公开(公告)号：EP4210097A1

公开(公告)日：2023-07-12

申请号：EP22205731.7

申请日：2022-11-07

Applicant: INTEL Corporation

Inventor： SAIN, Arghya ,  COLLINS, Andrew ,  PANDI, Sivaseetharaman ,  XIE, Jianyong ,  KAMGAING, Telesphor

IPC: H01L23/15 ,  H01L23/498

Abstract: Embodiments disclosed herein include a package core. In an embodiment, the package core includes a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises glass. In an embodiment, a third layer is over the second layer, where the third layer comprises glass. In an embodiment, a first trace is between the first layer and the second layer. In an embodiment, a second trace is between the second layer and the third layer.

公开(公告)号：EP4199070A1

公开(公告)日：2023-06-21

申请号：EP22213185.6

申请日：2022-12-13

Applicant: INTEL Corporation

Inventor： PANDI, Sivaseetharaman ,  COLLINS, Andrew ,  SAIN, Arghya ,  KAMGAING, Telesphor

IPC: H01L23/15 ,  H01L23/498 ,  H01L23/64

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a core, where the core comprises glass, and a first via through the core. In an embodiment, a first fin extends out laterally from the first via. In an embodiment, the electronic package further comprises a second via through the core, and a second fin extending out laterally from the second via. In an embodiment, a face of the first fin overlaps a face of the second fin.

公开(公告)号：EP3764466A1

公开(公告)日：2021-01-13

申请号：EP20175888.5

申请日：2015-12-22

Applicant: INTEL Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K.

IPC: H01Q1/22 ,  H01Q1/40 ,  H01Q3/26 ,  H01Q1/28 ,  H01Q23/00 ,  H01Q25/00 ,  G06F1/16 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q21/28

Abstract: Embodiments of the invention include a microelectronic device comprising a package substrate; an antenna within the package substrate, wherein the antenna is configured to transmit or receive wireless communications with a frequency of at least 24 gigahertz; and a die physically coupled with the package substrate within the microelectronic device, wherein the die includes circuitry related to transmission or reception of a wireless communication.

公开(公告)号：EP3732785A1

公开(公告)日：2020-11-04

申请号：EP17936634.9

申请日：2017-12-28

Applicant: INTEL Corporation

Inventor： EID, Feras ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H03H9/64 ,  H03H9/25 ,  H03H9/145

公开(公告)号：EP3712939A1

公开(公告)日：2020-09-23

申请号：EP20156740.1

申请日：2020-02-11

Applicant: INTEL Corporation

Inventor： ELSHERBINI, Adel A. ,  DOGIAMIS, Georgios ,  LIFF, Shawna ,  SWAN, Johanna ,  KAMGAING, Telesphor ,  BRAUNISCH, Henning ,  ALEKSOV, Aleksandar

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/485

Abstract: Embodiments may relate to a microelectronic package that includes a radio frequency (RF) chip coupled with a die by interconnects with a first pitch. The RF chip may further be coupled with a waveguide of a package substrate by interconnects with a second pitch that is different than the first pitch. The RF chip may facilitate conveyance of data to the waveguide as an electromagnetic signal with a frequency greater than approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：EP3506418A1

公开(公告)日：2019-07-03

申请号：EP18209354.2

申请日：2018-11-29

Applicant: INTEL Corporation

Inventor： ELSHERBINI, Adel A. ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  EWY, Erich N. ,  KAMGAING, Telesphor ,  SWAN, Johanna M.

IPC: H01P5/107 ,  H04W4/38 ,  H04W4/40 ,  G05D1/00 ,  H01Q1/32 ,  H04L12/40

Abstract: Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.

公开(公告)号：EP2705572B1

公开(公告)日：2018-11-21

申请号：EP12779473.3

申请日：2012-04-27

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor

IPC: H01Q21/12 ,  H01Q1/12 ,  H01L23/552 ,  H01Q3/26 ,  H01Q21/06 ,  H01Q1/22 ,  H01L23/00 ,  H01Q21/00

CPC classification number: H01Q1/1271 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32155 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01Q1/2283 ,  H01Q3/26 ,  H01Q21/0087 ,  H01Q21/0093 ,  H01Q21/065 ,  Y10T29/49016 ,  H01L2924/00

Abstract: A glass-based, high-performance 60 GHz/mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned.

公开(公告)号：EP3050098A1

公开(公告)日：2016-08-03

申请号：EP13894760.1

申请日：2013-09-27

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  RAO, Valluri R.

IPC: H01L23/48

CPC classification number: H01L23/66 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2223/6672 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582

Abstract: A die package is described that includes a substrate to carry passive components. In one example, the package has a semiconductor die having active circuitry near a front side of the die and having a back side opposite the front side, and a component substrate near the back side of the die. A plurality of passive electrical components are on the component substrate and a conductive path connects a passive component to the active circuitry. The die has a silicon substrate between the front side and the back side and the conductive path is a through-silicon via through the die from the back side to the active circuit.

Abstract translation: 描述了包括用于承载无源部件的基板的管芯封装。 在一个示例中，封装具有半导体管芯，该半导体管芯具有靠近管芯前侧的有源电路，并具有与前侧相反的背面，以及靠近管芯背侧的部件衬底。 多个无源电组件在组件衬底上，并且导电路径将无源组件连接到有源电路。 芯片在前侧和后侧之间具有硅衬底，并且导电路径是从后侧到有源电路的通过芯片的穿硅通孔。

公开(公告)号：EP3026755A1

公开(公告)日：2016-06-01

申请号：EP15191354.8

申请日：2015-10-23

Applicant: Intel Corporation

Inventor： ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  HERRERO, Pablo ,  RAAF, Bernhard

IPC: H01Q1/24

CPC classification number: H04W24/08 ,  H01Q1/245 ,  H04B7/04

Abstract: Described herein are architectures, platforms and methods for implementing an antenna array with a dynamic polarization adjustment in a portable device.

Abstract translation: 这里描述了用于在便携式设备中实现具有动态极化调整的天线阵列的架构，平台和方法。

公开(公告)号：EP2705532A2

公开(公告)日：2014-03-12

申请号：EP12779644.9

申请日：2012-04-27

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  RAO, Valluri R.

IPC: H01L23/66 ,  H05K9/00

Abstract: An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio- and electromagnetic interference.