公开(公告)号：WO2004107829A2

公开(公告)日：2004-12-09

申请号：PCT/US2004/016421

申请日：2004-05-24

Applicant: REFLECTIVITY, INC. ,  TARN, Terry

Inventor： TARN, Terry

IPC: H05K

CPC classification number: B81C1/00269 ,  B81C2203/0181 ,  G02B26/0841 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/16195 ,  Y10T156/10 ,  H01L2924/00

Abstract: A novel method of packaging electronic devices (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, and light detecting device has been provided herein. The electronic device is placed between two substrates, at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium. The adhesion of the sealing medium to the substrates, especially when one of the two substrates is ceramic, can be improved by applying a metallization layer to the surface of the substrate.

Abstract translation: 本文提供了一种包括微机电装置，半导体装置，发光装置，光调制装置和光检测装置的电子装置（例如接收或发送电子信号的装置）的新颖方法。 电子设备放置在两个基板之间，其中至少一个具有用于保持电子设备的空腔。 然后将两个基板粘合并用密封介质气密密封。 密封介质对基材的粘附，特别是当两个基材中的一个是陶瓷时，可以通过将金属化层施加到基材的表面来改善。

公开(公告)号：WO2004106221A3

公开(公告)日：2004-12-09

申请号：PCT/US2004/014895

申请日：2004-05-12

Applicant: REFLECTIVITY, INC. ,  TARN, Terry

Inventor： TARN, Terry

IPC: H01L23/02

Abstract: A microelectromechanical device package with integral a heater (220) and a method for packaging the micro-electromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate (210) and second substrate (215), between which a microelectromechanical device, such as a micromirror array device is (105) located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer (230) is deposited, and heated by the heater (220) so as to bond the first and second package substrates together.

公开(公告)号：WO2004072696A3

公开(公告)日：2004-08-26

申请号：PCT/US2004/004441

申请日：2004-02-11

Applicant: REFLECTIVITY, INC. ,  PATEL, Satyadev, R. ,  HUIBERS, Andrew, G.

Inventor： PATEL, Satyadev, R. ,  HUIBERS, Andrew, G.

IPC: G02B26/00

Abstract: A spatial light modulator (200) is disclosed, along with methods for making such a modulator, that comprises an array of micromirrors (201) each having a hinge (240) and a micromirror plate (210) held via the hinge on a substrate (202), the micromirror plate being disposed in a plane separate from the hinge and having a diagonal (211) extending across the micromirror plate, the micromirror plate being attached to the hinge such that the micromirror plate can rotate along a rotation axis (214) that is parallel to, but off-set from the diagonal of the micromirror plate. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.

公开(公告)号：WO2003060920A1

公开(公告)日：2003-07-24

申请号：PCT/US2003/000600

申请日：2003-01-09

Applicant: REFLECTIVITY, INC. ,  RICHARDS, Peter

Inventor： RICHARDS, Peter

IPC: G11C11/24

CPC classification number: G09G3/34 ,  G02F1/136277 ,  G09G3/2018 ,  G09G3/346 ,  G09G3/3648 ,  G09G2300/08 ,  G09G2310/0235 ,  G09G2310/0251 ,  G11C11/401 ,  G11C11/404

Abstract: A voltage storage cell circuit includes an access transistor and a storage capacitor, wherein the source of said access transistor is connected to a bitline, the gate of said access transistor is connected to a wordline, and wherein the drain of said access transistor is connected to a first plate of said storage capacitor forming a storage node, and wherein the second plate of said storage capacitor is connected to a pump signal. This arrangement allows for a novel pixel circuit design with area requirements comparable to that of a 1T1C DRAM-like pixel cell, but with the advantage of an output voltage swing of the full range allowed by the breakdown voltage of the pass transistor. A spatial light modulator such as a micromirror array can comprise such a voltage storage cell.

