公开(公告)号：US5901899A

公开(公告)日：1999-05-11

申请号：US718808

申请日：1996-09-24

Applicant: Norbert Flache

Inventor： Norbert Flache

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K2201/36

Abstract: The invention relates to a wave soldering machine with at least one device for generating at least one solder wave (10a) consisting of liquid solder (10) for wetting assembled units (22) which are conducted over the solder wave (10a). To achieve a reproducible adjustment and control of the wave height (24), it is proposed to mount at least one temperature-compensated pressure sensor (18) in the transport path of the solder (10), preferably in the immediate vicinity of the nozzle opening (13).

Abstract translation: 本发明涉及一种波峰焊机，其具有至少一个装置，用于产生至少一个由用于润湿在焊波（10a）上传导的组装单元（22）的液体焊料（10）组成的焊波（10a）。 为了实现对波高的可重复的调整和控制（24），建议将至少一个温度补偿压力传感器（18）安装在焊料（10）的输送路径中，优选地在喷嘴的紧邻附近 开（13）。

公开(公告)号：US5844199A

公开(公告)日：1998-12-01

申请号：US796693

申请日：1997-03-04

Applicant: Shinji Iino ,  Takashi Amemiya

Inventor： Shinji Iino ,  Takashi Amemiya

IPC: G01R31/02 ,  B23K31/12 ,  G01R31/08 ,  H01L21/66 ,  B23K26/00

CPC classification number: G01R31/086 ,  B23K31/12 ,  B23K2201/36

Abstract: A conductor pattern test apparatus comprises a DC voltage power source for applying a predetermined DC voltage to an end of one of a plurality of conductor patterns arranged in parallel with each other, a current measurement circuit for measuring a current flowing to another conductor pattern adjacent to the one of the conductor patterns via the end by the DC voltage power source to the end, and a short-circuit position calculation circuit for calculating a resistance value from the end to a short-circuited part of the two conductor patterns adjacent to each other, based on the current value measured by the current measurement circuit and the voltage value applied by the DC power source, and locating a position of the short-circuited part based on the calculated resistance value and a resistance value of a conductor pattern having no short-circuit. A disconnect location is also obtained.

Abstract translation: 导体图案测试装置包括用于将预定DC电压施加到彼此并联布置的多个导体图案之一的端部的DC电压电源，用于测量流向与其相邻的另一个导体图案的电流的电流测量电路 通过直流电压电源的末端的导体图案中的一个到端部，以及用于计算从彼此相邻的两个导体图案的端部到短路部分的电阻值的短路位置计算电路 基于由当前测量电路测量的电流值和由DC电源施加的电压值，并且基于计算的电阻值和不短的导体图案的电阻值来定位短路部分的位置 电路 还可以获得断开位置。

公开(公告)号：US5826779A

公开(公告)日：1998-10-27

申请号：US874836

申请日：1997-06-13

Applicant: David C. Jacks ,  Randall R. Walston

Inventor： David C. Jacks ,  Randall R. Walston

IPC: B23K1/012 ,  B23K1/018 ,  B23K3/02 ,  B23K3/047

CPC classification number: B23K1/012 ,  B23K1/018 ,  B23K3/025 ,  B23K2201/36 ,  B23K2201/42 ,  H01L2224/16225

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract translation: 一方面，提供了一种用于将部件附接到电路板的装置，包括保持在保持器中的电路板和接触加热器，所述接触加热器通过接触加热电路板上的部件并且通过部件传导热量。 在另一方面，接触加热器是手动移动到部件上的魔杖。 在另一方面，本发明提供了一种用于将部件附接到电路板的方法，包括以下步骤：用接触加热器夹紧部件; 将组件放置在电路板上; 并且通过接触加热电路板上的部件，其中通过部件传导的热量熔化部件下的焊料并将部件附接到电路板。

公开(公告)号：US5765744A

公开(公告)日：1998-06-16

申请号：US678474

申请日：1996-07-09

Applicant: Kouhei Tatumi ,  Kenji Shimokawa ,  Eiji Hashino

Inventor： Kouhei Tatumi ,  Kenji Shimokawa ,  Eiji Hashino

IPC: B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  B23K1/00 ,  B23K31/02

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  B23K2201/36 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2203/0113 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082

Abstract: A process of producing small metal bumps includes the steps of simultaneously holding small metal balls on an arrangement baseplate in the positions corresponding to those of electrodes of a semiconductor chip, a film carrier, or a substrate; aligning the small metal balls held on the arrangement baseplate with the electrodes; lightly pressing the small metal balls against the electrodes; to provisionally fix the balls to the electrodes; and pressing the provisionally fixed small metal balls to flatten the pressed surfaces of the small metal balls, and at the same time, to bond the small metal balls to the electrodes.

