公开(公告)号：DE69733164T2

公开(公告)日：2006-02-16

申请号：DE69733164

申请日：1997-02-07

Applicant: JSR CORP

Inventor： SUWA MITSUHITO ,  KAJITA TORU ,  IWANAGA SHIN-ICHIRO ,  OTA TOSHIYUKI

IPC: C08F32/08 ,  C08G61/06 ,  C08G61/08 ,  C08L65/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.

公开(公告)号：DE69728366T2

公开(公告)日：2005-02-24

申请号：DE69728366

申请日：1997-12-12

Applicant: JSR CORP

Inventor： SUWA MITSUHITO ,  IWASAWA HARUO ,  KAJITA TORU ,  IWANAGA SHIN-ICHIRO

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039

Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.

公开(公告)号：DE69736024T2

公开(公告)日：2006-11-23

申请号：DE69736024

申请日：1997-02-07

Applicant: JSR CORP

Inventor： SUWA MITSUHITO ,  KAJITA TORU ,  IWANAGA SHIN-ICHIRO ,  OTA TOSHIYUKI

IPC: G03F7/004 ,  C08F32/08 ,  C08G61/06 ,  C08G61/08 ,  C08L65/00 ,  G03F7/039 ,  H01L21/027

Abstract: A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.

公开(公告)号：DE60143178D1

公开(公告)日：2010-11-18

申请号：DE60143178

申请日：2001-06-15

Applicant: JSR CORP ,  IBM

Inventor： NISHIMURA YUKIO ,  YAMAHARA NOBORU ,  YAMAMOTO MASAFUMI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU ,  ITO HIROSHI

IPC: G03F7/004 ,  C08K5/00 ,  C08L33/06 ,  C08L35/00 ,  C08L45/00 ,  G03F7/039 ,  H01L21/027

公开(公告)号：SG125883A1

公开(公告)日：2006-10-30

申请号：SG200004850

申请日：2000-09-16

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/027 ,  G03F7/004 ,  G03F7/039

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

公开(公告)号：DE60025297T2

公开(公告)日：2006-08-17

申请号：DE60025297

申请日：2000-09-14

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/027 ,  G03F7/039 ,  G03F7/004

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

公开(公告)号：DE60025297D1

公开(公告)日：2006-03-30

申请号：DE60025297

申请日：2000-09-14

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/027 ,  G03F7/039 ,  G03F7/004

Abstract: A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.

公开(公告)号：DE69728366D1

公开(公告)日：2004-05-06

申请号：DE69728366

申请日：1997-12-12

Applicant: JSR CORP

Inventor： SUWA MITSUHITO ,  IWASAWA HARUO ,  KAJITA TORU ,  IWANAGA SHIN-ICHIRO

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039

Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.

公开(公告)号：DE69220257T3

公开(公告)日：2002-06-13

申请号：DE69220257

申请日：1992-01-24

Applicant: JSR CORP

Inventor： KAJITA TORU ,  OTA TOSHIYUKI ,  YUMOTO YOSHIJI ,  MIURA TAKAO

IPC: C08G8/24 ,  G03F7/022 ,  G03F7/023 ,  H01L21/70

Abstract: 1. An i-ray sensitive positive resist composition: which (A) comprises an alkali-soluble novolak resin obtained by subjecting (a) a phenolic mixture of 5 to 95 mol% of 2,3-xylenol with 95 to 5 mol% of a phenol selected from mon-, di- and tri-methyl phenols other than 2,3-xylenol or (b) a phenolic mixture of 5 to 50 mol% of 3,4-xylenol with 95 to 50 mol% of a phenol selected from mono-, di- and trimethyl phenols other than 3,4-xylenol to polycondensation together with an aldehyde, and a 1,2-quinonediazide compound, and (B) which has sensitivity to i-ray. There is also provided a method of forming a pattern, which comprises: (1) applying the i-ray sensitive positive resist composition to a wafer to form a photosensitive layer, (2) irradiating the photosensitive layer with i-ray through a predetermined pattern, and (3) developing the pattern with a developer.

公开(公告)号：DE60235663D1

公开(公告)日：2010-04-29

申请号：DE60235663

申请日：2002-01-17

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  YAMAMOTO MASAFUMI ,  KATAOKA ATSUKO ,  KAJITA TORU

IPC: G03F7/038 ,  G03F7/039 ,  G03F7/004

Abstract: A radiation-sensitive resin composition comprising: (A) an acid-dissociable group-containing resin, insoluble or scarcely soluble in alkali but becoming soluble in alkali when the acid-dissociable group dissociates, and containing recurring units with specific structures and (B) a photoacid generator of the formula (3), wherein R represents a monovalent aromatic hydrocarbon group, m is 1-8, and n is 0-5. The resin composition is suitable as a chemically-amplified resist responsive to deep ultraviolet rays such as a KrF excimer laser and ArF excimer laser, exhibits high transparency, excellent resolution, dry etching resistance, and sensitivity, produces good pattern shapes, and well adheres to substrates.