公开(公告)号：US20160095246A1

公开(公告)日：2016-03-31

申请号：US14502717

申请日：2014-09-30

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Shawn Noland ,  Daniel Milligan

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K7/1489 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10159 ,  H05K2201/10507

Abstract: An apparatus as associated method contemplating a housing and a midplane supported by the housing having a midplane connector. A printed circuit board (PCB) having a PCB connector is selectively connectable to the midplane connector. A plurality of data storage devices are arranged on the printed circuit board in a staggered pattern, each electrically connected to the PCB connector via a respective electrical trace in the PCB.

Abstract translation: 一种设备作为相关方法，考虑由具有中平面连接器的壳体支撑的壳体和中平面。 具有PCB连接器的印刷电路板（PCB）可选择性地连接到中面板连接器。 多个数据存储装置以交错图案布置在印刷电路板上，每个电路板经由PCB中的相应电迹线与PCB连接器电连接。

公开(公告)号：US09185807B2

公开(公告)日：2015-11-10

申请号：US14708755

申请日：2015-05-11

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/183 ,  H05K1/0231 ,  H05K1/11 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09645 ,  H05K2201/10015 ,  H05K2201/10507 ,  Y02P70/611 ,  Y10T29/49135

Abstract: Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (IC) structure includes: a substrate layer having an upper surface; an IC chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the IC chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the IC chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the IC chip.

Abstract translation: 各种实施例包括具有离轴孔内电容器的集成电路结构。 在一些实施例中，集成电路（IC）结构包括：具有上表面的基底层; 至少部分地包含在所述衬底层内并与垂直于所述衬底层的上表面的短轴对准的IC芯片; 所述基板层中的孔，所述孔与所述IC芯片物理分离; 以及孔中的电容器，并且至少部分地包含在所述衬底层内，所述电容器与所述IC芯片物理隔离，其中所述电容器与垂直于所述衬底层的上表面的轴线对准，并且偏离所述衬底层的短轴 IC芯片。

公开(公告)号：US09030837B2

公开(公告)日：2015-05-12

申请号：US13267802

申请日：2011-10-06

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K5/00 ,  H05K7/00 ,  B29C65/00 ,  B29C65/02 ,  B32B37/00 ,  B32B38/00 ,  H05K1/02 ,  H05K5/02 ,  B29C45/14 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其被模制成包括装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路; 和内部连接器。

公开(公告)号：US20150077969A1

公开(公告)日：2015-03-19

申请号：US14458232

申请日：2014-08-12

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K5/00 ,  H05K1/18 ,  F21V8/00 ,  H05K5/02

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其被模制成包括装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路。

公开(公告)号：US20150077945A1

公开(公告)日：2015-03-19

申请号：US14474909

申请日：2014-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongjae RHEE

IPC: H05K7/20 ,  H01M10/615 ,  H05K1/02

CPC classification number: H05K7/2039 ,  H01M2/1022 ,  H01M2/1066 ,  H01M10/425 ,  H01M10/615 ,  H01M10/623 ,  H01M10/667 ,  H01M2200/00 ,  H01M2220/30 ,  H04M1/0262 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0296 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10507

Abstract: A portable electronic device and a battery pack for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) in which at least one electronic component is disposed, and a battery pack including a heat conductor separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell.

Abstract translation: 提供了一种用于便携式电子设备的便携式电子设备和电池组。 便携式电子设备包括其中设置有至少一个电子部件的印刷电路板（PCB），以及包括分别设置在与PCB间隙处的热导体并将电子部件中产生的热量传递到电池的电池组 细胞。

公开(公告)号：US20150009642A1

公开(公告)日：2015-01-08

申请号：US14381640

申请日：2012-03-01

Applicant: Laurent Caclard

Inventor： Laurent Caclard

IPC: H05K9/00 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K1/0218 ,  H05K5/0047 ,  H05K7/1427 ,  H05K2201/0723 ,  H05K2201/0919 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/10507