Abstract translation: 制造小金属凸块的工艺包括以下步骤：在与半导体芯片，薄膜载体或基板的电极对应的位置上同时将小金属球保持在布置基板上; 将安置基板上保持的小金属球与电极对准; 轻轻地将小金属球压在电极上; 将球临时固定到电极; 并且按压临时固定的小金属球来使小金属球的压制表面变平，同时将小金属球粘合到电极上。

公开(公告)号：US5750199A

公开(公告)日：1998-05-12

申请号：US867801

申请日：1997-06-03

Applicant: Shoji Sakemi

Inventor： Shoji Sakemi

IPC: B23K3/06 ,  B23K3/08 ,  H01L21/48 ,  H05K3/34 ,  B05D3/12

CPC classification number: B23K3/082 ,  B23K3/0623 ,  H01L21/4853 ,  H05K3/3478 ,  B23K2201/36 ,  H05K2203/041 ,  H05K2203/082 ,  H05K3/3489

Abstract: An absorber head picks up a plurality of soldering balls from a container, and is shifted horizontally toward a substrate. In the midway of this shift movement, the absorber head is stopped just above a flux storage and then lowered to soak the soldering ball in the flux stored in the flux storage, thereby applying each soldering ball with an adequate amount of flux. Thereafter, the absorber head is again shifted horizontally until it reaches the substrate. Then, the absorber head lowers the soldering ball applied with flux, so that each soldering ball is mounted on a corresponding electrode provided on the substrate. If any soldering balls are left in the flux storage due to failure of the pickup operation by the absorber head, such soldering balls are surely collected in a groove by wiping movement of a squeegee which is associated with the flux storage.

Abstract translation: 吸收头从容器上拾取多个焊球，并且朝向衬底水平移动。 在该换档运动的中途，吸收头停止在储存器的正上方，然后降低以将焊球浸入储存在助焊剂储存器中的助焊剂中，从而使每个焊球具有足够量的助焊剂。 此后，吸收头再次水平移动直到其到达基板。 然后，吸收头降低施加焊剂的焊球，使得每个焊球安装在设置在基板上的相应电极上。 如果由于吸收头的拾取操作的故障而将任何焊球留在焊剂储存器中，则通过擦拭与焊剂储存器相关联的刮板的运动，可靠地将这样的焊球收集在凹槽中。

公开(公告)号：US5738267A

公开(公告)日：1998-04-14

申请号：US733585

申请日：1996-10-18

Applicant: David Charles Olson ,  Robert Phillips, III

Inventor： David Charles Olson ,  Robert Phillips, III

IPC: B23K1/018 ,  G01R1/04 ,  G01R31/28 ,  H01L21/60 ,  H05K13/04 ,  B23K3/00

CPC classification number: H05K13/0486 ,  B23K1/018 ,  G01R1/0483 ,  G01R31/2867 ,  H01L24/799 ,  H01L24/98 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/131 ,  H01L2224/75703 ,  H01L2224/7999 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T156/19

Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

公开(公告)号：US5709338A

公开(公告)日：1998-01-20

申请号：US636186

申请日：1996-04-22

Applicant: Mitugu Shirai ,  Hideaki Sasaki ,  Takeshi Takahashi

Inventor： Mitugu Shirai ,  Hideaki Sasaki ,  Takeshi Takahashi

IPC: B23K1/00 ,  B23K35/26 ,  H05K3/34 ,  B23K1/19 ,  B23K35/14 ,  B23K35/24

CPC classification number: B23K1/0016 ,  B23K35/26 ,  H05K3/3463 ,  B23K2201/36 ,  B23K35/262 ,  B23K35/268 ,  H05K2201/10992 ,  H05K3/341 ,  H05K3/3457

Abstract: A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil portion having a lower melting point. Initially, the part is held to the metallization by the solder chip having the higher melting point. The solder foil having the lower melting point is first melted in such a state and, after that, the solder chip having the higher melting point is melted. By such a soldering method, a reliable soldering can be performed, without causing a void on the undersurface of a part joint section, by one soldering operation, so that a presoldering operation becomes unnecessary.

Abstract translation: 以这样的方式进行焊接，使得具有不同熔点的两个焊料部分放置在用于接合的基板上的金属化和一部分之间。 使具有较高熔点的芯片部分比具有较低熔点的焊料箔部分厚。 最初，通过具有较高熔点的焊料芯片将部件保持在金属化之上。 具有较低熔点的焊料箔在这种状态下首先被熔化，之后熔化熔点较高的焊料芯片。 通过这样的焊接方法，可以通过一次焊接操作来进行可靠的焊接，而不会在部分接合部的下表面上产生空隙，从而不需要预焊工艺。

公开(公告)号：US5676302A

公开(公告)日：1997-10-14

申请号：US520937

申请日：1995-08-31

Applicant: John P. Petry, III

Inventor： John P. Petry, III

IPC: B23K20/00 ,  G06T3/00 ,  B23K31/12 ,  B23K37/00

CPC classification number: B23K20/004 ,  G06T7/0083 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  B23K2201/36 ,  G06T2207/20068 ,  G06T2207/30152 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14

