公开(公告)号：WO2006005317A3

公开(公告)日：2006-06-15

申请号：PCT/DE2005001200

申请日：2005-07-06

Applicant: EPCOS AG ,  BRUNNER SEBASTIAN ,  FEICHTINGER THOMAS ,  PUDMICH GUENTER ,  SCHLICK HORST ,  SCHMIDT-WINKEL PATRICK

Inventor： BRUNNER SEBASTIAN ,  FEICHTINGER THOMAS ,  PUDMICH GUENTER ,  SCHLICK HORST ,  SCHMIDT-WINKEL PATRICK

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/40

CPC classification number: H05K3/4061 ,  H01L2924/0002 ,  H05K3/248 ,  H05K3/28 ,  H05K2201/035 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The invention relates to a method for the production of an electric component (1). Said method consists of the following steps; A) a ceramic base body (5) which comprises a through-contact (10) and at least one metal surface (20C) which is connected in an electrically conductive manner to the through-contact, is prepared. In step B), one first electrically insulating material is arranged in a layered manner on the surface of the base body and at least over the through-contact, and subsequently in step C) an electrically conductive second material is applied over the through-contact (10). In step D) a soldering contact (30B) is formed by means of hardening, said soldering contact binding, in an electrically conductive manner, the through-contact (10) through the passivation layer (25B) which is formed from a first material by means of sintering.

Abstract translation: 它提出了一种方法，用于经由导电连接的金属化制造（1），其中，在一个方法步骤A中的陶瓷基体）被提供（5）的电组件，其包括通过（10）和至少一个与所述（20℃） ， 在基体的第一，在工艺步骤B的电绝缘材料）在方法步骤C的导电性的第二材料）的表面通过设置在层中的至少在所施加的，并且此后在通孔（10）。 在方法步骤D）中，焊料接触（30B）然后通过中，（通过在钝化层25B），其由所述第一材料通过烧结而形成，通过上述通路孔（10）导电地连接的固化来形成。

公开(公告)号：WO2005101493A2

公开(公告)日：2005-10-27

申请号：PCT/US2005/005655

申请日：2005-02-23

Applicant: NORTHROP GRUMMAN CORPORATION ,  BERRY, Cynthia, W. ,  BAILEY, Alex, E.

Inventor： BERRY, Cynthia, W. ,  BAILEY, Alex, E.

IPC: H01L23/02

CPC classification number: H01L23/49883 ,  H01L23/13 ,  H01L23/49833 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/092 ,  H05K1/182 ,  H05K3/248 ,  H05K3/328 ,  H05K2201/035 ,  H05K2203/049 ,  Y10T29/49018 ,  Y10T29/49078 ,  Y10T29/49155

Abstract: An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.

Abstract translation: LTCC（低温共烧陶瓷）结构，其具有用于连接到外部电路的引线的导体。 导体包括用于促进与陶瓷层的粘附的添加剂。 这些添加剂的存在降低了粘合性能。 为了使引线具有更好的粘合性，在引线要被接合的区域中的导体上放置没有添加剂的纯导体金属层。 该纯导体金属层可以与陶瓷层的堆叠共烧，或者可以在堆叠烧制之后进行烧制。

公开(公告)号：WO2002063261A2

公开(公告)日：2002-08-15

申请号：PCT/US2002/003675

申请日：2002-02-07

Applicant: INTERLINK ELECTRONICS, INC. ,  BAKER, Jeffrey, R. ,  SANCHEZ, Carlos, S.

Inventor： BAKER, Jeffrey, R. ,  SANCHEZ, Carlos, S.

IPC: G01L

CPC classification number: H01H13/702 ,  G01L1/20 ,  G01L1/205 ,  H01H2201/036 ,  H01H2203/02 ,  H01H2239/01 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/141 ,  H05K1/167 ,  H05K3/249 ,  H05K3/305 ,  H05K3/365 ,  H05K2201/035 ,  H05K2201/09663 ,  H05K2201/10151 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.

