-
公开(公告)号:EP1454349A2
公开(公告)日:2004-09-08
申请号:EP02793902.4
申请日:2002-11-08
Applicant: Coventor, Incorporated , Turnstone Systems Inc.
Inventor: CUNNINGHAM, Shawn, J. , TATIC-LUCIC, Sveltana
IPC: H01L21/302 , H01L21/4763 , H01P1/10 , H01H57/00 , H02B1/00
CPC classification number: B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
Abstract: A method for fabricating a trilayered beam MEMS device includes depositing a sacrificial layer (310) on a substrate and depositing and removing a portion of a first conductive layer on the sacrificial layer (310) to form a first conductive microstructure (312); depositing a structural layer (322) on the first conductive microstructure (312); the sacrificial layer (310), and the substrate (300) and forming a via through the structural layer (322) to the first conductive microstructure (312); depositing a second conductive layer (336) on the structural layer (322) and in the via; forming a second conductive microstructure (324) by removing a portion of the second conductive layer (336), wherein the second conductive microstructure (324) electrically communicates with the first conductive microstructure (312) through the via; and removing a sufficient amount of the sacrificial layer (310) so as to separate the first conductive microstructure (312) from the substrate, wherein the structural layer (322) is supported by the substrate at a first end is freely suspended above the substrate at an opposing second end.
-
112.
公开(公告)号:EP1454333A1
公开(公告)日:2004-09-08
申请号:EP02797085.4
申请日:2002-11-08
Applicant: Conventor, Incorporated , Turnstone Systems Inc.
Inventor: CUNNINGHAM, Shawn, J. , DEREUS, Dana, R. , Sett, Subham , TATIC-LUCIC, Svetlana
IPC: H01H57/00
CPC classification number: B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
Abstract: A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).
-
公开(公告)号:KR1020130118228A
公开(公告)日:2013-10-29
申请号:KR1020127033926
申请日:2011-06-08
Applicant: 인터내셔널 비지네스 머신즈 코포레이션
Inventor: 던바,조지,에이. , 허,중-샹 , 몰링,제프리,씨. , 머피,윌리암,제이. , 스탬퍼,앤서니,케이.
IPC: H01L29/84
CPC classification number: B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
Abstract: 적어도 하나의 미세전자기계시스템 (MEMS)를 형성하는 방법은 기판상에 하부 배선 층을 형성하는 단계를 포함한다. 상기 방법은 상기 하부 배선 층으로부터 복수의 분리된 와이어들 (14)를 형성하는 단계를 더 포함한다. 상기 방법은 상기 복수의 분리된 와이어들 위에 전극빔 (38)을 형성하는 단계를 더 포함한다. 상기 전극빔과 상기 복수의 분리된 와이어들을 형성하는 단계 중 적어도 하나는 후속 실리콘 증착 (50)에서 힐록(hillock)들과 트리플 포인트(triple point)들을 최소화하는 레이아웃으로 형성된다.
-
公开(公告)号:KR1020100041710A
公开(公告)日:2010-04-22
申请号:KR1020097027214
申请日:2008-06-26
Applicant: 알카텔-루센트 유에스에이 인코포레이티드
IPC: B81B3/00
CPC classification number: H01H1/0036 , B81B3/0024 , B81B2201/014 , B81B2201/031 , H01H37/00 , H01H2001/0047 , H01H2037/008 , H01H2061/006 , H01H2061/008
Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.
