-
公开(公告)号：KR1020100061213A
公开(公告)日：2010-06-07
申请号：KR1020080120120
申请日：2008-11-28
Applicant: 한국전자통신연구원
IPC: H04B10/29 , H04B10/2581
CPC classification number: H04B10/29 , H04J3/0682 , H04Q11/0067
Abstract: PURPOSE: A burst mode optical repeater is provided to increase transmission distance and the number of subscribers. CONSTITUTION: An optical receiver(110) receives a weak optical signal transmitted from an optical network unit to an uplink, and an optical transmitter(120) transmits the optical signal received through the optical receiver to an optical line terminal. A delay controller(130) generates a burst enable signal from the strength of the optical signal received by the optical reception unit, and the optical signal transmitted through the optical transmission unit has a burst characteristic by using the signal. The optical receiver optically converts the received optical signal into an electrical signal.
Abstract translation: 目的：提供突发模式光中继器，以增加传输距离和用户数量。 光接收器（110）接收从光网络单元传输到上行链路的弱光信号，并且光发射机（120）将通过光接收机接收的光信号发送到光线路终端。 延迟控制器（130）根据由光接收单元接收的光信号的强度产生突发使能信号，并且通过光传输单元传输的光信号通过使用该信号具有突发特性。 光接收器将所接收的光信号光学地转换成电信号。
-
公开(公告)号：KR1020100058832A
公开(公告)日：2010-06-04
申请号：KR1020080117385
申请日：2008-11-25
Applicant: 한국전자통신연구원
IPC: H01L23/045 , H01L23/02 , H01L23/12 , G03F7/027
CPC classification number: H01L2224/11 , H01L2924/15787 , H01L2924/00 , H01L2924/00012
Abstract: PURPOSE: A manufacturing method of a through wafer via having thick insulation layer is provided to minimize the electrical crosstalk by adjusting the thickness of insulating material and a diameter of via core. CONSTITUTION: A first via-hole(3-1) is formed on a wafer(1). A second via hole(3-2) is formed within the first via-hole. A via core(7) is formed within the first via-hole. A space between the via hole and the via core is filled with the film insulating material. The film insulating material is sucked through the second via hole on the back of the wafer.
Abstract translation: 目的：提供通过具有厚绝缘层的贯通晶片的制造方法，通过调节绝缘材料的厚度和通孔芯的直径来最小化电串扰。 构成：在晶片（1）上形成第一通孔（3-1）。 第二通孔（3-2）形成在第一通孔内。 通孔芯（7）形成在第一通孔内。 通孔和通孔芯之间的空间填充有薄膜绝缘材料。 薄膜绝缘材料通过晶片背面的第二通孔吸入。
-
公开(公告)号：KR1020100058309A
公开(公告)日：2010-06-03
申请号：KR1020080117065
申请日：2008-11-24
Applicant: 한국전자통신연구원
CPC classification number: H04N21/812 , G06Q30/02 , H04N21/2547 , H04N21/25891 , H04N21/6581
Abstract: PURPOSE: An advertisement service server system and a television broadcast receiving system associated with the same are provided to perform TV advertisement in cheap prices by making an advertiser register the advertisement directly. CONSTITUTION: An advertisement registration unit(110) receives a selection standard value by selection standards selected from an advertiser, the first access information expressing intuitively the minimum information of goods and the secondary access information expressing the detailed information of advertisement from an advertiser terminal. The advertisement registration unit registers the information as advertisement related information in a database(170). A metadata transmitting unit(120) transmits the advertisement related information at a meta data type to a service subscriber terminal.
Abstract translation: 目的：提供一种广告服务器系统和与其相关联的电视广播接收系统，以通过使广告商直接注册广告来廉价地执行电视广告。 构成：广告登记单元（110）通过从广告商选择的选择标准接收选择标准值，第一访问信息直观地表示商品的最小信息，以及从广告主终端表达广告的详细信息的辅助访问信息。 广告登记单元将信息作为广告相关信息登记在数据库（170）中。 元数据发送单元（120）将元数据类型的广告相关信息发送到服务用户终端。
-
公开(公告)号：KR1020100010267A
公开(公告)日：2010-02-01
申请号：KR1020080071175
申请日：2008-07-22
Applicant: 한국전자통신연구원
CPC classification number: G02B6/4246 , G02B6/02095 , G02B6/29317 , G02B6/29323 , G02B6/4214
Abstract: PURPOSE: An optical waveguide apparatus and an optical transmitting/receiving module apparatus for optical path conversion are provided to prevent the deterioration of combination rate of an optical signal. CONSTITUTION: An optical waveguide device includes a core(210) and a cladding unit(200). The cladding unit is formed around the core, and one portion of the optical waveguide apparatus is tilted to diffract the inputted and outputted optical signal. The tilted one end portion is an inclination unit(230). In order to make the optical signal incident through the cladding unit progress in parallel, a diffraction unit(220) diffracts the optical signal. The long period Bragg diffraction grating of the diffraction unit selects the light of a certain wavelength band.