Abstract translation: 通过直接在包含支撑电子装置的印刷电路板上构造这样的换能器，降低了电子压敏换能器的成本和复杂性。 导电迹线形成在印刷电路板上以限定接触区域。 具有内表面的柔性基板位于接触区域上方。 基本上围绕接触区域的粘合间隔件将柔性基板附接到印刷电路板。 至少一个电阻层沉积在柔性衬底内表面上。 在使用中，电阻层响应于施加到柔性衬底上的压力而接触至少两个导电迹线，以产生指示所施加的压力的电信号。

公开(公告)号：WO00064226A1

公开(公告)日：2000-10-26

申请号：PCT/JP2000/002383

申请日：2000-04-12

IPC: H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11 ,  H05K3/12

CPC classification number: H01L21/486 ,  H05K1/0306 ,  H05K3/248 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/035

Abstract: When a ceramic substrate with via holes filled with conductive material is baked, recesses appear at the via holes. A first conductive paste is applied to the recesses. A circuit is printed with a second conductive paste on the ceramic substrate with its recesses filled with the first conductive paste. The viscosity of the first conductive paste is lower than the viscosity of the second conductive paste. As a result, conduction improves between the circuit conductor on the surface and the conductor in the via holes, and the accuracy of the printed patterns around the via holes also improves. This method is suitable for manufacture of reliable high-density circuits with high productivity

Abstract translation: 当具有填充有导电材料的通孔的陶瓷基板被烘烤时，在通孔处出现凹陷。 将第一导电膏施加到凹部。 电路在陶瓷基片上印有第二导电膏，其凹陷填充有第一导电膏。 第一导电糊的粘度低于第二导电糊的粘度。 结果，表面上的电路导体和通孔中的导体之间的导通性提高，并且通孔周围的印刷图案的精度也提高。 该方法适用于生产高可靠性的高密度电路

公开(公告)号：WO98049725A1

公开(公告)日：1998-11-05

申请号：PCT/FR1998/000837

申请日：1998-04-27

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/12 ,  H05K3/34

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/0577

Abstract: The invention concerns a method for producing and soldering electrical connection balls (1) on mounting lands (2) for electronic circuit or component (3) electrical connection. The invention further concerns the device for implementing said method. The invention is characterised in that it essentially comprises the following steps: the operations for filling the stencil screen openings (4) by means of a squeegee (6) or the like and hot refusion are carried out with the stencil screen positioned above the substrate; the stencil screen (4) positioned on the component (3) during refusion is separated from the component after refusion but before the balls (1) are solidified, the latter being still in liquid state such that the balls that are being formed acquire their balanced position and their strictly identical spherical shape whatever their number; after the balls are solidified, the denatured binder is cleaned out.

Abstract translation: 本发明涉及用于在用于电子电路或部件（3）电连接的安装台面（2）上制造和焊接电连接球（1）的方法。 本发明还涉及用于实现所述方法的装置。 本发明的特征在于，其基本上包括以下步骤：用模板丝网位于基板上方进行用于通过刮板（6）等填充模板丝网孔（4）和热反射的操作， 在反驳期间位于组件（3）上的模板丝网（4）在反驳之后与组件分离，但在球（1）固化之前，其仍处于液态，使得正在形成的球获得平衡 位置及其严格相同的球形，无论其数量多少; 球固化后，将变性粘合剂清除。

公开(公告)号：WO1996019913A1

公开(公告)日：1996-06-27

申请号：PCT/US1995016739

申请日：1995-12-19

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  BRADLEY, Edwin, L., III ,  BANERJI, Kingshuk ,  KAZEM-GOUDARZI, Vahid

IPC: H05K03/34

CPC classification number: H05K3/3463 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/04 ,  B23K2101/12 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/043

Abstract: A soldering process uses two or more different solder alloys. A first solder alloy (115) that undergoes a solid-to-liquid transition at a first temperature is coated (20) onto the solderable surfaces (105) of a printed circuit board (100). A solder paste (120) that undergoes this solid-to-liquid transition at a temperature greater than the first temperature is deposited on the coated solderable portions, and is heated to a temperature that is above the first temperature but below the second temperature. During this time, the first solder alloy liquifies, while the solder paste does not. The first solder alloy wets to the individual particles in the solder paste, and alloys to the solderable surfaces and the solder particles in the solder paste. The soldering composition is subsequently cooled (40) to solidify the first solder material, forming a solid and substantially planar coating on the solderable portions of the printed circuit board.