Abstract: An electronic unit (1) having a circuit board, PCB, (2) arranged to be mounted in a main housing (6, 7 and having a first housing part (6) and a second housing part (7), where the first housing part (6) is at least partly electrically conducting. The PCB (2) having a first outer layer (3), a second outer layer (4), and a ground plane (5). The first outer layer (3) faces the first housing part (6) and the second outer layer (4) faces the second housing part (7) The ground plane (5) is in electrical contact with the first housing part (6) forming a first chamber (29), facing the first outer layer (3), and a second chamber (30), facing the second outer layer (4). The chambers (29, 30) are separated by the ground plane (5), providing electromagnetic shielding between the chambers (29, 30).

Abstract translation: 一种具有布置成安装在主壳体（6,7）中并具有第一壳体部件（6）和第二壳体部件（7））的电路板，PCB（2）的电子单元（1），其中第一壳体 部分（6）至少部分导电，PCB（2）具有第一外层（3），第二外层（4）和接地平面（5），第一外层（3） 第一壳体部分（6）和第二外层（4）面向第二壳体部分（7）。接地平面（5）与形成第一室（29）的第一壳体部分（6）电接触， 第一外层（3）和与第二外层（4）相对的第二室（30），室（29,30）由接地平面（5）分开， 30）。

公开(公告)号：US20140347826A1

公开(公告)日：2014-11-27

申请号：US14452808

申请日：2014-08-06

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其包含装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路; 和内部连接器。

公开(公告)号：US08829661B2

公开(公告)日：2014-09-09

申请号：US11372666

申请日：2006-03-10

Applicant: William H. Lytle ,  Scott M. Hayes ,  George R. Leal

Inventor： William H. Lytle ,  Scott M. Hayes ,  George R. Leal

IPC: H01L23/02 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56 ,  H01L23/538 ,  H01L23/544

CPC classification number: H05K1/0271 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/5442 ,  H01L2223/5446 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/10507

Abstract: Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts (36), opposed rear faces (33) and edges (32) therebetween. The devices (30) are mounted primary faces (31) down on a temporary support (60) in openings (44) in a warp control sheet (WCS) (40) attached to the support (60). Plastic encapsulation (50) is formed at least between lateral edges (32, 43) of the devices (30) and WCS openings (44). Undesirable panel warping (76) during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA (82) containing the devices (30) and the WCS (40) is separated from the temporary support (60) and, optionally, mounted on another carrier (70) with electrical contacts (36) exposed. Thin film insulators (85) and conductors (87) are desirably applied to couple electrical contacts (36) on various devices (30) to each other and to external terminals (88), thereby forming an integrated multi-device EPA (84).

Abstract translation: 提供了一种用于电子面板组件（EPA）（82,83）的方法和装置，包括：为一个或多个电子设备（30）提供具有电触头（36），相对的后表面（33）和 其间的边缘（32）。 装置（30）在连接到支撑件（60）的经纱控制片（WCS）（40））的开口（44）中的主要面（31）向下安装在临时支撑件（60）上。 至少在装置（30）的横向边缘（32,43）和WCS开口（44）之间形成塑料封装（50）。 通过选择WCS热膨胀系数（CTE）小于封装CTE来减轻封装期间的不希望的面板翘曲（76）。 在封装固化之后，含有装置（30）和WCS（40）的EPA（82）与临时支撑件（60）分离，并且可选地安装在具有暴露的电触点（36）的另一个载体（70）上。 期望施加薄膜绝缘体（85）和导体（87）以将各种装置（30）上的电触头（36）彼此耦合到外部端子（88），从而形成集成的多装置EPA（84）。

公开(公告)号：US08804346B2

公开(公告)日：2014-08-12

申请号：US13921173

申请日：2013-06-18

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K1/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其包含装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路; 和内部连接器。

公开(公告)号：US20130279125A1

公开(公告)日：2013-10-24

申请号：US13921173

申请日：2013-06-18

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其被模制成包括装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路; 和内部连接器。