Abstract translation: 电压存储单元电路包括存取晶体管和存储电容器，其中所述存取晶体管的源极连接到位线，所述存取晶体管的栅极连接到字线，并且其中所述存取晶体管的漏极连接到 所述存储电容器的第一板形成存储节点，并且其中所述存储电容器的第二板连接到泵浦信号。 这种布置允许具有与1T1C类DRAM像素单元的面积要求相当的面积要求的新型像素电路设计，但是具有通过晶体管的击穿电压允许的全范围的输出电压摆幅的优点。 诸如微镜阵列的空间光调制器可以包括这种电压存储单元。

公开(公告)号：WO02095800A3

公开(公告)日：2003-02-13

申请号：PCT/US0216224

申请日：2002-05-22

Applicant: REFLECTIVITY INC ,  PATEL SATYADEV R ,  HUIBERS ANDREW G ,  SCHAADT GREGORY P ,  HEUREUX PETER J

Inventor： PATEL SATYADEV R ,  HUIBERS ANDREW G ,  SCHAADT GREGORY P ,  HEUREUX PETER J

IPC: B81B3/00 ,  C23F1/00 ,  H01L21/00 ,  H01L21/302 ,  H01L21/306 ,  H01L21/461 ,  B81C5/00 ,  G02B26/08

CPC classification number: B81C1/00476 ,  B81C1/00547 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/112 ,  B82Y30/00

Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate (10); providing a sacrificial layer (20) directly or indirectly on the substrate; providing one or more micromechanical structural layers (30) on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer (20), the first etch comprising providing an etchant gas and energizing (42) the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material.

Abstract translation: 公开了一种诸如用于形成微机械装置的蚀刻方法。 该方法的一个实施例是用于释放微机械结构，包括提供衬底（10）; 在衬底上直接或间接提供牺牲层（20）; 在牺牲层上提供一个或多个微机械结构层（30）; 执行第一蚀刻以去除牺牲层（20）的一部分，所述第一蚀刻包括提供蚀刻剂气体并激发（42）蚀刻剂气体，以便使蚀刻剂气体在物理或化学和物理上移除部分 的牺牲层; 执行第二蚀刻以去除牺牲层中的附加牺牲材料，第二蚀刻包括提供化学上但不物理蚀刻附加牺牲材料的气体。

公开(公告)号：WO2002095800A2

公开(公告)日：2002-11-28

申请号：PCT/US2002/016224

申请日：2002-05-22

Applicant: REFLECTIVITY, INC. ,  PATEL, Satyadev, R. ,  HUIBERS, Andrew, G. ,  SCHAADT, Gregory, P. ,  HEUREUX, Peter, J.

Inventor： PATEL, Satyadev, R. ,  HUIBERS, Andrew, G. ,  SCHAADT, Gregory, P. ,  HEUREUX, Peter, J.

IPC: H01L

CPC classification number: B81C1/00476 ,  B81C1/00547 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/112 ,  B82Y30/00

Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.

Abstract translation: 公开了一种诸如用于形成微机械装置的蚀刻方法。 该方法的一个实施例是用于释放微机械结构，其包括：在衬底上直接或间接提供牺牲层; 在所述牺牲层上提供一个或多个微机械结构层; 执行第一蚀刻以去除牺牲层的一部分，所述第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体，以允许蚀刻剂气体在物理或化学和物理上去除牺牲层的该部分; 执行第二蚀刻以去除牺牲层中的附加牺牲材料，第二蚀刻包括提供化学上但不物理蚀刻附加牺牲材料的气体。 该方法的另一实施例是用于在衬底上或衬底内蚀刻硅材料，包括：执行第一蚀刻以去除硅的一部分，第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体以允许蚀刻剂 物理或化学和物理的气体去除硅的部分; 执行第二蚀刻以去除附加的硅，第二蚀刻包括提供蚀刻剂气体，其化学地但不物理地蚀刻附加的硅。

公开(公告)号：WO02075794A3

公开(公告)日：2002-11-14

申请号：PCT/US0207761

申请日：2002-03-15

Applicant: REFLECTIVITY INC ,  PATEL SATYADEV R ,  HUIBERS ANDREW G

Inventor： PATEL SATYADEV R ,  HUIBERS ANDREW G

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  H01L21/00 ,  H01L21/30 ,  H01L21/301 ,  H01L21/46

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on first substrate (5a). A second substrate is bonded onto the first substrate so a to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion (21) of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die (3a-3d) to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate (10) assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

