公开(公告)号：JPH10142784A

公开(公告)日：1998-05-29

申请号：JP34700697

申请日：1997-12-01

Applicant: JSR CORP

Inventor： KAJITA TORU ,  MIURA TAKAO ,  ISAMOTO YOSHITSUGU ,  OKUDA CHOZO

IPC: G03F7/004 ,  G03F7/022 ,  G03F7/023 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. effectively suppressing the generation of scum at the time of forming a resist pattern, excellent in developability, having high sensitivity and suitable for use as a positive resist excellent in heat resistance and the rate of a residual film by incorporating alkali-soluble novolak resin, a specified 1,2-quinonediazido compd. and a dissolution accelerator. SOLUTION: This radiation sensitive resin compsn. contains alkali-soluble novolak resin, a 1,2-quinonediazido compd. represented by formula I and a dissolution accelerator. In the formula I, D is H or an org. group having a 1,2-quinonediazido group and a part or all of D's are org. group each having a 1,2-quinonediazido group. The novolak resin is preferably obtd. by polycondensing phenol represented by formula II and aldehyde. In the formula II, (n) is an integer of 1-3.