Abstract:
PROBLEM TO BE SOLVED: To obtain a composition for a resist underlayer film disposed between a resist and an antireflection film, having both of adhesion to the resist and resistance to a resist developing solution, and further having resistance to oxygen ashing in resist removal. SOLUTION: The composition for a resist underlayer film comprises: (A) both or either of a hydrolysate and a condensate of a silane compound; (B) a compound generating an acid by ultraviolet irradiation and/or heating (e.g., bis(4-t-butylphenyl)iodonium camphorsulfonate); and (C) a catalyst (e.g., maleic acid). The silane compound is at least one compound selected from the group consisting of tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-iso-propoxysilane and tetraphenoxysilane. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide the radiation sensitive resin composition capable of being applied in a uniform film thickness with a small coating amount and not liable to cause pattern defect and capable of forming a resist pattern superior in pattern profiles and high in resolution with high sensitivity and suitable for a positive resist. SOLUTION: This radiation sensitive resin composition comprises (1) an alkali-soluble resin, (2) a quinonediazido compound, and (3) a mixed solvent containing a 7-14C monoketone and alkyl alkoxypropionate in a weight proportion of 10/90-90/10.
Abstract:
PROBLEM TO BE SOLVED: To obtain a positive or negative radiation sensitive resin compsn. useful as a chemical amplification resist which ensures especially low edge roughness in a fine pattern of
Abstract:
PROBLEM TO BE SOLVED: To provide the radiation sensitive resin composition high in resolution and very little in deterioration of sensitivity and small in a stationary wave effect and superior in focus allowance and heat resistance and developability by incorporating an alkali-soluble resin and a specified compound and a 1,2- quinonediazido compound other than this compound. SOLUTION: The radiation sensitive resin composition contains (1) the alkali- soluble resin, (2) the compound represented by the formula, and (3) the 1,2- quinonediazido compound other than the compound (2). In the formula, each of R -R is, independently, an H or halogen atom of an alkyl or alkoxy or aryl or nitro group of a group represented by -OD; and D is an H atom or a group comprising a quinonediazido group. It is preferred to use a novolak resin as the alkali-soluble resin. An amount of the compound represented by the formula to be used is 0.5-50weight%, preferably, 1-30 weight % of the alkali- soluble resin.
Abstract:
PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition high in resolution, sensitivity, developability, focus allowance and heat resistance as a positive resist, and capable of forming a pattern good in form reduced in stationary wave effect by incorporating an alkali-soluble resin and a specified compound. SOLUTION: This resin composition comprises the alkali-soluble resin and one of the compounds represented by formulae I and II and a 1,2-quinonediazido compound except the above compounds, and in formulae I and II, D is an H atom or an organic group having the 1,2-quinonediazido group; each of R1 -R7 is an H or halogen atom or an alkyl, aryl, nitro, cyano, hydroxy-alkyl, hydroxyalkoxy, or -OD group; X is an H or halogen atom or a cyano group; and Y is an O or S atom.
Abstract:
PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. effectively suppressing the generation of scum at the time of forming a resist pattern, excellent in developability, having high sensitivity and suitable for use as a positive resist excellent in heat resistance and the rate of a residual film by incorporating alkali-soluble novolak resin, a specified 1,2-quinonediazido compd. and a dissolution accelerator. SOLUTION: This radiation sensitive resin compsn. contains alkali-soluble novolak resin, a 1,2-quinonediazido compd. represented by formula I and a dissolution accelerator. In the formula I, D is H or an org. group having a 1,2-quinonediazido group and a part or all of D's are org. group each having a 1,2-quinonediazido group. The novolak resin is preferably obtd. by polycondensing phenol represented by formula II and aldehyde. In the formula II, (n) is an integer of 1-3.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition high in resolution and sensitivity and superior in developability and restrained in a stational wave effect and capable of obtaining a good pattern form, by incorporating an alkali- soluble resin and a specified compound and a 1,2-quinonediazido compound. SOLUTION: The radiation-sensitive resin composition contains the alkali- soluble resin and the 1,2-quinonediazido compound and a compound represented by the formula in which each of R1 -R4 is a halogen atom or an alkyl, alkoxy, aryl, nitro, cyano, hydroxyalkyl, hydroxyalkoxy, or -OD group; (where, D is H atom or a group containing a 1,2-qdz group); each of (a)-(d) is an integer of 1-3 satisfying the following expressions: 0
Abstract:
PROBLEM TO BE SOLVED: To provide an antireflective film for a plasma display front plate which is excellent in antireflection characteristics, transparency, near-infrared-ray shielding property, color tone correction property, and antistatic property, and its manufacturing method. SOLUTION: The antireflective film for the plasma display front plate is constituted by providing on at least one surface of a base material a hard coat layer, a conductive layer made of a conductive polymer, a high-refractive-index layer, and a low-refractive-index layer in arbitrary order. Consequently, adhesion between the conductive layer and the base material can be increased when a monomer such as thiophene is formed on the surface of the base material by vapor-phase polymerization. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition retaining good sensitivity, excellent in resolution and margin for exposure and suitable for use in a positive type resist giving a good pattern shape and having good balance of characteristics. SOLUTION: The radiation sensitive resin composition has (A) an alkali- soluble resin, (B) a quinonediazidosulfonic ester compound and (C) an ester compound of an aliphatic dibasic acid represented by formula (1) (where R1 and R2 are each a 1-6C alkyl and R3 is methylene or a 2-6C alkylene).
Abstract:
PROBLEM TO BE SOLVED: To attain effective sensitivity to various radiations, to improve resolution, pattern shape, PED stability, etc., to reduce baking temp. dependency and to enhance process stability by incorporating a compd. having a specified substituent, a specified polymer having a specified ratio of wt. average mol. wt. (Mw) expressed in terms of polystyrene to number average mol. wt. (Mn) expressed in terms of polustyrence and a radiation sensitive acid generating agent. SOLUTION: The radiation sensitive compsn. contains a compd. having -C(= O)-OC(CH3)3 as a substituent having an acid cleavable t-butyl group, a polymer having acid decomposable acetal or ketal groups and an Mw to Mn ration 1-3 and 0.1-20 pts.wt., preferably 0.5-10 pts.wt. radiation sensitive acid generating agent based on 100 pts.wt. polymer.