 90），其由所述基板（88）的第二侧电连接到接地信号支撑件，并且其中所述导电构件位于位于所述基板的第一侧上的细长导体的长度的大部分，导电路径（94） 在基板（88）的第一和第二侧之间，以及电连接到导电路径以便与被测器件接触的触点。

    SYSTEMS AND METHODS FOR ON-WAFER DYNAMIC TESTING OF ELECTRONIC DEVICES
    113.
    发明申请
    SYSTEMS AND METHODS FOR ON-WAFER DYNAMIC TESTING OF ELECTRONIC DEVICES 审中-公开
    电子设备的静态动态测试系统和方法

    公开(公告)号：WO2015130573A1

    公开(公告)日：2015-09-03

    申请号：PCT/US2015/016926

    申请日：2015-02-20

    Applicant: CASCADE MICROTECH, INC.

    Inventor： NEGISHI, Kazuki ,  HILL, Eric

    IPC: H01L21/66

    CPC classification number: G01R31/2601 ,  G01R31/2889

    Abstract: Systems and methods for on- wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conduclive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another lo selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.

    Abstract translation: 电子设备晶片动态测试的系统和方法。 该系统包括探针头组件，探针侧接触结构，卡盘和卡盘侧接触结构。 探头组件包括被配置为电接触被测器件（DUT）的第一侧的探针。 探针侧接触结构包括探针侧接触区域。 卡盘包括电导管支撑表面，其被配置为支撑包括DUT的基板并且电接触DUT的第二侧。 探针头组件和卡盘被配置为相对于彼此平移，lo选择性地建立探头和DUT之间的电接触。 卡盘侧接触结构包括与导电支撑表面电连通并与探针侧接触结构相对的卡盘侧接触区域。 这些方法可以包括操作系统或系统的方法。

    SYSTEMS, DEVICES, AND METHODS FOR TWO-SIDED TESTING OF ELECTRONIC DEVICES
    114.
    发明申请
    SYSTEMS, DEVICES, AND METHODS FOR TWO-SIDED TESTING OF ELECTRONIC DEVICES 审中-公开
    用于电子设备的两面测试的系统，设备和方法

    公开(公告)号：WO2013009609A1

    公开(公告)日：2013-01-17

    申请号：PCT/US2012/045733

    申请日：2012-07-06

    Applicant: CASCADE MICROTECH, INC. ,  CLEARY, Tim ,  HANAWAY, Peter ,  STRID, Eric ,  LESLIE, David ,  HILL, Eric ,  SMITH, Ken ,  GLEASON, K., Reed

    Inventor： CLEARY, Tim ,  HANAWAY, Peter ,  STRID, Eric ,  LESLIE, David ,  HILL, Eric ,  SMITH, Ken ,  GLEASON, K., Reed

    IPC: G01R31/02

    CPC classification number: G01R31/2884 ,  G01R31/2887

    Abstract: Systems, devices, and methods for two-sided testing of electronic devices. These systems, devices, and methods may include the use of a test fixture that is configured to electrically connect a back side electrical pad of a device under test with an auxiliary pad that faces in a different direction than the back side electrical pad. Additionally or alternatively, these systems, devices, and methods also may include the use of a probe head that is configured to form an electrical connection with both the auxiliary pad and a front side electrical pad of the device under test. The systems, devices, and methods also may include providing a test signal to the device under test, receiving a resultant signal from the device under test, and/or analyzing the resultant signal.

    Abstract translation: 用于电子设备双面测试的系统，设备和方法。 这些系统，装置和方法可以包括使用测试夹具，其被配置为将被测器件的背面电焊盘与面向不同于背面电焊盘的方向的辅助焊盘电连接。 附加地或替代地，这些系统，装置和方法还可以包括使用探针头，其被配置成与被测设备的辅助焊盘和前侧电焊盘形成电连接。 系统，设备和方法还可以包括向被测设备提供测试信号，从被测设备接收结果信号和/或分析所得到的信号。

    LOW INSERTION FORCE BGA SOCKET ASSEMBLY
    116.
    发明申请
    LOW INSERTION FORCE BGA SOCKET ASSEMBLY 审中-公开
    低插入力BGA插座组件

    公开(公告)号：WO2010078296A1

    公开(公告)日：2010-07-08

    申请号：PCT/US2009/069647

    申请日：2009-12-29

    Applicant: CASCADE MICROTECH, INC. ,  CAVEGN, Martin ,  SPANIER, Gregory D.

    Inventor： CAVEGN, Martin ,  SPANIER, Gregory D.

    IPC: H05K7/10

    CPC classification number: H05K7/1069 ,  H05K2201/10378 ,  H05K2201/10734

    Abstract: A socket assembly includes a housing with a plurality of through openings that extend between opposite surfaces of the housing. First and second plurality of contact members are positioned in a plurality of the through openings. The contact members each include major beams and minor beams with proximal ends attached to a center portion, and distal ends extending away from the center portion. The major beams preferably have a length greater than the minor beams. When the first circuit member is engaged with the socket assembly the ball grid array displaces the distal ends of the major beams to create a plurality of first and second forces. The first plurality of forces generally oppose the second plurality of forces. The first and second plurality of forces also generate an engagement force that biases the first circuit member toward the housing. The minor beams on the first and second plurality of contact members do not contribute to the engagement force.

    Abstract translation: 插座组件包括具有在壳体的相对表面之间延伸的多个通孔的壳体。 第一和第二多个接触构件定位在多个通孔中。 接触构件各自包括主梁和小梁，其近端附接到中心部分，远端远离中心部分延伸。 主梁优选地具有大于次梁的长度。 当第一电路构件与插座组件接合时，球栅阵列移动主梁的远端以产生多个第一和第二力。 第一多个力通常与第二多个力相对。 第一和第二多个力也产生使第一电路构件偏向壳体的接合力。 第一和第二多个接触构件上的次梁对接合力没有贡献。

    DIFFERENTIAL SIGNAL PROBING SYSTEM
    117.
    发明申请
    DIFFERENTIAL SIGNAL PROBING SYSTEM 审中-公开
    差分信号探测系统

    公开(公告)号：WO2007145727A3

    公开(公告)日：2009-04-16

    申请号：PCT/US2007010800

    申请日：2007-05-03

    Applicant: CASCADE MICROTECH INC ,  STRID ERIC ,  CAMPBELL RICHARD

    Inventor： STRID ERIC ,  CAMPBELL RICHARD

    IPC: G01R31/02

    CPC classification number: G01R1/06772

    Abstract: A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal.

    Abstract translation: 探头测量系统包括具有探针尖端的线性阵列的探针，使得能够在用差分信号探测测试结构时使用单个探针。

    DIFFERENTIAL SIGNAL PROBING SYSTEM
    120.
    发明申请
    DIFFERENTIAL SIGNAL PROBING SYSTEM 审中-公开
    差分信号探测系统

    公开(公告)号：WO2007145727A2

    公开(公告)日：2007-12-21

    申请号：PCT/US2007/010800

    申请日：2007-05-03

    Applicant: CASCADE MICROTECH, INC. ,  STRID, Eric ,  CAMPBELL, Richard

    Inventor： STRID, Eric ,  CAMPBELL, Richard

    IPC: G01R1/06

    CPC classification number: G01R1/06772

    Abstract: A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal.

    Abstract translation: 探头测量系统包括具有探针尖端的线性阵列的探针，使得能够在用差分信号探测测试结构时使用单个探针。

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