Abstract translation: 公开了一种用于形成微机械装置的方法。 该方法包括在第一衬底（5a）上多次完全或部分地形成一个或多个微机械结构。 第二衬底被结合到第一衬底上以便覆盖每个具有一个或多个微机械结构的多个区域，以便形成衬底组件。 然后将基板组件分离成单独的模具，每个模具具有一个或多个微机械结构，其保持在第一基板的一部分（21）上，其中第二基板的一部分结合到第一基板部分。 最后，从每个管芯（3a-3d）移除第二衬底部分以露出第一衬底部分上的一个或多个微机械结构。 本发明还涉及一种用于形成微机械装置的方法，包括：在第一衬底上的一个或多个区域中形成一个或多个微机械结构; 将盖接合到第一基板上以覆盖每个具有一个或多个微机械结构的一个或多个区域，以便形成基板（10）组件; 在一段时间之后，移除盖以露出一个或多个微机械结构。 在接合盖子和稍后移除盖子之间的时间段期间，可以对基板组件进行单切割，检查，照射，退火，模具附接，运输和/或存储。

公开(公告)号：WO2006001918A3

公开(公告)日：2009-06-04

申请号：PCT/US2005016622

申请日：2005-05-12

Applicant: REFLECTIVITY INC ,  PAEL SATYADEV ,  HUIBERS ANDREW ,  RICHARDS PETER ,  TARN TERRY ,  DEHLINGER DIETRICH

Inventor： PAEL SATYADEV ,  HUIBERS ANDREW ,  RICHARDS PETER ,  TARN TERRY ,  DEHLINGER DIETRICH

IPC: G02B26/00 ,  G02B26/08

CPC classification number: G02B26/0841 ,  B81C3/001 ,  Y10S359/90 ,  Y10T156/10

Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on t substrates (116), In order to maintain uniformity of the gap between the substrates, a plurality of pillars (130A, 130B, 134A, 134B) is provided and distributed in the gap so as to prevent decrease of the gap size The increase of the gap size can be prevented by bondin the pillars to the components of the microstructure Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas electrical contact pads and electrical contact springs

Abstract translation: 本发明提供了一种微结构器件，其包括多个衬底，其中器件的部件形成在t衬底（116）上。为了保持衬底之间的间隙的均匀性，多个柱（130A，130B，134A，134B）是 间隙设置并分布，以防止间隙尺寸的减小可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。或者，可以通过将压力保持在内部来防止间隙尺寸的增加 微结构将在其下进行工作的压力之间的间隙可以通过许多方式制造其上形成微反射镜和电极的基板的电接触，例如电接触区域电接触焊盘和电接触弹簧

公开(公告)号：WO2005077037A3

公开(公告)日：2008-09-04

申请号：PCT/US2005004009

申请日：2005-02-09

Applicant: REFLECTIVITY INC ,  CUTLER GREGORY ,  HUIBERS ANDREW

Inventor： CUTLER GREGORY ,  HUIBERS ANDREW

IPC: F21V7/00 ,  F21V1/00 ,  G02B6/00 ,  G02B6/42

CPC classification number: G02B6/4298 ,  G02B6/0001 ,  H04N9/315

Abstract: The present invention provides an illumination system having a light source (124) for emitting light and a reflector (122) having a reflective surface () for collecting and reflecting the light from the light source.

Abstract translation: 本发明提供了一种具有用于发射光的光源（124）和具有用于收集和反射来自光源的光的反射表面（）的反射器的照明系统。

公开(公告)号：WO2005022312A3

公开(公告)日：2006-11-16

申请号：PCT/US2004027120

申请日：2004-08-19

Applicant: REFLECTIVITY INC ,  RICHARDS PETER

Inventor： RICHARDS PETER

IPC: G09G3/34 ,  G06F20060101

CPC classification number: G09G3/346 ,  G09G3/2014 ,  G09G3/2022 ,  G09G2300/08 ,  G09G2310/0235

Abstract: Data processing methods and apparatus used in digital display system transpose pixel-by-pixel data into bitplane-by-bitplane data. The methods and apparatus are especially useful for dynamically transposing high-speed flowing-through pixel data in a "real-time" fashion. In a transpose process, a stream of pixel data is received by a plurality of input lines of the transpose apparatus. The received pixel data are delayed by a set of delay units and then permutated by one or more switches according to a predefined delay scheme and permutation rule. After permutation, the stream of data is delayed so as to finalize the transpose process.

Abstract translation: 数字显示系统中使用的数据处理方法和装置将逐像素数据转换成逐位平面数据。 该方法和装置对于以“实时”方式动态地转置高速流通像素数据特别有用。 在转置处理中，由转置装置的多条输入线接收像素数据流。 接收到的像素数据被延迟一组延迟单元，然后根据预定义的延迟方案和置换规则由一个或多个开关置换。 排列后，数据流被延迟，以便最终确定转置过程。