Abstract:
PROBLEM TO BE SOLVED: To minimize diffracted light in a switching direction with respect to a mobile micromirror and a micromirror array in a projection display device or the like. SOLUTION: A micromirror being not rectangular is adopted in order to minimize diffraction of light in the switching direction, namely, diffraction of light to a light receiving cone of a light condensing system. In order to minimize the cost of an irradiation system and the size of a display unit, a light source is arranged perpendicularly to rows (or columns) of an array or perpendicularly to a side of a frame demarcating an effective area of the array. Incident light is not practically perpendicular to side surfaces of individual micromirrors in the array. Perpendicular side surfaces diffract incident light in the direction of micromirror switching. This light diffraction decreases the contrast ratio of the micromirror, and thus an improved and more compact system is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide micromirrors to minimize light diffraction along the direction of switching and more particularly light diffraction into the acceptance cone of a collection optics. SOLUTION: In the present invention, a light source is placed orthogonal to the rows (or columns) of an array, and/or the light source is placed orthogonal to a side of the frame defining the active area of the array. An incident light beam, though orthogonal to the sides of the active area, is not however, orthogonal to any substantial portion of sides of the individual micromirrors in the array. Orthogonal sides cause incident light to diffract along the direction of micromirror switching, and result in minimum light leakage into 'on' state even if the micromirrors are in the 'off' state to thereby improve a contrast ratio. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide micromirrors which are not rectangular to minimize light diffraction along the direction of switching and more particularly light diffraction into the acceptance cone of a collection optics. SOLUTION: A light source 114 is placed orthogonal to the rows (or columns) of the array, and/or the light source 114 is placed orthogonal to a side of the frame defining the active area 94 of the array. An incident light beam 116, though orthogonal to the sides of the active area, is not substantially orthogonal to any side surface of the individual micromirrors in the array. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide micromirrors which are not rectangular to minimize light diffraction along the direction of switching and more particularly light diffraction into the acceptance cone of a collection optics. SOLUTION: A light source is placed orthogonal to the rows (or columns) of the array, and/or the light source is placed orthogonal to a side of the frame defining the active area of the array. An incident light beam, though orthogonal to the sides of the active area, is not however, orthogonal to any substantial portion of sides of the individual micromirrors in the array. This structure and design suppress the light diffraction and improve contrast ratio, and the arrangement of the light source to micromirror array results in a more compact system. The micromirrors pivot in opposite direction to on and off positions, where the movement to the on position is greater than movement to the off position. A package has a window that is not parallel to the substrate upon which the micromirrors are formed. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Abstract:
An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.
Abstract:
A projection system, a spatial light modulator, and a method for forming a MEMS device are disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micro-mirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers if desired. In one embodiment of the invention, one of the substrates is a light transmissive substrate and a light blocking layer that is preferably a light absorbing layer is provided on the light transmissive substrate to selectively block light from passing through the substrate. The light blocking layer can be formed as a pattern, such as a grid or strips for blocking light from entering gaps between adjacent micro-mirrors.
Abstract:
A color wheel is disclosed that has at least one segment that occupies, for a given radius, a percentage of the circumference of the wheel at that radius, which percentage varies continuously or in multiple steps from a radially inward point to a radially outer point on the wheel. In one embodiment, the color wheel has a plurality of filter segments adjacent each other around the circumference of the wheel, wherein at least one of the transitions from one filter segment to the next is curved or stepped. A color wheel also is disclosed that has a plurality of filter segments adjacent each other around the circumference of the wheel, wherein at least one of the segments is a higher brightness segment than the others and has sides facing adjacent filter segments that do not lie on the radius of the wheel. A projection system is also disclosed that has a light source, a unique color wheel, a spatial light modulator, and projection optics.
Abstract:
A spatial light modulator (12) includes an upper optically transmissive substrate (20) held above a lower substrate (34) containing addressing circuitry (36). One or more electrostatically deflectable elements (48) are suspended by hinges (50) from the upper substrate (20). In operation, individual mirrors (48) are selectively deflected and serve to spatially modulate light (56) that is incident to, and then reflected back through, the upper substrate (20). Motion stops (49) may be attached to the reflective deflectable elements so that the mirror (48) does not snap to the bottom substrate (34). Instead, the motion stop (49) rests against the upper substrate (20) thus limiting the deflection angle of the reflective deflectable elements (48).
Abstract:
An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.