公开(公告)号：WO2018063874A1

公开(公告)日：2018-04-05

申请号：PCT/US2017/052405

申请日：2017-09-20

Applicant: CASCADE MICROTECH, INC.

Inventor： FISHER, Gavin, Neil ,  THAERIGEN, Thomas, Reiner ,  MCCANN, Peter ,  JONES, Rodney ,  DUCKWORTH, Koby, L.

IPC: G01R1/067 ,  G01R31/28 ,  G01R1/073

Abstract: Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

Abstract translation: 本文公开了探针系统和方法。 该方法包括直接测量第一操纵组件和第二操纵组件之间的距离，使第一和第二探针与第一和第二接触位置接触，向电气结构提供测试信号，并接收来自电气结构的合成信号。 该方法还包括基于距离表征探针系统和电气结构中的至少一个。 在一个实施例中，探测系统包括配置为直接测量第一操纵组件和第二操纵组件之间的距离的测量装置。 在另一个实施例中，探针系统包括探针头组件，该探针头组件包括台板，可操作地连接到台板的操纵器，可操作地连接到操纵器的矢量网络分析仪（VNA）延伸器以及可操作地连接到VNA延伸器的探针。 p>

公开(公告)号：WO2015134258A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/017678

申请日：2015-02-26

Applicant: CASCADE MICROTECH, INC.

Inventor： INGRAM-GOBLE, Robbie ,  SIMMONS, Michael, E. ,  WOLF, Philip ,  GARRISON, Ryan ,  STORM, Christopher

IPC: H01L21/683

CPC classification number: H01L21/6838 ,  B25J11/0095 ,  B25J15/0014 ,  B25J15/0616 ,  H01L21/67778 ,  Y10S901/40

Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

Abstract translation: 本文公开了包括和/或与晶片处理端效应器一起使用的晶片处理末端执行器和半导体制造装置。 末端执行器包括末端执行器主体和多个晶片接触表面，其由端部执行器主体支撑并被配置为与晶片形成至少部分的面对面的接触。 末端执行器还包括在末端执行器主体的机器人近端与多个晶片接触表面之间延伸的真空分配歧管。 末端执行器还包括限定在多个晶片接触表面内并在多个晶片接触表面和真空分配歧管之间延伸的多个真空开口。 末端执行器还包括多个密封结构，每个密封结构与多个晶片接触表面中的相应一个相关联。

公开(公告)号：WO2014106154A1

公开(公告)日：2014-07-03

申请号：PCT/US2013/078222

申请日：2013-12-30

Applicant: CASCADE MICROTECH, INC,

Inventor： FEHRMANN, Frank ,  HIRSCHFELD, Botho ,  KANEV, Stojan

IPC: H01L21/00

CPC classification number: H01L21/67745 ,  H01L21/67775

Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.

Abstract translation: 本文公开了在晶片处理系统中提供晶片访问的系统和方法。 所述方法可以包括将晶片处理系统上的第一晶片盒对接，并且利用晶片处理系统从第一晶片盒移除选定的晶片。 该方法还可以包括使用晶片处理系统在所选择的晶片上执行处理操作，并且在执行处理操作时从晶片处理系统脱离第一晶片盒。 所述方法还可以包括将第二晶片盒（其可以与第一晶片盒相同或不同）对准在晶片处理系统上，利用晶片处理系统盘存第二晶片盒，和/或随后将所选择的晶片 在第二晶片盒中。 系统可以包括晶片处理系统，其包括被编程为执行方法的至少一部分的控制器。

公开(公告)号：WO2014106152A1

公开(公告)日：2014-07-03

申请号：PCT/US2013/078218

申请日：2013-12-30

Applicant: CASCADE MICROTECH, INC.

Inventor： HIRSCHFELD, Botho ,  BECKER, Axel

IPC: G01K13/12

CPC classification number: G01N25/66 ,  G01R31/00 ,  G01R31/2862

Abstract: Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.