Abstract translation: 本发明提供一种双向微电子机械元件,包括双向元件的微机电开关,以及减少双向元件中机械蠕变的方法。 在一个实施例中,双向微机电元件包括具有自由端的冷梁和连接到冷束锚的第一端。 冷梁锚附接到基板。 第一束对通过自由端系绳连接到冷束,并且被构造成在被加热时延伸到比冷束的温度更大的温度。 第二光束对位于与第一光束对的冷光束的相对侧上,并且通过自由端系绳耦合到第一光束对和冷光束。 第二束对被配置成在被加热时延长到更高的温度。
-
公开(公告)号:KR1020080091140A
公开(公告)日:2008-10-09
申请号:KR1020087016893
申请日:2006-12-19
Applicant: 폼팩터, 인코포레이티드
CPC classification number: B81C1/0046 , B33Y10/00 , B81B2201/014 , B81B2203/0118 , B81C2201/0184 , B81C2201/0197 , C23C18/1608 , C23C18/1844 , C25D1/003 , C25D1/12 , C25D5/02 , G01R1/06755 , G01R3/00 , H01L21/288 , H01L21/76873 , H01L2924/0001 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/1461 , H05K3/1275 , H01L2224/13099 , H01L2924/00
Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 可以将结构材料电沉积到种子层上以产生三维结构。
-
公开(公告)号:KR1020060017499A
公开(公告)日:2006-02-23
申请号:KR1020057020130
申请日:2004-04-15
Applicant: 심플러 네트웍스, 인코포레이티드
Inventor: 메나르,스테파네 , 라송드,노르망 , 빌레네브,쟝-끌로드
CPC classification number: H01H61/04 , B81B3/0024 , B81B2201/014 , B81B2203/0118 , B81B2203/051 , B81B2203/053 , F03G7/06 , H01H2001/0047 , H01H2001/0078 , H01H2061/006 , H01H2061/008
Abstract: The MEMS cantilever actuator (10) is designed to be mounted on a substrate (12). The actuator (10) comprises an elongated hot arm member (20) having two spaced-apart portions (22), each provided at one end with a corresponding anchor pad (24) connected to the substrate (12). The portions (22) are connected together at a common end (26) that is opposite the anchor pads (24). It further comprises an elongated cold arm member (30) adjacent to and substantially parallel of the hot arm member (20), the cold arm member (30) having at one end an anchor pad (32) connected to the substrate (12), and a free end (34) that is opposite the anchor pad (32) thereof. A dielectric tether (40) is attached over the common end (26) of the portions (22) of the hot arm member (20) and the free end (34) of the cold arm member (30). This actuator (10) allows improving the performance, reliability and manufacturability of MEMS switches (100).
Abstract translation: MEMS悬臂致动器(10)设计成安装在基板(12)上。 致动器(10)包括具有两个间隔开的部分(22)的细长的热臂构件(20),每个部分(22)的一端设置有连接到基板(12)的相应的锚固垫(24)。 部分(22)在与锚垫(24)相对的共同端(26)处连接在一起。 其还包括与热臂构件(20)相邻并且基本平行的细长的冷臂构件(30),冷臂构件(30)在一端具有连接到衬底(12)的锚垫(32) 和与其固定垫(32)相对的自由端(34)。 介质系绳(40)安装在热臂构件(20)的部分(22)和冷臂构件(30)的自由端(34)的共同端部(26)上。 该致动器(10)允许改善MEMS开关(100)的性能,可靠性和可制造性。
-
公开(公告)号:WO2014105178A1
公开(公告)日:2014-07-03
申请号:PCT/US2013/047796
申请日:2013-06-26
Applicant: INTEL CORPORATION , HSU, Hao-han , MAHAMEED, Rashed , ABDELMONEUM, Mohamed, A. , HAN, Dong-ho
Inventor: HSU, Hao-han , MAHAMEED, Rashed , ABDELMONEUM, Mohamed, A. , HAN, Dong-ho
CPC classification number: H01H59/0009 , B81B3/0056 , B81B2201/014 , B81B2203/0118 , H01H2001/0084 , H01H2057/006 , H01L41/094 , Y10T29/42
Abstract: Methods and systems may provide for a hybrid RF MEMS component design including an electrostatic actuation and a piezoelectric actuation. In one example, the method may include applying a first voltage to generate a first piezoelectric force to reduce a first gap between a cantilever and an actuation electrode, and applying a second voltage to generate an electrostatic force to create contact between the cantilever and a transmission electrode.
