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公开(公告)号：KR1020040090891A
公开(公告)日：2004-10-27
申请号：KR1020030049918
申请日：2003-07-21
Applicant: 삼성전자주식회사
IPC: H03H3/02
CPC classification number: H03H9/205 , H03H3/02 , H03H9/02094 , H03H9/173
Abstract: PURPOSE: A single chip duplexer for bonding a substrate and a fabricating method thereof are provided to simplify a fabrication process by using an air gap type FBAR and an isolation part. CONSTITUTION: A first air gap and a second air gap are formed on an upper surface of a substrate(410). A second insulating layer(420) is deposited on the substrate of both sides of the first and the second gaps. A first air gap type FBAR is formed by fabricating a first laminated resonance part on the first air gap. A second air gap type FBAR is formed by fabricating the first laminated resonance part on the second air gap. An isolation part(500) is formed between the first air gap type FBAR and the second air gap type FBAR.
Abstract translation: 目的：提供一种用于粘合基板的单芯片双工器及其制造方法，以通过使用气隙型FBAR和隔离部分来简化制造工艺。 构成：在基板（410）的上表面上形成第一气隙和第二气隙。 第二绝缘层（420）沉积在第一和第二间隙的两侧的基板上。 第一气隙型FBAR通过在第一气隙上制造第一层叠共振部而形成。 第二气隙型FBAR通过在第二气隙上制造第一层叠共振部而形成。 在第一气隙型FBAR和第二气隙型FBAR之间形成隔离部（500）。
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公开(公告)号：KR102227504B1
公开(公告)日：2021-03-15
申请号：KR1020130093689
申请日：2013-08-07
Applicant: 삼성전자주식회사
Abstract: 복수의송신공진기에대한무선전력송신장치및 방법이제공된다. 일실시예에따르면, 무선전력송신장치는수신공진기와매칭되는공진주파수를가지도록설계된송신공진기를적어도둘 이상포함하는다중공진기, 다중공진기로입력주파수의전력을인가하는급전부및 수신공진기가수신하는전력이안정적으로공급되도록입력주파수를제어하는주파수제어부를포함한다.
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