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公开(公告)号：WO2017078664A1
公开(公告)日：2017-05-11
申请号：PCT/US2015/058564
申请日：2015-11-02
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHEN, Chien-Hua , CUMBIE, Michael W.
CPC classification number: B41J2/16 , B41J2/14 , B41J2/155 , B41J2/1623 , B41J2/1632 , B41J2/1635 , B41J2/1637 , B41J2002/14491 , B41J2202/20
Abstract: Examples include a glass-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises nozzles for dispensing printing material. The glass-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.
Abstract translation: 示例包括基于玻璃的支撑基板和与其耦合的至少一个流体喷射管芯。 该至少一个流体喷射模具包括用于分配印刷材料的喷嘴。 基于玻璃的支撑基底具有贯穿其中形成的流体连通通道，其中流体连通通道与至少一个流体喷射模具的喷嘴流体连通。
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公开(公告)号：WO2017065725A1
公开(公告)日：2017-04-20
申请号：PCT/US2015/055086
申请日：2015-10-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHEN, Chien-Hua , CUMBIE, Michael W. , CHOY, Silam J.
CPC classification number: B41J2/14072 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1634 , B41J2/1635 , B41J2/1637 , B41J2202/20
Abstract: A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.
Abstract translation: 打印头包括可模制基板和多个模制到可模制基板中的打印头模具。 打印头模具包括模制到可模制基底中的多个打印头模具。 模具包括非矩形形状。 多个流体槽限定在可模制基板中以流体耦合到打印头模具以将流体供给到打印头模具。 流体槽的数量不等于打印头模具的数量。
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公开(公告)号：WO2017023238A1
公开(公告)日：2017-02-09
申请号：PCT/US2015/043064
申请日：2015-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHEN, Chien-Hua , LUTNESKY, Gary G. , CUMBIE, Michael W. , NIKKEL, Eric L.
CPC classification number: H05K3/284 , H05K1/0271 , H05K1/181 , H05K3/46 , H05K2201/068 , H05K2203/1327
Abstract: A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.
Abstract translation: 印刷电路板具有第一热膨胀系数。 化合物围绕印刷电路板模制。 该化合物具有与第一热膨胀系数不同的第二热膨胀系数。 接口位于印刷电路板的边缘和复合体之间。 该界面在第一热膨胀系数与第二热膨胀系数之间具有第三热膨胀系数。
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公开(公告)号：WO2016159934A1
公开(公告)日：2016-10-06
申请号：PCT/US2015/023020
申请日：2015-03-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHEN, Chien-Hua , CUMBIE, Michael W. , FARRAR, Stephen R.
IPC: H01L23/28
CPC classification number: H01L23/3135 , B41J2/155 , H01L21/561 , H01L21/565 , H01L24/96 , H01L2924/10253 , H01L2924/3511
Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.
Abstract translation: 电路封装包括第一环氧模具化合物中的电路装置和不同组成的第二环氧模塑料。
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公开(公告)号：WO2015116025A1
公开(公告)日：2015-08-06
申请号：PCT/US2014/013309
申请日：2014-01-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHEN, Chien-Hua , GROH, Michael G. , CUMBIE, Michael W.
CPC classification number: B41J2/1433 , B41J2/1601 , B41J2/1623 , B41J2/1637 , B41J2002/14491
Abstract: The present disclosure includes a flexible carrier along with a system and a method including the flexible carrier.
Abstract translation: 本公开包括柔性载体以及包括柔性载体的系统和方法。
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Patent Agency Ranking
公开(公告)号：WO2014133590A1
公开(公告)日：2014-09-04
申请号：PCT/US2013/062221
申请日：2013-09-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHOY, Silam J. , CUMBIE, Michael W. , MOUREY, Devin Alexander , CHEN, Chien-Hua
CPC classification number: B41J2/17526 , B41J2/14072 , B41J2/14145 , B41J2/1433 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/1628 , B41J2/1637 , B41J2/17553 , B41J2002/14362 , B41J2002/14419 , B41J2202/20
Abstract: In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.
Abstract translation: 在一个示例中，打印头包括：打印头芯片，其具有可以从模具分配流体的前表面，模具模制成具有通道的整体模制件，流体可以通过该通道直接传递到模具的后部， 裸露在模具外部的模具的前表面和除了通道之外的由模制物覆盖的模具的后部; 暴露在模制件外部以连接到打印头外部的电路的电触头; 模制到模制品中的印刷电路板，印刷电路板具有与裸露的前表面共面并且围绕裸露的前表面的暴露的前表面和与触点电连接的导体; 以及在模具和完全封装在模制件中的印刷电路板导体之间的电连接。
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公开(公告)号：WO2023048701A1
公开(公告)日：2023-03-30
申请号：PCT/US2021/051416
申请日：2021-09-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CUMBIE, Michael W. , SHKOLNIKOV, Viktor
Abstract: In example implementations, an apparatus is provided. The apparatus includes a digital microfluidic (DMF) board, an injection port, and an aspiration port. The DMF board is to manipulate a droplet. The DMF board includes a collection region. The injection port is located over the collection region to provide a continuous supply of a carrier fluid. The droplet is immiscible in the carrier fluid. The aspiration port is located adjacent to the injection port and located over the collection region to collect the droplet and the carrier fluid.
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公开(公告)号：WO2023038630A1
公开(公告)日：2023-03-16
申请号：PCT/US2021/049864
申请日：2021-09-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： SHKOLNIKOV, Viktor , CUMBIE, Michael W.
Abstract: An interface device includes a housing that defines a microfluidic path including a conduit, wherein the microfluidic path is connectable to a first port of a digital microfluidic (DMF) device. A plurality of electrodes are supported by the housing and disposed proximal to the microfluidic path to move a sample fluid droplet into and through the microfluidic path.
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公开(公告)号：WO2022132134A1
公开(公告)日：2022-06-23
申请号：PCT/US2020/065144
申请日：2020-12-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： SHKOLNIKOV, Viktor , CUMBIE, Michael W.
IPC: C12Q1/6806 , G01N33/569 , B01F3/08
Abstract: An apparatus may include a sample collection cartridge including a liquid transport medium and a sample swab, and a heating instrument including a metal strip extending a length of the sample swab.
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公开(公告)号：WO2022066158A1
公开(公告)日：2022-03-31
申请号：PCT/US2020/052564
申请日：2020-09-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CUMBIE, Michael W. , CHEN, Chien-Hua , SHKOLNIKOV, Viktor
Abstract: In an example implementation according to aspects of the present disclosure, a fluid device comprises a fluid reservoir arranged to deliver printing fluid to an ejection chamber. The fluid device further comprises a substrate including an array of microfluidic electrodes. The fluid device also comprises electrical interconnects to receive control signals to enable delivery of printing fluid from the reservoir to a fluid port.
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