Abstract translation: 方法和系统可以提供包括静电致动和压电致动的混合RF MEMS部件设计。 在一个示例中,该方法可以包括施加第一电压以产生第一压电力以减小悬臂与致动电极之间的第一间隙,以及施加第二电压以产生静电力以产生悬臂与传动之间的接触 电极。
-
公开(公告)号:WO2012011703A3
公开(公告)日:2012-03-29
申请号:PCT/KR2011005260
申请日:2011-07-18
Applicant: KOMICO LTD , CHOI JEONG-DUCK , YUK HYUN-MI , CHOI JIN-SIK , PARK CHANG-HYUN
Inventor: CHOI JEONG-DUCK , YUK HYUN-MI , CHOI JIN-SIK , PARK CHANG-HYUN
CPC classification number: H01H59/0009 , B81B3/007 , B81B2201/014 , B81B2203/0118 , B81B2203/019
Abstract: According to the MEMS switch and the method for manufacturing same of the present invention, the MEMS switch includes a substrate, a first terminal formed on the substrate, a second terminal formed on the substrate and being spaced a predetermined interval from the first terminal, a conductive support formed on the second terminal, a conductive driving beam connected to the support in a cantilever form and extending parallel to the substrate to allow one end thereof to be disposed above the first terminal and to contact the first terminal when same is bent by an externally applied impact. Accordingly, a micro-sized switch may be manufactured and stable operation of the switch is possible.
Abstract translation: 根据本发明的MEMS开关及其制造方法,MEMS开关包括基板,形成在基板上的第一端子,形成在基板上并与第一端子隔开规定间隔的第二端子, 形成在所述第二端子上的导电支撑件,导电驱动梁,其以悬臂形式连接到所述支撑件并且平行于所述基板延伸,以允许其一端设置在所述第一端子上方并且当其相对于所述第一端子弯曲时与所述第一端子接触 外部施加冲击。 因此,可以制造微型开关,并且开关的稳定操作是可能的。
-
公开(公告)号:WO2010100622A1
公开(公告)日:2010-09-10
申请号:PCT/IB2010/050939
申请日:2010-03-04
Applicant: NXP B.V. , GOOSENS, Martijn , SUY, Hilco , STEENEKEN, Peter,Gerard , VAN BEEK, Jozef, Thomas, Martinus
Inventor: GOOSENS, Martijn , SUY, Hilco , STEENEKEN, Peter,Gerard , VAN BEEK, Jozef, Thomas, Martinus
IPC: B81B3/00
CPC classification number: B81B3/0078 , B81B2201/014 , B81B2201/016 , H01G5/011 , H01G5/16
Abstract: A MEMS device comprises first and second opposing electrode arrangements (22,28), wherein the second electrode arrangement (28) is electrically movable to vary the electrode spacing between facing sides of the first and second electrode arrangements. At least one of the facing sides has a non-flat surface with at least one peak and at least one trough. The height of the peak and depth of the trough is between 0.01t and 0.1t where t is the thickness of the movable electrode.
Abstract translation: MEMS器件包括第一和第二相对电极布置(22,28),其中第二电极布置(28)可电可移动以改变第一和第二电极布置的相对侧之间的电极间距。 至少一个相对侧具有具有至少一个峰和至少一个槽的非平坦表面。 槽的高度和深度在0.01t到0.1t之间,其中t是可动电极的厚度。
-
公开(公告)号:WO2008079887A3
公开(公告)日:2009-01-29
申请号:PCT/US2007088166
申请日:2007-12-19
Applicant: ANALOG DEVICES INC , O SUILLEABHAIN LIAM , GOGGIN RAYMOND , MURPHY EVA , HARNEY KIERAN
Inventor: O'SUILLEABHAIN LIAM , GOGGIN RAYMOND , MURPHY EVA , HARNEY KIERAN
IPC: B81C1/00
CPC classification number: B81B7/007 , B81B2201/014 , B81B2207/015 , B81B2207/017 , B81C1/0023 , B81C2203/032 , H01H59/0009 , H01L2924/0002 , H01L2924/00
Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
Abstract translation: MEMS装置具有夹在基座和电路芯片之间的MEMS器件。 MEMS器件的可移动部件的一侧上靠在电路芯片上。 可移动部件可以安装在MEMS器件的基板上,或直接形成在电路芯片上的钝化层上。 电路芯片通过引线键合,通过MEMS器件的通孔或导电路径(例如MEMS器件外部的焊球)向MEMS器件提供控制信号。
-
-
-
-
-
-
-
-
-