Abstract: Method and apparatus for selecting a threshold for use by a boundary tracker to locate a crescent on a bonded lead involves creating a two-dimensional inspection window along the angle of the wire in a post-bond image of a bonded wire in order to generate a one-dimensional projection; generating a one-dimensional projection by summing each column of pixels in the inspection window in the direction of the wire angle and computing an average grey value for each column; and applying an edge-detection to the one-dimensional projection to locate the edges of the wire. If an edge point falls directly in the center of a pixel of the one-dimensional projection, the grey value for that edge point is considered to be the grey value of that pixel. If the edge falls between pixels, the edge's grey value is determined by the fractional pixel position of the edge point in the projection. The grey values of the left and right edge points are averaged and used as the threshold value. For more accurate threshold selection or if reflective stripes or confusing edges are likely to occur in the parts being inspected, the same steps are performed using a clipped difference image of the bonded wire instead of a post-bond image.

Abstract translation: 用于选择由边界跟踪器使用以在粘合引线上定位月牙的阈值的方法和装置包括在接合线的后贴合图像中沿导线的角度产生二维检查窗口，以便产生 一维投影; 通过在检查窗口中的线列方向上的每列像素求和并计算每列的平均灰度值来生成一维投影; 以及将边缘检测应用于所述一维投影以定位所述线的边缘。 如果边缘点直接落在一维投影的像素的中心，则该边缘点的灰度值被认为是该像素的灰度值。 如果边缘落在像素之间，则边缘的灰度值由投影中边缘点的分数像素位置决定。 将左边缘点和右边缘点的灰度值平均，并将其用作阈值。 为了更准确的阈值选择，或者如果在被检查部件中可能发生反射条纹或混淆边缘，则使用接合线的剪切差分图像而不是后贴合图像来执行相同的步骤。

公开(公告)号：US5662262A

公开(公告)日：1997-09-02

申请号：US412292

申请日：1995-03-28

Applicant: John Francis McMahon ,  George Chiu

Inventor： John Francis McMahon ,  George Chiu

IPC: B23K3/06 ,  B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/30 ,  H05K3/34 ,  B23K35/00

CPC classification number: H01L24/16 ,  B23K3/0623 ,  B23K3/0692 ,  B23K35/0222 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11013 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/27438 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/303 ,  Y02P70/613

Abstract: A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a "bed of nails". In addition, the solder forms maybe shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.

Abstract translation: 公开了一卷带有焊料形式的胶带以及用于仅将焊料形成或将两种焊料形式和带的部分两者转移到电子部件的方法。 电子元件可以是集成电路芯片，芯片封装和印刷电路板中的任何一种。 将焊料形式转移到电子部件是一个两步的过程：（a）焊料形式定位并离线放置在一卷胶带上，（b）胶带上的焊料形式被转移到电子部件中 一条装配线。 焊料形式可能暂时或永久性地附着在磁带上。 首先，仅传送焊料形式。 在后一种情况下，带部分被转移到具有焊料形式的电子部件。 焊料形式可以使用UV敏感粘合剂或冷粘合剂（例如助焊剂）附接到带的一侧或带中的通孔中。 可以通过将焊料形式压在电子部件上，将UV敏感粘合剂暴露于UV光或使用“指甲床”来消除焊料形式。 此外，焊料形状可以形成为球，圆柱体，多边形盒，桶或小时眼镜。 胶带是导热和耐热的，并且可以具有诸如陶瓷，氮化铝或助焊剂的浸渍材料，以改善其热，机械和/或电性质。

公开(公告)号：US5639011A

公开(公告)日：1997-06-17

申请号：US390755

申请日：1995-02-17

Applicant: David C. Jacks ,  Randall R. Walston

Inventor： David C. Jacks ,  Randall R. Walston

IPC: B23K1/012 ,  B23K1/018 ,  B23K3/02 ,  B23K3/04 ,  H01L21/58

CPC classification number: B23K1/012 ,  B23K1/018 ,  B23K3/025 ,  B23K2201/36 ,  B23K2201/42 ,  H01L2224/16225

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract translation: 一方面，提供了一种用于将部件附接到电路板的装置，包括保持在保持器中的电路板和接触加热器，所述接触加热器通过接触加热电路板上的部件并且通过部件传导热量。 在另一方面，接触加热器是手动移动到部件上的魔杖。 在另一方面，本发明提供了一种用于将部件附接到电路板的方法，包括以下步骤：用接触加热器夹紧部件; 将组件放置在电路板上; 并且通过接触加热电路板上的部件，其中通过部件传导的热量熔化部件下的焊料并将部件附接到电路板。