Abstract translation: 选择用于使用探针系统测试被测设备（DUT）的公开的系统和方法，以在低于探针系统周围环境环境露点的温度下测试DUT。 探测系统包括被配置为隔离冷却干燥测试环境的测量室和被配置为选择性地隔离测量室的内部体积的测量室门。 当在低温下测试被包括在基底上的DUT时，选择系统和方法以将至少部分与测量室隔离的干燥环境中的衬底加热至至少高于 露点和/或周围环境的霜点。

公开(公告)号：WO2014074518A1

公开(公告)日：2014-05-15

申请号：PCT/US2013/068518

申请日：2013-11-05

Applicant: CASCADE MICROTECH, INC.

Inventor： BOCK, Daniel, M. ,  SMITH, Kenneth, R.

IPC: G01N27/416 ,  G01D21/00

CPC classification number: G01R31/31715 ,  G01R31/28

Abstract: Systems and methods for testing a device under test (DUT) that includes a low power output driver. The methods include providing an input signal to the DUT. The low power output driver is configured to generate a data signal responsive to receipt of the input signal by the DUT and provide the data signal to a signal analyzer via a data signal transmission line. The methods further include determining an expected data signal to be received from the low power output driver and charging at least a portion of the data signal transmission line with a co-drive output signal that is based, at least in part, on the expected data signal. The methods further include receiving a composite data signal with the signal analyzer. The systems include probe heads with a plurality of data signal transmission lines and a plurality of co-drive conductors.

Abstract translation: 用于测试包含低功率输出驱动器的被测设备（DUT）的系统和方法。 所述方法包括向DUT提供输入信号。 低功率输出驱动器被配置为响应于DUT接收到输入信号而生成数据信号，并且经由数据信号传输线将数据信号提供给信号分析器。 所述方法还包括确定要从低功率输出驱动器接收的期望数据信号，并且至少部分地基于预期数据对共驱动输出信号进行数据信号传输线的至少一部分的充电 信号。 所述方法还包括用信号分析器接收复合数据信号。 该系统包括具有多个数据信号传输线和多个共驱动导体的探头。

公开(公告)号：WO2012154584A1

公开(公告)日：2012-11-15

申请号：PCT/US2012/036601

申请日：2012-05-04

Applicant: CASCADE MICROTECH, INC. ,  DUCKWORTH, Koby ,  HILL, Eric

Inventor： DUCKWORTH, Koby ,  HILL, Eric

IPC: G01R1/073

CPC classification number: G01R1/0735 ,  G01R1/06711 ,  G01R1/06738 ,  G01R1/07378 ,  G01R31/2889

Abstract: Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes.

Abstract translation: 探针头组件，探针头组件的组件，包括探针头组件和/或其部件的测试系统及其操作方法。 探针头组件被配置为将多个测试信号传送到和/或从被测设备，并且包括空间变换器，接触组件和立管，空间变换器与接触组件空间上分离并传送多个 在空间变压器和接触组件之间测试信号。 接触组件可以包括限定孔的框架，并且具有与被测器件的阈值差的阈值差的热膨胀系数，附接到框架的柔性电介质体，由框架保持张力， 并延伸穿过该孔，以及多个导电探针。

公开(公告)号：WO2012037444A3

公开(公告)日：2012-05-31

申请号：PCT/US2011051899

申请日：2011-09-16

Applicant: CASCADE MICROTECH INC ,  STRID ERIC W

Inventor： STRID ERIC W

IPC: H04W4/00

CPC classification number: H04B5/0031 ,  H02J5/005 ,  H02J50/05 ,  H02J50/12 ,  H02J50/90 ,  H04B5/0037

Abstract: Systems and methods for non-contact and/or wireless transmission of power and/or data between and/or within electronic devices. These systems and methods may include the use of two or more wireless power modules to transmit a wireless power signal between a first electronic device and a second electronic device and/or the use of two or more wireless data modules to transmit a wireless data signal between the first electronic device and the second electronic device. The wireless power modules and/or the wireless data modules may include one or more near-field coupling devices. The wireless power modules and/or wireless data modules associated with the first electronic device may be arranged in complementary locations to the wireless power modules and/or wireless data modules associated with the second electronic device and the complementary modules may be separated by a distance of less than 10 um.

