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    Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet
    112.
    发明专利
    Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet 有权
    使用其的压敏粘合剂，压敏粘合片和使用压敏粘合片的电子元件的制造方法

    公开(公告)号：JP2007045955A

    公开(公告)日：2007-02-22

    申请号：JP2005232720

    申请日：2005-08-11

    Applicant: Denki Kagaku Kogyo Kk ,  電気化学工業株式会社

    Inventor： TAKATSU TOMOMICHI ,  TAGUCHI KOICHI

    IPC: C09J201/04 ,  C09J4/00 ,  C09J7/02 ,  C09J11/06 ,  C09J133/06 ,  C09J201/00 ,  H01L21/301

    Abstract: PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive that realizes both of contradictory properties of enhanced pressure-sensitive adhesive force and ready peelability, suppresses scattering of electronic components on dicing and exhibits large effects for suppressing static electricity when an electronic component is picked up, a pressure-sensitive adhesive sheet obtained using the same and a manufacturing method of electronic components using the pressure-sensitive adhesive sheet. SOLUTION: The pressure-sensitive adhesive comprises an elastomer having a halogen-containing monomer unit and a heat-polymerizable compound. The pressure-sensitive adhesive sheet is obtained using the same. The manufacturing method of the electronic component comprises using the pressure-sensitive adhesive sheet. The pressure-sensitive adhesive and the pressure-sensitive adhesive sheet are suitably employed for a pressure-sensitive adhesive sheet for fixing electronic components that is pasted on the back surface of an electronic component aggregate when a plurality of electronic component aggregates formed on a plate-like substrate is divided into a separate electronic component by dicing. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供实现增强的压敏粘合力和即时剥离性的矛盾性能的压敏粘合剂，抑制电子部件在切割时的散射，并且当电子元件 拾取组分，使用其获得的压敏粘合片和使用该压敏粘合片的电子部件的制造方法。 解决方案：压敏粘合剂包括具有含卤素单体单元和热可聚合化合物的弹性体。 使用该粘合片可以得到粘合片。 电子部件的制造方法包括使用压敏粘合片。 压敏粘合剂和压敏粘合片适合用于固定电子部件的粘合片，该粘合片粘贴在电子部件集合体的背面上， 像基片通过切割分成独立的电子部件。 版权所有（C）2007，JPO＆INPIT

    SOLDER PASTE
    114.
    发明专利
    SOLDER PASTE 失效

    公开(公告)号：JPH10128573A

    公开(公告)日：1998-05-19

    申请号：JP30086396

    申请日：1996-10-28

    Applicant: SHOWA DENKO KK

    Inventor： SAEDA SHIGERU ,  SAKURAI TETSURO ,  TAGUCHI ISAMU ,  UTSUNOMIYA MASAHIDE

    IPC: B23K35/22 ,  B23K35/363 ,  C09J11/06 ,  C09J201/04

    Abstract: PROBLEM TO BE SOLVED: To provide a solder paste in which the organic halide compound to be blended to improve the solder wettability is sufficiently decomposed under the reflow condition without generating any ionic halogen, the performance as the solder paste is kept, and further the solder wettability is kept in a excellent condition, and the reliability of the product is excellent for a long time even without any cleaning. SOLUTION: In the solder paste in which the organic halide compound is blended as the activator, the flux in which 0.005-2.0wt.% polymer containing at least one of polyethylene glycol, poly-N-vinyl acetamide and poly-acrylic acid having the complex forming ability to the metal is added to the total weight of the flux, is blended.

    Vinyl chloride-grafted ethylene copolymer and process for producing same
    117.
    发明公开
    Vinyl chloride-grafted ethylene copolymer and process for producing same 失效
    米色乙烯基氯丹gepfropftesÄ乙烯共聚物和dessen Herstellungsverfahren。

    公开(公告)号：EP0255757A2

    公开(公告)日：1988-02-10

    申请号：EP87305546.1

    申请日：1987-06-22

    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

    Inventor： Okawa, Masahisa ,  Emura, Tomoyuki ,  Owatari, Yoshitaka ,  Mashita, Kentaro ,  Kawakita, Toshio

    IPC: C08F255/02 ,  C09J201/04

    CPC classification number: C09J151/06 ,  C08F255/02 ,  C08F214/06

    Abstract: Vinyl chloride-grafted ethylene copolymer superior in adhesiveness both to metals, glasses or polar high molecular materials such as polyamides and to non-rigid vinyl chloride resins is provided in which backbone polymer is copolymer of ethylene, ester of monohydric alcohol of 1 - 8 carbon atoms with acrylic acid or methacrylic acid and maleic anhydride and pendant or grafting polymer is vinyl chloride polymer. This copolymer is produced by graft-polymerization of vinyl chloride onto the ethylene-acrylic or methacrylic ester-maleic anhydride copolymer.

    Abstract translation: 提供了与金属，玻璃或极性高分子材料如聚酰胺和非刚性氯乙烯树脂的粘合性优异的乙烯基氯接枝乙烯共聚物，其中主链聚合物是乙烯，一元醇的1-8碳的共聚物 原子与丙烯酸或甲基丙烯酸和马来酸酐和侧链或接枝聚合物是氯乙烯聚合物。 该共聚物通过氯乙烯在乙烯 - 丙烯酸酯或甲基丙烯酸酯 - 马来酸酐共聚物上的接枝聚合制备。

    接合方法
    119.
    发明专利
    接合方法 有权

    公开(公告)号：JP6796744B1

    公开(公告)日：2020-12-09

    申请号：JP2020540363

    申请日：2020-03-16

    Applicant: リンテック株式会社

    Inventor： 佐々木 遼 ,  青木 拓斗 ,  田矢 直紀

    IPC: C09J7/35 ,  C09J201/00 ,  C09J5/06 ,  C09J11/04 ,  C09J201/04 ,  B29C65/36

    Abstract: 被着体(21,22)と高周波誘電加熱接着シートとを接合させる接合方法であって、被着体(21,22)は、表面に少なくともフッ素を含むフッ素含有表面(21A,22A)を有し、高周波誘電加熱接着シートは、高周波誘電接着剤層(10)を有し、高周波誘電接着剤層(10)は、熱可塑性樹脂(A)と誘電フィラー(B)とを含有し、高周波誘電接着剤層(10)の表面自由エネルギーは、15mJ/m 2 以上、30mJ/m 2 以下であり、高周波誘電接着剤層(10)の融点は、110℃以上、300℃以下であり、被着体(21,22)のフッ素含有表面(21A,22A)と高周波誘電接着剤層(10)とを当接させる工程と、高周波誘電接着剤層(10)に高周波を印加して、フッ素含有表面(21A,22A)に高周波誘電加熱接着シートを接合する工程と、を有する、接合方法。

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