Abstract translation: 目的：提供一种用于光路转换的光波导装置和光发射/接收模块装置，以防止光信号的组合速率的恶化。 构成：光波导器件包括芯（210）和包层单元（200）。 包层单元形成在芯周围，并且光波导装置的一部分被倾斜以衍射输入和输出的光信号。 倾斜的一个端部是倾斜单元（230）。 为了使通过包层单元入射的光信号并行进行，衍射单元（220）衍射光信号。 衍射单元的长周期布拉格衍射光栅选择一定波长带的光。
-
125.发明公开연속 모드 신호처리소자들로 광 수신 인터페이스가 구현된광 회선 단말과 그 인터페이스를 위한 동작 방법 및 광네트워크 유닛에서 수행되는 광 회선 단말의 연속 모드신호 처리를 위한 동작 방법 失效具有包含用于接收光信号的连续模式信号处理单元的接口的光线路终端，用于接口的光线路终端的操作方法和用于光网络单元中的光线路终端的连续模式信号处理的操作方法
公开(公告)号：KR1020100008560A
公开(公告)日：2010-01-26
申请号：KR1020080069106
申请日：2008-07-16
Applicant: 한국전자통신연구원
IPC: H04B10/27 , H04B10/2581
CPC classification number: H04J3/1694 , H04B10/272
Abstract: PURPOSE: An OLT(Optical Line Termination) implementing an optical receiving interface from CM(Continuous Mode) signal process element, an operation method for an interface and an operation method for the CM signal process of the OLT are provided to process the burst signal by using the CM signal process element. CONSTITUTION: A light receiving unit(410) comprises CM signal processing elements of a general purpose. The CM signal processing elements restores the clock and data from optical signal transmitted from a plurality of ONTs. A controller(430) controls a plurality of ONUs in order to continue the light signal received from the light receiving unit. The controller excludes a guard time for preventing the collision of data transmitted from ONUs.
Abstract translation: 目的：提供从CM（连续模式）信号处理单元实现光接收接口的OLT（光线路终端），用于OLT的CM信号处理的接口操作方法和操作方法，以处理突发信号 使用CM信号处理元件。 构成：光接收单元（410）包括通用的CM信号处理元件。 CM信号处理元件从多个ONT发送的光信号中恢复时钟和数据。 控制器（430）控制多个ONU，以便继续从光接收单元接收的光信号。 控制器不包括用于防止从ONU发送的数据的冲突的保护时间。
-
Patent Agency Ranking
公开(公告)号：KR1020060021134A
公开(公告)日：2006-03-07
申请号：KR1020040069987
申请日：2004-09-02
Applicant: 한국전자통신연구원
Abstract: 본 발명은 가입자 단말 이상 동작 여부의 원격 진단 장치 및 그 방법에 관한 것으로 특히, 수동 광가입자망 시스템에서 가입자 단말의 이상 여부를 중앙국에서 원격으로 진단하는 장치 및 그 방법에 관한 것으로 본 명세서에서 개시하는 가입자 단말 이상 동작 여부의 원격 진단 장치는 상향 신호로부터 사용자 단말의 오류 발생을 감지하고 상기 상향 신호의 주파수 스펙트럼을 분석하는 주파수 분석부; 및 상기 스펙트럼의 모양에 맞는 특정 주파수를 결정하고, 이 특정 주파수와 진단 대상 사용자 단말로부터 전송된 이상 여부 진단용 신호의 최대 주파수를 상호 비교하여 상기 사용자 단말의 이상 동작 여부를 진단하는 이상 여부 진단부를 포함하여 본 발명의 목적 및 기술적 과제를 달성한다.
수동 광가입자망(Passive Optical Network), Ethernet-PON, ATM-PON, WDM-PON, 고장 진단 방법, ONT(Optical Network Terminal)-
公开(公告)号：KR100521138B1
公开(公告)日：2005-10-12
申请号：KR1020030009753
申请日：2003-02-17
Applicant: 한국전자통신연구원
IPC: H01S3/13
Abstract: 본 발명은 광통신 시스템에서 사용되는 파장 검출 및 안정화 장치와 그 방법에 관하여 개시한다. 본 발명은 투과형 광 검출기(Transmittance Photodetector)의 투과 특성을 이용하여 하나의 패브리-페롯 필터(Fabry-Perot filter)의 파장 투과 특성에 의해 패브리-페롯 필터의 뒤에서 광을 검출함으로써 파장분할 다중화 방식의 파장간격을 만족하는 파장 안정화 기능을 제공한다. 따라서, 본 발명은 부품 수를 줄여서 장치를 소형화할 수 있으며, 장치의 정렬과정이 생략되어 생산비용을 절감할 수 있다.
