Abstract:
A UV light emitting device is disclosed. The UV light emitting device includes: a substrate; an n-type semiconductor layer disposed on the substrate; an active layer disposed on the n-type semiconductor layer; a hole injection layer disposed on the active layer and comprising Al; an Al-delta layer disposed on the hole injection layer and comprising Al; and a first p-type contact layer disposed on the Al-delta layer and having a higher doping concentration of p-type dopants than the hole injection layer, wherein the first p-type contact layer has a lower Al content than the hole injection layer, a band-gap of the first p-type contact layer is lower than or equal to energy of light emitted from the active layer, and the Al-delta layer has a higher Al content than the hole injection layer and allows holes to enter the active layer by tunneling therethrough.
Abstract:
In an embodiment of the present disclosure, a sterilizing humidifier using ultraviolet rays includes: a cover unit in which an air inlet hole and an air outlet hole are formed; a fan unit disposed between the air inlet hole and the air outlet hole and moving air from the air inlet hole toward the air outlet hole; a storage unit coupled to the cover unit and containing liquid therein; a light emitting diode unit installed in the storage unit and radiating ultraviolet rays onto the liquid; and a liquid moving unit for moving the liquid contained in the storage unit to a space between the air outlet hole and the fan unit.
Abstract:
Disclosed herein is a light emitting diode chip. The light emitting diode chip includes a substrate, and a semiconductor stack, which is formed on the substrate and includes a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, the semiconductor stack having first side surface and second side surface disposed under the first side surface, wherein the first side surface is an outer side surface of the semiconductor stack to mesa-etching, the second side surface is an outer side surface of the first conductive type semiconductor layer, and at least one of the first side surface and second side surface has a convex pattern. Accordingly, the light emitting diode chip of the present invention can improve lateral light extraction by the convex pattern.
Abstract:
Disclosed is a light emitting diode including a plurality of light emitting elements and a method of fabricating the same. The light emitting diode includes: a substrate; a plurality of light emitting elements disposed on the substrate; interconnection lines connecting the light emitting elements to each other, wherein the plurality of light emitting elements comprise outer light emitting elements aligned along an edge of the substrate, each of the outer light emitting elements comprises an inner face directed towards an adjacent light emitting element and an outer face disposed adjacent the edge of the substrate and directed towards an outside of the substrate, and the inner face of at least one of the outer light emitting elements comprises a more gently slanted side surface than the outer face thereof.
Abstract:
A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. In the light emitting diode chip, the light emitting diode section is disposed together with the inverse parallel diode section.
Abstract:
Provided is a washing machine using a UV LED, which can sterilize and deodorize the interior without dissembling the washing machine. The washing machine includes: a drum; a rotational shaft coupled to a rear surface of the drum; a tub compassing the drum; and a UV light-emitting unit disposed on a rear surface of the tub in a bar type and configured to sterilize and deodorize the rear surface of the drum and a periphery of the rotational shaft.
Abstract:
Exemplary embodiments of the present invention provide a light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other, a first transparent electrode layer disposed on the first light emitting cell and electrically connected to the first light emitting cell, a current blocking layer disposed between a portion of the first light emitting cell and the first transparent electrode layer, an interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the interconnection and a side surface of the first light emitting cell. The current blocking layer and the insulation layer are connected to each other.
Abstract:
Exemplary embodiments of the present invention disclose a semiconductor device and a method of fabricating the same. The semiconductor device includes a gallium nitride substrate, a plurality of semiconductor stacks disposed on the gallium nitride substrate, and an insulation pattern disposed between the gallium nitride substrate and the plurality of semiconductor stacks, the insulation pattern insulating the semiconductor stacks from the gallium nitride substrate.
Abstract:
A near ultraviolet light emitting device is disclosed. The light emitting device includes an n-type contact layer including a gallium nitride layer, a p-type contact layer including a gallium nitride layer, and an active region of a multiple quantum well structure disposed between the n-type contact layer and the p-type contact layer, wherein the active region emits near ultraviolet light in a wavelength range from 360 nm to 390 nm.
Abstract:
A light emitting diode having a plurality of light emitting cells is provided. The light emitting diode according to an exemplary embodiment includes a lower insulation layer covering an ohmic reflection layer, connectors disposed on the lower insulation layer to connect the light emitting cells, and an upper insulation layer covering the connectors and the lower insulation layer. An edge of the lower insulation layer is spaced apart farther from an edge of the upper insulation layer than an edge of the light emitting cell. The lower insulation layer susceptible to moisture may be protected and reliability of the light emitting diode may improve.