Abstract translation: 焊接工艺使用两种或更多种不同的焊料合金。 在第一温度下经历固 - 液过渡的第一焊料合金（115）涂覆（20）到印刷电路板（100）的可焊接表面（105）上。 在大于第一温度的温度下经历该固 - 液过渡的焊膏（120）沉积在涂覆的可焊接部分上，并被加热到高于第一温度但低于第二温度的温度。 在此期间，第一焊料合金液化，而锡膏不发生。 第一焊料合金润湿焊锡膏中的各个颗粒，并将其焊接到可焊接表面和焊膏中的焊料颗粒。 焊接组合物随后被冷却（40）以固化第一焊料材料，在印刷电路板的可焊接部分上形成固体和基本上平面的涂层。

公开(公告)号：WO1986006551A1

公开(公告)日：1986-11-06

申请号：PCT/US1986000639

申请日：1986-03-31

Applicant: AMP INCORPORATED

Inventor： AMP INCORPORATED ,  DERY, Ronald, Allen ,  GENTRY, William, Gray ,  JONES, Warren, Charlie ,  MAY, Clifton, Carl, Jr. ,  WENTINK, Steven, George

IPC: H01R04/04

CPC classification number: H05K3/323 ,  H01R4/04 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/148 ,  H05K1/181 ,  H05K1/189 ,  H05K3/247 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2201/10136 ,  H05K2203/066

Abstract: A flexible flat cable assembly, which is adapted to form a low profile interconnection between two electrical circuit members, each having a row of closely spaced apart conductive traces (18). The cable (2) comprises a row of traces (18), with an insulating polymeric film (20) overlying each side of the row. Also, the row is exposed at each end of the jumper cable, and the exposed end portion is covered by a layer of an anisotropically conductive adhesive (22). The cable is adapted to electrically join a flat display panel (220) to a printed circuit board (222), with the jumper cable (210) forming the interconnection between the conductors (221) on the display panel with the conductors on the circuit board. A jumper cable assembly is also disclosed, which includes surface mountable electrical components (224) which are electrically connected and mechanically secured to the traces (230) of the jumper cable assembly by means of an anisotropically conductive adhesive (22). A cable assembly especially adapted for tapping is also disclosed.

Abstract translation: 柔性扁平电缆组件，其适于在两个电路构件之间形成薄型互连，每个具有一排紧密间隔开的导电迹线（18）。 电缆（2）包括一排迹线（18），其上覆盖在该行的每一侧上的绝缘聚合物膜（20）。 此外，该行在跨接电缆的每一端处露出，并且暴露的端部被各向异性导电粘合剂层（22）覆盖。 电缆适于将平面显示面板（220）电连接到印刷电路板（222），跳线电缆（210）在显示面板上的导体（221）之间形成互连，电路板上的导体 。 还公开了一种跳线电缆组件，其包括通过各向异性导电粘合剂（22）电连接并机械地固定到跨接电缆组件的迹线（230）的可表面安装的电气部件（224）。 还公开了一种特别适用于攻丝的电缆组件。

公开(公告)号：WO2018065162A1

公开(公告)日：2018-04-12

申请号：PCT/EP2017/072265

申请日：2017-09-05

Applicant: CONTINENTAL AUTOMOTIVE GMBH

Inventor： ZACHERL, Jürgen ,  GOHLKE, Silvia

IPC: H05K3/12 ,  H05K3/34 ,  H05K3/32

CPC classification number: H05K3/1275 ,  H05K3/1216 ,  H05K3/321 ,  H05K3/3484 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/0134 ,  H05K2203/0143 ,  H05K2203/0338 ,  H05K2203/1476

Abstract: Die Erfindung betrifft ein Verfahren zum Drucken von Verbin-dungsmaterialien (4, 4', 6, 7, 8, 9) auf eine Gesamtanzahl von Kontaktflächen (2) auf einem Schaltungsträger (1) bei dem eine erste Schicht aus einem ersten Verbindungsmaterial (4, 4') mit einer ersten Dicke auf eine erste Teilanzahl von Kontaktflächen (2) mit einem ersten Druckverfahren und eine zweite Schicht aus einem zweiten Verbindungsmaterial (6; 4, 6; 7; 8, 9) mit einer zweiten Dicke auf eine zweite Teilanzahl von Kontaktflächen (2) mit einem Rotationsdruckverfahren aufgebracht wird.