-
公开(公告)号：KR1020040090660A
公开(公告)日：2004-10-26
申请号：KR1020030024634
申请日：2003-04-18
Applicant: 한국전자통신연구원
IPC: H01L21/60
CPC classification number: H01L2224/16 , H01L2924/00012
Abstract: PURPOSE: A flip-chip bonding method using an slanted groove for optical passive alignment is provided to improve junction precision of an LD(laser diode) chip by minimizing small misalignment between a semiconductor chip and the surface of a substrate after the semiconductor chip and an optical fiber or a planar optical waveguide are initially aligned. CONSTITUTION: A photoresist pattern is formed on a substrate(30) corresponding to a solder bump(22) formed on the bottom surface of a semiconductor chip. An etch process is performed along the photoresist pattern formed on the substrate to form a bonding groove(34). A UBM(under bump metal)(35) is formed in the bonding groove. While the solder bump in the semiconductor chip is aligned with the bonding groove, the solder bump is heated below a melting-point temperature and the semiconductor chip is closely attached to the bonding groove. The heated solder bump is cooled to fix the semiconductor chip to the substrate.
Abstract translation: 目的：提供使用用于光学无源对准的倾斜槽的倒装焊接方法，以通过最小化半导体芯片和半导体芯片之后的衬底表面上的小的不对准来改善LD（激光二极管）芯片的结精度 光纤或平面光波导最初对齐。 构成：在与形成在半导体芯片的底表面上的焊料凸块（22）相对应的基板（30）上形成光致抗蚀剂图案。 沿着形成在基板上的光致抗蚀剂图案进行蚀刻处理，以形成接合槽（34）。 UBM（凸块下金属）（35）形成在接合槽中。 虽然半导体芯片中的焊料凸块与接合槽对准，但是将焊料凸点加热到低于熔点温度，并且半导体芯片紧密地附接到接合槽。 将加热的焊料凸块冷却以将半导体芯片固定到基板上。
-
公开(公告)号：KR1020040000926A
公开(公告)日：2004-01-07
申请号：KR1020020035943
申请日：2002-06-26
Applicant: 한국전자통신연구원
IPC: G02B6/32
Abstract: PURPOSE: An optic fiber is provided to be capable of increasing the focal length of light by forming a semi-circular type concave part at the end portion of the optic fiber and filling predetermined material having a higher refraction index than that of the optic fiber into the semi-circular type concave part. CONSTITUTION: An optic fiber is provided with a core part(11) and a clad part(12). The optic fiber further includes a concave part(15) formed at one end portion of the core part and the clad part. And, predetermined material having a higher refraction index than that of the core part is filled into the concave part. In the device, the concave part is formed into a semi-circular type structure, a wet etching process is carried out for forming the concave part.
Abstract translation: 目的：提供一种光纤，通过在光纤的端部形成半圆形凹部，并将具有比光纤的折射率高的折射率的预定材料填充到能够增加光的焦距的位置 半圆形凹部。 构成：光纤设有芯部（11）和包层部（12）。 光纤还包括形成在芯部的一端部和包层部的凹部（15）。 并且，将具有比芯部更高的折射率的预定材料填充到凹部中。 在该装置中，凹部形成为半圆形结构，进行用于形成凹部的湿式蚀刻工序。
-
公开(公告)号：KR101835456B1
公开(公告)日：2018-03-09
申请号：KR1020100116815
申请日：2010-11-23
Applicant: 한국전자통신연구원
Abstract: 본발명의일 실시예에따른광섬유어레이블럭의제조방법은, 실리콘기판상에피식각될영역을노출시키는식각마스크패턴을형성하는단계; 노출된상기실리콘기판을건식식각하여트렌치를형성하는단계; 상기트렌치의바닥면에노출된상기실리콘기판을습식식각으로이방성식각하여복수개의브이홈(V-groove)들을형성하는단계; 상기브이홈들에광섬유들을안착시키는단계; 및상기안착된광섬유들에 UV 경화용에폭시를도포하고덮개판을올린후 UV를조사하여상기광섬유들을고정시키는단계를포함한다.
-
-
-
-
-
-
-
-
-
Search Results
170
records
(took 0.026 seconds)
