Abstract:
This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. Amulti-functionmemory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.
Abstract:
A gateway apparatus for performing transfer control of frame data between communication channels includes a routing map that stores ID information about the frame data and information about a communication channel that uses the ID information, and a search engine unit that routes the frame data to a transfer destination on the basis of the ID information of the frame data received and the routing map-The search engine unit does not transfer the frame data to the transfer destination when the ID information about the frame data received is ID information that is not used in the communication channel through which the frame data is received.
Abstract:
A gateway apparatus for performing transfer control of frame data between communication channels includes a routing map that stores ID information about the frame data and information about a communication channel that uses the ID information, and a search engine unit that routes the frame data to a transfer destination on the basis of the ID information of the frame data received and the routing map-The search engine unit does not transfer the frame data to the transfer destination when the ID information about the frame data received is ID information that is not used in the communication channel through which the frame data is received.
Abstract:
An error detector has a parity bit generator which generates error detection data for data strings sent from a CPU I/F to a memory, a parity checker which detects an error in the data strings output from the memory based on the error detection data, and a selector circuit which switchingly outputs the data from the parity bit generator and the data from a CPU which sends diagnostic data. While the selector circuit is switched to output the data from the CPU, based on the error detection data output from the selector circuit, the error detector conducts a failure diagnosis of error detection functions including at least one of the parity bit generator and the parity checker.
Abstract translation:错误检测器具有产生从CPU I / F发送到存储器的数据串的错误检测数据的奇偶校验位产生器,基于检错数据检测从存储器输出的数据串中的错误的奇偶检验器,以及 选择器电路,其切换地输出来自奇偶位产生器的数据和来自发送诊断数据的CPU的数据。 当选择器电路切换以从CPU输出数据时,基于从选择器电路输出的错误检测数据,错误检测器进行错误检测功能的故障诊断,包括奇偶位产生器和奇偶校验器中的至少一个 。
Abstract:
The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.
Abstract:
A semiconductor device comprises a floating gate which is formed on a semiconductor substrate of a first conductive type interposing a first gate insulation layer therebetween, a second charge retaining area which is formed on the semiconductor substrate interposing a second insulation layer, a control gate which is formed on the floating gate interposing a second gate insulation layer therebetween, a second gate electrode which extends in the first direction and which is formed on the second charge retaining region interposing the second gate insulation layer therebetween, and a semiconductor layer which extends in a second direction and which is formed on the semiconductor substrate so as to intersect the first and the second gate electrode are provided; wherein an n-type conductive region of a second conductive type is formed on the semiconductor layer. Consequently, it achieves high-integration of a semiconductor device.
Abstract:
In non-volatile storage device using a variable resistance material, when a crystal state and a noncrystalline state co-exists in the variable resistance material, a crystallization time is shorted, resulting in decrease of the time to maintain information stored. Heat radiation is not rapidly performed during rewriting and thus it takes a long time to complete the rewriting due to a low thermal conductivity of a material contacting the variable resistance material. According to the present invention, a contact area between a variable resistance material and a lower electrode, and a contact area between the variable resistance material and an upper electrode are made equal to each other, thereby unifying a current path. The invention provides a structure in which a material having a high thermal conductivity is disposed so as to contact a sidewall of the variable resistance material, and its end portion is made to contact the lower electrode as well.
Abstract:
For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.
Abstract:
A method of fabricating a semiconductor device including a first wiring pattern extending in a vertical direction and a second wiring pattern identical in geometry to the first wiring pattern and extending in a (horizontal) direction orthogonal to the vertical direction, including the steps of: employing linearly polarized illumination to perform exposure along a mask pattern including mask patterns (16, 17) used to form the first and second wiring patterns, respectively; and subsequently forming the first and second wiring patterns having a geometry along the mask patterns. The mask patterns to form the first and second wiring patterns are formed to be different in geometry.
Abstract:
A first nitrogen-containing insulating film is formed under a low dielectric constant film, in which a via hole is formed, with a first nitrogen-non-containing insulating film interposed between the first nitrogen-containing insulating film and the low dielectric constant film. A second nitrogen-containing insulating film is formed over the low dielectric constant film with a second nitrogen-non-containing insulating film interposed therebetween.