Semiconductor memory device and method for producing the same
    116.
    发明公开
    Semiconductor memory device and method for producing the same 审中-公开
    Halbleiterspeicherbauelement und Herstellungsverfahrendafür

    公开(公告)号:EP1806788A2

    公开(公告)日:2007-07-11

    申请号:EP06026218.5

    申请日:2006-12-18

    Abstract: A semiconductor device comprises a floating gate which is formed on a semiconductor substrate of a first conductive type interposing a first gate insulation layer therebetween, a second charge retaining area which is formed on the semiconductor substrate interposing a second insulation layer, a control gate which is formed on the floating gate interposing a second gate insulation layer therebetween, a second gate electrode which extends in the first direction and which is formed on the second charge retaining region interposing the second gate insulation layer therebetween, and a semiconductor layer which extends in a second direction and which is formed on the semiconductor substrate so as to intersect the first and the second gate electrode are provided; wherein an n-type conductive region of a second conductive type is formed on the semiconductor layer. Consequently, it achieves high-integration of a semiconductor device.

    Abstract translation: 半导体器件包括浮置栅极,其形成在其间插入第一栅极绝缘层的第一导电类型的半导体衬底上,形成在插入第二绝缘层的半导体衬底上的第二电荷保持区域,控制栅极 形成在浮置栅极上,在其间插入第二栅极绝缘层的第二栅电极,第二栅电极,沿第一方向延伸并形成在第二栅极绝缘层之间的第二电荷保持区域上;以及半导体层,其在第二栅极绝缘层中延伸 并且形成在半导体基板上以与第一和第二栅电极相交的方向; 其中在所述半导体层上形成第二导电类型的n型导电区域。 因此,实现了半导体器件的高集成度。

    NONVOLATILE MEMORY
    117.
    发明公开
    NONVOLATILE MEMORY 有权
    NICHTFLÜCHTIGERSPEICHER

    公开(公告)号:EP1793424A1

    公开(公告)日:2007-06-06

    申请号:EP05765318.0

    申请日:2005-07-04

    Abstract: In non-volatile storage device using a variable resistance material, when a crystal state and a noncrystalline state co-exists in the variable resistance material, a crystallization time is shorted, resulting in decrease of the time to maintain information stored. Heat radiation is not rapidly performed during rewriting and thus it takes a long time to complete the rewriting due to a low thermal conductivity of a material contacting the variable resistance material.
    According to the present invention, a contact area between a variable resistance material and a lower electrode, and a contact area between the variable resistance material and an upper electrode are made equal to each other, thereby unifying a current path. The invention provides a structure in which a material having a high thermal conductivity is disposed so as to contact a sidewall of the variable resistance material, and its end portion is made to contact the lower electrode as well.

    Abstract translation: 在使用可变电阻材料的非易失性存储装置中,当晶体状态和非结晶状态在可变电阻材料中共存时,结晶时间短路,导致维持信息存储的时间减少。 在重写期间热辐射不会迅速进行,因此由于与可变电阻材料接触的材料的低导热性,完成重写需要很长时间。 根据本发明,可变电阻材料和下电极之间的接触面积和可变电阻材料与上电极之间的接触面积彼此相等,从而使电流通路一致。 本发明提供了一种结构,其中设置具有高导热性的材料以便接触可变电阻材料的侧壁,并且其端部也与下电极接触。

    SEMICONDUCTOR DEVICE
    118.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开
    HALBLEITERBAUELEMENT

    公开(公告)号:EP1755165A1

    公开(公告)日:2007-02-21

    申请号:EP05741426.0

    申请日:2005-05-19

    Abstract: For example, one memory cell is configured using two memory cell transistors and one phase change element by disposing a plurality of diffusion layers in parallel to a bit-line, disposing gates between the diffusion layers so as to cross the bit-line, disposing bit-line contacts and source contacts alternately to the plurality of diffusion layers arranged in a bit-line direction for each diffusion layer, and providing a phase change element on the source contact. Also, the phase change element can be provided on the bit-line contact instead of the source contact. By this means, for example, increase in drivability of the memory cell transistors and reduction in area can be realized.

    Abstract translation: 例如,使用两个存储单元晶体管和一个相变元件配置一个存储单元,通过将多个扩散层与位线平行地布置,在扩散层之间设置栅极以跨越位线,布置位 线接触和源触点交替地布置到针对每个扩散层的位线方向上的多个扩散层,以及在源极触点上提供相变元件。 此外,相位元件可以设置在位线触点上而不是源极触点。 通过这种方式,例如,可以实现存储单元晶体管的驱动性的提高和面积的减小。

    PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE AND METHOD FOR GENERATING MASK PATTERN DATA
    119.
    发明公开
    PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE AND METHOD FOR GENERATING MASK PATTERN DATA 审中-公开
    用于生产半导体部件和产生光掩膜数据结构

    公开(公告)号:EP1635217A1

    公开(公告)日:2006-03-15

    申请号:EP04807522.0

    申请日:2004-12-22

    CPC classification number: G03F7/70425 G03F7/70441

    Abstract: A method of fabricating a semiconductor device including a first wiring pattern extending in a vertical direction and a second wiring pattern identical in geometry to the first wiring pattern and extending in a (horizontal) direction orthogonal to the vertical direction, including the steps of: employing linearly polarized illumination to perform exposure along a mask pattern including mask patterns (16, 17) used to form the first and second wiring patterns, respectively; and subsequently forming the first and second wiring patterns having a geometry along the mask patterns. The mask patterns to form the first and second wiring patterns are formed to be different in geometry.

    Abstract translation: 一种半导体器件,其包括第一布线图案在垂直方向上延伸并在几何上的第一布线图案的第二布线相同的图案,并在(水平)方向垂直延伸的垂直方向上,包括以下步骤的制造方法:用人 线性偏振照明沿着掩模图案包含​​用于形成第一和第二布线图案,分别掩模图案(16,17)进行曝光; 并随后形成具有沿着所述掩模图案的几何形状的第一和第二布线图案。 掩模图案,以形成第一和第二布线图案形成为在不同的几何形状。

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