Abstract translation: 电子设备之间和/或内部的电力和/或数据的非接触和/或无线传输的系统和方法。 这些系统和方法可以包括使用两个或更多个无线功率模块来在第一电子设备和第二电子设备之间传输无线功率信号和/或使用两个或更多个无线数据模块来在无线数据模块之间传输无线数据信号 第一电子设备和第二电子设备。 无线功率模块和/或无线数据模块可以包括一个或多个近场耦合设备。 与第一电子设备相关联的无线功率模块和/或无线数据模块可以布置在与第二电子设备相关联的无线功率模块和/或无线数据模块的互补位置，并且互补模块可以被分开 小于10 um。

公开(公告)号：WO2012061568A2

公开(公告)日：2012-05-10

申请号：PCT/US2011/059091

申请日：2011-11-03

Applicant: CASCADE MICROTECH, INC. ,  SMITH, Kenneth R. ,  JOLLEY, Mike ,  STRID, Eric ,  HANAWAY, Peter ,  GLEASON, K., Reed ,  DUCKWORTH, Koby, L.

Inventor： SMITH, Kenneth R. ,  JOLLEY, Mike ,  STRID, Eric ,  HANAWAY, Peter ,  GLEASON, K., Reed ,  DUCKWORTH, Koby, L.

IPC: G01R1/067 ,  H05K3/10 ,  H05K1/11 ,  H05K1/18

CPC classification number: G01R1/0735 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/4857 ,  Y10T29/49155

Abstract: Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

Abstract translation: 可用于在第一装置和第二装置之间形成多个电连接的弹性电插入件，以及可利用弹性电插入件及其使用和/或制造方法的系统。 弹性电插入件可以包括弹性介电体，其中包含多个电导管。 多个电导管可以被配置为在电插入器的第一表面和/或弹性电介质体之间提供多个电连接以及电插入器和/或弹性介电体的第二相对的表面。 本文公开的系统和方法可以提供弹性电插入器的改进的垂直顺应性，改进的接触力控制和/或改进的尺寸稳定性。

公开(公告)号：WO2012054423A1

公开(公告)日：2012-04-26

申请号：PCT/US2011/056626

申请日：2011-10-18

Applicant: CASCADE MICROTECH, INC. ,  NEGISHI, Kazuki ,  HARRIS, Steve ,  STRID, Eric, W. ,  BOLT, Bryan

Inventor： NEGISHI, Kazuki ,  HARRIS, Steve ,  STRID, Eric, W. ,  BOLT, Bryan

IPC: G01R31/26

CPC classification number: G01J1/32 ,  G01J1/0242 ,  G01J1/0425 ,  G01J2001/0481 ,  G01J2001/4247 ,  G01R31/2635

Abstract: Systems and methods for simultaneous optical testing of a plurality of devices under test. These systems and methods may include the use of an optical probe assembly that includes a power supply structure that is configured to provide an electric current to a plurality of devices under test (DUTs) and an optical collection structure that is configured to simultaneously collect electromagnetic radiation that may be produced by the plurality of DUTs and to provide the collected electromagnetic radiation to one or more optical detection devices. The systems and methods also may include the use of the optical probe assembly in an optical probe system to evaluate one or more performance parameters of each of the plurality of DUTs.

Abstract translation: 用于同时光学测试多个待测设备的系统和方法。 这些系统和方法可以包括使用光学探针组件，该光学探针组件包括电源结构，该电源结构被配置为向被测试的多个被测设备（DUT）提供电流，以及被配置为同时收集电磁辐射的光学收集结构 其可以由多个DUT产生并且将收集的电磁辐射提供给一个或多个光学检测装置。 所述系统和方法还可以包括在光学探针系统中使用光学探针组件来评估多个DUT中的每一个的一个或多个性能参数。

公开(公告)号：WO2010059247A3

公开(公告)日：2011-03-24

申请号：PCT/US2009006250

申请日：2009-11-20

Applicant: CASCADE MICROTECH INC ,  SMITH KENNETH R

Inventor： SMITH KENNETH R

IPC: G01R31/01

CPC classification number: G01R31/2891 ,  B32B38/10 ,  G01R1/06711 ,  G01R1/06772 ,  G01R1/0735 ,  G01R35/00 ,  Y10T29/49126

Abstract: The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.

Abstract translation: 探测装置的触点弹性地支撑在可更换的试样上并与膜或空间变压器上的导体电互连。