Abstract translation: 本发明涉及一种用于在电路载体（1）上的多个接触表面（2）上印刷复合材料（4,4'，6,7,8,9）的方法， 其中具有第一厚度的第一结合材料（4,4'）的第一层通过第一印刷工艺被施加到第一部分数量的接触表面（2），并且第二结合材料（6; 4,6; 具有第二厚度的第二部分数量的接触表面（2; 7; 8; 9）通过旋转印刷工艺施加到第二部分数量的接触表面（2）

公开(公告)号：WO2017165525A1

公开(公告)日：2017-09-28

申请号：PCT/US2017/023600

申请日：2017-03-22

Applicant: BOT HOME AUTOMATION, INC.

Inventor： TSO, Robert

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/22 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K1/0268 ,  H05K1/0292 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/035 ,  H05K2201/10022 ,  Y02P70/611

Abstract: Some embodiments provide a novel surface-mount technology (SMT) printed circuit board (PCB) assembly. The SMT PCB assembly includes at least a pair of adjacent conductive pads with a small gap between them. During the development phase of the SMT PCB assembly, the small gap between the adjacent conductive pads, as well as some of the adjacent portions of the conductive pads, are covered with solder mask. An SMT component (e.g., a zero-ohm resistor) may then be mounted to the SMT PCB assembly through the exposed portions of the conductive pads. During the production phase, however, the solder mask is revised to cover the far sides of the conductive pads, which results in the adjacent portions of the conductive pads being exposed. As such, a solder jumper can easily be created during the production phase by connecting the two conductive pads using solder paste.

Abstract translation: 一些实施例提供了新颖的表面安装技术（SMT）印刷电路板（PCB）组件。 SMT PCB组件包括至少一对相邻的导电焊盘，它们之间具有小间隙。 在SMT PCB组装的开发阶段，相邻导电焊盘之间的小间隙以及导电焊盘的一些相邻部分被阻焊层覆盖。 然后可以通过导电焊盘的暴露部分将SMT元件（例如，零欧姆电阻器）安装到SMT PCB组件。 然而，在生产阶段，焊接掩模被修改为覆盖导电焊盘的远侧，这导致导电焊盘的相邻部分被暴露。 因此，通过使用焊膏连接两个导电焊盘，可以在生产阶段轻松创建焊接跳线。

公开(公告)号：WO2017134331A1

公开(公告)日：2017-08-10

申请号：PCT/FI2016/050062

申请日：2016-02-01

Applicant: ELCOFLEX OY

Inventor： TARVAINEN, Timo

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/42 ,  B82Y30/00

CPC classification number: H05K3/4635 ,  B82Y30/00 ,  H05K3/4069 ,  H05K3/4623 ,  H05K2201/035 ,  H05K2203/0723 ,  H05K2203/1545

Abstract: In the manufacturing method of a multilayer printed circuit board and in a multilayer printed circuit board of the invention, at least part from insulating, conductive or semi-conductive layers remaining inside the multilayer printed circuit board there are manufactured a printed circuit board by using a roll-to-roll manufacturing method for two or several semi-finished printed circuit boards. Between the conductive printed layers of a semi-finished printed circuit board it is possible to manufacture electric vias connecting these by printing. A flexible multilayer printed circuit board is manufactured by connecting at least two semi-finished printed circuit boards face to face so that the pure surfaces of the metal foils of the semi-finished printed circuit boards remain outermost. After this holes can be manufactured through the flexible multilayer printed circuit board, which are metal-plated to produce an electric via.

Abstract translation: 在本发明的多层印刷电路板和多层印刷电路板的制造方法中，至少部分来自保留在多层印刷电路板内部的绝缘层，导电层或半导电层， 通过使用用于两个或多个半成品印刷电路板的卷对卷制造方法来制造印刷电路板。 在半成品印刷电路板的导电印刷层之间，可以通过印刷来制造连接这些印刷电路板的电通孔。 柔性多层印刷电路板通过将至少两块半成品印刷电路板面对面地连接而制造，使得半成品印刷电路板的金属箔的纯表面保持最外面。 这些孔可以通过柔性多层印刷电路板制造，这些印刷电路板镀金属以生产电子通孔。